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市場調查報告書
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1914306

晶圓CMP材料市場按產品類型、晶圓尺寸、顆粒尺寸、應用和最終用途產業分類－2026-2032年全球預測

CMP Materials for Wafers Market by Product Type, Wafer Size, Particle Size, Application, End Use Industry - Global Forecast 2026-2032
出版日期: | 出版商: 360iResearch | 英文 191 Pages | 商品交期: 最快1-2個工作天內

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預計到 2025 年，CMP 材料（晶圓用）市值將達到 28.2 億美元，到 2026 年將成長到 30.1 億美元，到 2032 年將達到 44.4 億美元，複合年成長率為 6.67%。

關鍵市場統計數據
基準年 2025 28.2億美元
預計年份：2026年 30.1億美元
預測年份 2032 44.4億美元
複合年成長率 (%) 6.67%

本文概述了CMP耗材在先進晶圓製造中的關鍵作用，以及不斷變化的製程需求如何推動技術和供應鏈的發展。

本執行摘要為晶圓製造中使用的化學機械拋光 (CMP) 材料建立了一個戰略框架，並重點闡述了這些材料在整個半導體價值鏈中的作用。 CMP 耗材包括墊片材料、試劑化學品和各種漿料，它們協同作用，實現晶圓平坦化、缺陷控制以及為後續光刻和蝕刻步驟進行表面處理。隨著晶圓廠向先進節點設計和高密度封裝發展，對 CMP 輸入材料的技術要求也日益嚴格，需要對顆粒尺寸分佈、材料純度、墊片表面形貌和化學成分進行更精確的控制。

技術規模化、確保供應鏈韌性的需求以及永續性的必要性正在同時重新定義 CMP 材料的開發和籌資策略。

CMP材料領域正經歷變革性的轉變，這些轉變正在重塑產品開發重點和供應商選擇標準。其中一個關鍵變化是技術層面的。隨著製程節點不斷縮小和封裝製程日益複雜，亞微米級顆粒控制和超高純度化學品的重要性也日益凸顯。製造商現在要求配方能夠在具有複雜表面形貌的區域內可靠地實現平整度，同時最大限度地減少缺陷並實現可重複的終點控制。因此，研發工作正轉向開發能夠平衡去除率和表面完整性的複雜磨料和特殊化學品。

到2025年，美國累積貿易措施如何重塑了CMP材料供應鏈的供應商策略、資格認證重點和風險管理？

美國在2025年前實施的累積政策和貿易措施，即使從定性而非定量角度衡量，也對化學機械加工（CMP）材料的供應鏈組成和成本結構產生了顯著影響。關稅調整和出口限制加速了對單一供應商依賴性的重新評估，迫使原始設備製造商（OEM）和材料供應商實現供應基礎多元化，並重新考慮近岸外包作為策略選擇。這影響了供應商的選擇時間、前置作業時間預期以及對具備本地或雙重採購能力的供應商的優先排序。

基於細分市場的深入洞察揭示了產品類型、應用特定要求、晶圓尺寸、磨料粒徑範圍和最終用戶產業如何決定CMP材料的優先順序。

詳細的市場區隔分析揭示了不同產品類型、應用、晶圓尺寸、粒徑類別和終端用戶產業在技術優先順序和採用路徑上的差異。基於產品類型，市場分析從墊片材料、試劑化學和漿料材料三個方面展開。在漿料材料方面，氧化鋁基複合磨料、二氧化矽基磨料和特殊磨料配方技術正逐漸成為技術重點，每種技術在去除率、選擇性和缺陷控制方面各有側重。墊片材料也在不斷發展，採用工程化的微紋理和預處理技術，而試劑化學則著重於pH值控制、腐蝕抑制和磨料懸浮液穩定性。

區域趨勢及其對美洲、歐洲、中東和非洲以及亞太地區製造地採購、認證和產能投資的策略影響

區域趨勢持續影響材料採購、產能投資和合作模式等方面的策略選擇。美洲地區已成為先進封裝和專用邏輯晶片製造的中心，推動了當地對高性能漿料和焊盤技術的需求，以支援不斷發展的裝置結構。該地區的供應鏈決策強調供應商的接近性、快速響應的技術支援以及能夠滿足汽車和通訊行業嚴格可靠性標準的強大品質系統。

競爭趨勢表明，技術差異化、協作開發和一體化支援服務將決定CMP材料領域供應商的長期生存能力。

CMP材料製造商和特殊化學品供應商之間的競爭格局呈現出多元化的特點，既有老牌企業，也有專注於特定領域的專業公司，還有垂直整合型企業。領先的供應商通常將深厚的材料科學專業知識與製程層面的支援相結合，提供應用工程服務、即時監控解決方案，並與晶圓製造商建立聯合開發夥伴關係。這些能力能夠加快生產現場問題的解決速度，並縮短新配方在多種晶圓尺寸和應用場景下的驗證時間。

領導企業可以採取切實可行的策略步驟，以加快認證流程、深化供應商夥伴關係，並將永續性和韌性融入其CMP材料專案中。

業界領導者應採取若干切實可行的措施，使其化學機械拋光（CMP）材料策略與不斷發展的技術和供應鏈實際情況相適應。首先，投資於跨職能認證項目，以加速對漿料、焊盤和試劑進行多地點、多晶圓尺寸的檢驗。標準化通訊協定並利用共用測試矩陣可以減少晶圓廠之間的差異，並加快實現穩定生產的速度。其次，優先考慮包含技術支援、共同故障排除和共同開發管道的供應商夥伴關係模式，因為與單純的交易型供應關係相比，這種合作關係能夠更快地解決產量比率和缺陷問題。

本執行摘要的調查方法結合了初步訪談、技術文獻綜合和實驗室檢驗結果，以提供可複製和可操作的分析性見解。

本執行執行摘要的研究採用混合方法，結合了訪談、技術文獻綜述和實驗室檢驗，最終得出基於實務經驗和資料驅動分析的結論。關鍵資訊是透過與晶圓製造和材料製造領域的製程工程師、採購主管和研發經理進行結構化討論收集的，重點是材料性能特徵、認證流程和供應鏈挑戰。此外，一項補充性的技術文獻綜述整合了同行評審的材料科學研究和供應商的技術出版物，以檢驗有關磨料化學、拋光墊表面形貌效應和顆粒尺寸影響的性能聲明。

總之，我們匯總了決定晶圓廠 CMP 材料競爭優勢的技術、策略和永續性優先事項的綜合總結。

總之，晶圓CMP材料領域正處於關鍵的轉折點，技術精度、策略性供應鏈設計和環境因素在此交會融合。隨著裝置結構日益複雜，精確調配的漿料化學成分、工程化的拋光墊材料以及嚴格控制的顆粒分佈變得愈發重要。同時，貿易和政策的變化正在推動關鍵投入品的多元化和在地採購。那些能夠積極將研發重點與特定應用需求結合，並實施穩健的採購和認證流程的供應商和製造商，將更有利於降低干擾因素並實現效能提升。

目錄

第1章：序言

第2章調查方法

  • 研究設計
  • 研究框架
  • 市場規模預測
  • 數據三角測量
  • 調查結果
  • 調查前提
  • 調查限制

第3章執行摘要

  • 首席主管觀點
  • 市場規模和成長趨勢
  • 2025年市佔率分析
  • FPNV定位矩陣，2025
  • 新的商機
  • 下一代經營模式
  • 產業藍圖

第4章 市場概覽

  • 產業生態系與價值鏈分析
  • 波特五力分析
  • PESTEL 分析
  • 市場展望
  • 上市策略

第5章 市場洞察

  • 消費者洞察與終端用戶觀點
  • 消費者體驗基準
  • 機會地圖
  • 分銷通路分析
  • 價格趨勢分析
  • 監理合規和標準框架
  • ESG與永續性分析
  • 中斷和風險情景
  • 投資報酬率和成本效益分析

第6章：美國關稅的累積影響，2025年

第7章：人工智慧的累積影響，2025年

8. 晶圓CMP材料市場（依產品類型分類）

  • 墊片材質
  • 試劑化學品
  • 漿料
    • 氧化鋁基
    • 複合磨料
    • 二氧化矽基
    • 特殊磨料

9. 依晶圓尺寸分類的晶圓CMP材料市場

  • 200mm
  • 300mm
  • 小於200毫米

10. 晶圓CMP材料市場（依粒徑分類）

  • 1-3微米
  • 3微米或以上
  • 亞微米

第11章 晶圓CMP材料市場（依應用領域分類）

  • 鑄造服務
  • LED元件
  • 邏輯裝置
  • 儲存裝置
    • DRAM
    • NAND快閃記憶體

12. 晶圓CMP材料市場依最終用途產業分類

  • 汽車電子
  • 家用電子電器
  • 電訊

第13章 晶圓CMP材料市場（依地區分類）

  • 美洲
    • 北美洲
    • 拉丁美洲
  • 歐洲、中東和非洲
    • 歐洲
    • 中東
    • 非洲
  • 亞太地區

第14章 晶圓CMP材料市場（依組別分類）

  • ASEAN
  • GCC
  • EU
  • BRICS
  • G7
  • NATO

第15章 各國晶圓CMP材料市場

  • 美國
  • 加拿大
  • 墨西哥
  • 巴西
  • 英國
  • 德國
  • 法國
  • 俄羅斯
  • 義大利
  • 西班牙
  • 中國
  • 印度
  • 日本
  • 澳洲
  • 韓國

第16章：美國晶圓CMP材料市場

第17章：中國晶圓CMP材料市場

第18章 競爭格局

  • 市場集中度分析，2025年
    • 濃度比（CR）
    • 赫芬達爾-赫希曼指數 (HHI)
  • 近期趨勢及影響分析，2025 年
  • 2025年產品系列分析
  • 基準分析，2025 年
  • 3M Company
  • AGC Inc.
  • Anjimirco Shanghai
  • BASF SE
  • Cabot Corporation
  • DuPont de Nemours, Inc.
  • Entegris, Inc.
  • Fujibo Holdings
  • Fujifilm Holdings Corporation
  • Fujimi Incorporated
  • Hitachi High-Technologies Corporation
  • Hubei Dinglong
  • JSR Corporation
  • KC Tech
  • Merck KGaA
Product Code: MRR-AE420CB13BEE

The CMP Materials for Wafers Market was valued at USD 2.82 billion in 2025 and is projected to grow to USD 3.01 billion in 2026, with a CAGR of 6.67%, reaching USD 4.44 billion by 2032.

KEY MARKET STATISTICS
Base Year [2025] USD 2.82 billion
Estimated Year [2026] USD 3.01 billion
Forecast Year [2032] USD 4.44 billion
CAGR (%) 6.67%

Framing the critical role of CMP consumables in advanced wafer fabrication and how evolving process demands are elevating technical and supply chain requirements

This executive summary establishes the strategic framing for chemical mechanical planarization materials used in wafer fabrication, emphasizing the role these materials play across the semiconductor value chain. CMP consumables include pad materials, reagent chemicals, and a diverse slate of slurry materials that together enable planarization, defect control, and surface conditioning for successive lithography and etch steps. As fabs push into advanced node designs and higher density packaging, the technical requirements for CMP inputs have tightened, driving more rigorous control of particle size distributions, material purity, pad topography, and chemical formulations.

Against this backdrop, manufacturers and supply chain stakeholders face a nexus of challenges and opportunities. Cost pressures, sustainability expectations, and the drive for yield improvement compel continuous innovation in abrasive compositions, polymeric pad architectures, and reagent chemistries. At the same time, capacity shifts in wafer production and evolving end use demands from automotive electronics, consumer devices, and telecommunications change the profile of material consumption. This section sets the stage for a detailed exploration of these dynamics, emphasizing the practical implications for procurement, quality assurance, and collaborative development between material suppliers and fabs.

How technological miniaturization, supply chain resilience imperatives, and sustainability mandates are simultaneously redefining CMP materials development and procurement strategies

The CMP materials landscape has been redefined by several transformative shifts that are altering product development priorities and supplier selection criteria. One major shift is technological: the steady progression to smaller nodes and more complex packaging has elevated the importance of submicron particle control and ultra-high-purity chemistries. Manufacturers now require formulations that can reliably deliver planarity across highly topographic surfaces while minimizing defectivity and enabling repeatable endpoint control. As a result, research and development has pivoted toward composite abrasives and specialty chemistries that balance removal rate with surface integrity.

Another important shift is strategic: supply chain resilience and regional diversification have moved from optional considerations to core business strategies. Companies are increasingly balancing cost efficiency with security of supply, seeking multiple qualified sources and deeper supplier partnerships. Concurrently, sustainability and regulatory compliance have gained prominence; customers demand lower chemical footprints, reduced waste, and transparent lifecycle data. These expectations are driving investments in closed-loop processes, more environmentally benign reagent options, and pad recycling or refurbishing programs. Together, these technological, strategic, and regulatory forces are catalyzing a new era of collaboration between materials developers, equipment makers, and wafer fabricators, fostering co-innovation that blends materials science with process engineering.

How cumulative US trade measures through 2025 have reshaped supplier strategies, qualification priorities, and risk management across CMP material supply chains

The cumulative policy and trade measures implemented by the United States through 2025 have had a material influence on supply chain configuration and cost structures for CMP materials, even when measured qualitatively rather than quantitatively. Tariff-related adjustments and export controls have accelerated the re-evaluation of single-source dependencies, prompting original equipment manufacturers and materials suppliers to diversify supplier bases and to reconsider nearshoring as a strategic option. These actions have affected supplier selection timelines, lead-time expectations, and the prioritization of suppliers with local manufacturing or dual-sourcing capabilities.

In operational terms, the shifting tariff landscape has incentivized investments in domestic processing capacity for certain high-purity chemicals and abrasive formulations to reduce exposure to cross-border friction. At the same time, some upstream raw material flows have rerouted through alternative logistics corridors, increasing inventory buffers and elevating working capital requirements for procurement teams. For technology teams, the tariff dynamics have reinforced the need for qualification plans that include multi-site validation to mitigate disruption risk. Overall, trade measures have catalyzed a more defensive posture across the supply chain, one that favors agility, supplier collaboration, and manufacturing footprints aligned with geopolitical risk profiles.

Deep segmentation-driven insights that reveal how product types, application-specific requirements, wafer dimensions, abrasive particle ranges, and end-use industries determine CMP material priorities

A granular review of segmentation reveals differentiated technical priorities and adoption pathways across product types, applications, wafer sizes, particle size categories, and end use industries. Based on product type, the market is studied across pad materials, reagent chemicals, and slurry materials. Within slurry materials, the technical conversation increasingly centers on alumina-based, composite abrasives, silica-based, and specialty abrasive formulations, each offering distinct tradeoffs in removal rate, selectivity, and defectivity control. Pad materials continue to evolve with engineered microtextures and conditioning regimes, while reagent chemistries emphasize pH control, corrosion inhibition, and stabilization of abrasive suspensions.

Based on application, the market is studied across foundry services, LED devices, logic devices, and memory devices. Memory device processing in particular is examined with additional granularity across DRAM and NAND Flash, where surface planarity demands and defect sensitivity differ significantly; DRAM applications often emphasize uniform removal across large device areas, whereas NAND Flash processes may prioritize localized planarity and interface integrity. Based on wafer size, the market is studied across 200 mm, 300 mm, and below 200 mm substrates, with larger wafers driving economies of scale but also imposing stricter uniformity and slurry distribution controls. Based on particle size, the market is studied across 1-3 μm, above 3 μm, and submicron categories, with submicron abrasives gaining traction where ultra-low defectivity and fine finishing are required. Finally, based on end use industry, the market is studied across automotive electronics, consumer electronics, and telecommunications, sectors whose differing reliability and performance specifications shape acceptable tolerance thresholds, qualification cycles, and supply chain expectations.

Taken together, these segmentation lenses show that suppliers and fabricators must pursue multi-dimensional strategies. Product developers need to match abrasive chemistry and pad architecture to application-specific removal profiles, while procurement and quality teams need to maintain flexible qualification roadmaps that cover multiple wafer sizes and particle distributions. In practice, that means prioritizing cross-functional collaboration, investing in application-specific testing, and creating modular supply agreements that can adapt as device portfolios shift. This segmentation-informed approach enables more precise alignment of material selection with device performance goals and operational constraints.

Regional dynamics and strategic implications for sourcing, qualification, and capacity investments across the Americas, Europe Middle East & Africa, and Asia-Pacific manufacturing hubs

Regional dynamics continue to shape strategic choices for material sourcing, capacity investment, and collaboration models. The Americas region has become a focal point for advanced packaging and certain logic fabs, encouraging localized demand for high-performance slurries and pad technologies that support evolving device architectures. Supply chain decisions in this region place a premium on supplier proximity, rapid technical support, and robust quality systems that can meet critical automotive and telecommunications reliability standards.

Europe, Middle East & Africa present a heterogeneous landscape where regulatory stringency, sustainability expectations, and specialized manufacturing pockets influence material selection and supplier engagement. In several European markets, the emphasis on environmental compliance has pushed suppliers to prioritize lower-emission chemistries and enhanced waste management practices. In contrast, the Middle East and Africa markets often prioritize foundational capacity building and partner-driven technology transfer to accelerate local fabrication capabilities. Asia-Pacific remains the dominant driver of wafer production and innovation, spanning a wide spectrum from foundries and memory fabs to consumer electronics assembly. This region's scale fosters rapid iteration in slurry and pad development and supports large-volume qualification programs, but it also intensifies competition among suppliers to provide cost-effective, high-performance materials while addressing regional logistics and regulatory nuances.

Competitive landscape dynamics show why technical differentiation, collaborative development, and integrated support services determine long-term supplier viability in CMP materials

The competitive environment among CMP materials manufacturers and specialty chemical suppliers is characterized by a mix of established incumbents, focused niche players, and vertically integrated firms. Leading suppliers typically combine deep materials science expertise with process-level support, offering application engineering services, in-situ monitoring solutions, and co-development partnerships with wafer fabricators. These capabilities enable faster problem resolution in production and reduce the time required to qualify new formulations across multiple wafer sizes and applications.

At the same time, smaller, agile companies often differentiate through rapid innovation cycles and the ability to commercialize specialty abrasives or reagent blends tailored to narrow process windows. Strategic collaboration between large and small organizations-whether through joint development agreements, licensing, or supply partnerships-has become a pragmatic strategy to accelerate the deployment of advanced materials. In addition, some equipment manufacturers have expanded their service portfolios to include consumable optimization, which blurs traditional vendor boundaries and creates new channels for integrated solutions. Together, these dynamics foster a competitive ecosystem where technical differentiation, responsiveness, and the capacity to support multi-site qualifications determine long-term supplier viability.

Actionable strategic steps for leaders to accelerate qualification, deepen supplier partnerships, and embed sustainability and resilience into CMP materials programs

Industry leaders should take several practical, actionable steps to align their CMP materials strategies with evolving technology and supply chain realities. First, invest in cross-functional qualification programs that expedite multi-site and multi-wafer-size validation of slurries, pads, and reagents. By standardizing protocols and leveraging shared test matrices, organizations can reduce variability across fabs and shorten time to stable production. Second, prioritize supplier partnership models that embed technical support, joint troubleshooting, and co-development pathways, because these collaborative arrangements deliver faster resolution of yield and defect issues than transactional supply relationships.

Third, accelerate adoption of sustainability best practices by incorporating lifecycle assessments into supplier selection and by piloting lower-impact reagent chemistries and pad refurbishment programs. These measures not only reduce regulatory exposure but also respond to customer preferences for greener processes. Fourth, enhance resilience through dual sourcing and by qualifying geographically diverse suppliers for critical inputs, while maintaining clear processes for rapid supplier substitution. Fifth, align R&D roadmaps with end use industry needs-working closely with automotive, telecommunications, and consumer electronics stakeholders to ensure materials meet long-term reliability and performance expectations. Taken together, these actions will strengthen operational agility, reduce risk, and increase the probability that material choices will support both short-term production goals and long-term strategic objectives.

Methodological framework combining primary interviews, technical literature synthesis, and laboratory validation notes to ground insights in reproducible and practical analysis

The research underpinning this executive summary uses a mixed-method approach that combines primary interviews, technical literature review, and laboratory validation insights to ensure conclusions are grounded in both practice and data-driven analysis. Primary inputs were gathered through structured discussions with process engineers, procurement leaders, and R&D managers across wafer fabrication and materials manufacturing, focusing on material performance attributes, qualification workflows, and supply chain challenges. Complementary technical literature review synthesized peer-reviewed materials science studies and supplier technical bulletins to validate performance claims related to abrasive chemistries, pad topography effects, and particle size impacts.

Where available, laboratory validation case notes and anonymized process characterizations were incorporated to illustrate typical tradeoffs among removal rate, surface roughness, and defectivity. The methodology emphasizes transparency in assumptions, and the analytical approach privileges reproducible test parameters and real-world qualification constraints. Finally, regional intelligence was developed by triangulating supplier footprints, public filings, and industry conference disclosures to capture shifts in capacity and strategic partnerships without relying on private or proprietary datasets. Together, these methods provide a robust foundation for the insights and recommendations presented earlier.

Concluding synthesis of technical, strategic, and sustainability priorities that will determine competitive advantage in CMP materials for wafer fabrication

In conclusion, the CMP materials landscape for wafers is at an inflection point where technical precision, strategic supply chain design, and environmental stewardship converge. The increasing complexity of device architectures places a premium on finely tuned slurry chemistries, engineered pad materials, and tightly controlled particle distributions, while trade and policy shifts incentivize diversification and localization of key inputs. Suppliers and fabricators who proactively align R&D priorities with application-specific requirements, while implementing resilient procurement and qualification practices, will be best positioned to mitigate disruption and capture performance gains.

Moving forward, the balance between innovation and operational consistency will determine competitive differentiation. Organizations that foster deep technical partnerships, adopt standardized multi-site validation protocols, and incorporate sustainability metrics into material selection will both reduce risk and create enduring value for device manufacturers and end users alike.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Definition
  • 1.3. Market Segmentation & Coverage
  • 1.4. Years Considered for the Study
  • 1.5. Currency Considered for the Study
  • 1.6. Language Considered for the Study
  • 1.7. Key Stakeholders

2. Research Methodology

  • 2.1. Introduction
  • 2.2. Research Design
    • 2.2.1. Primary Research
    • 2.2.2. Secondary Research
  • 2.3. Research Framework
    • 2.3.1. Qualitative Analysis
    • 2.3.2. Quantitative Analysis
  • 2.4. Market Size Estimation
    • 2.4.1. Top-Down Approach
    • 2.4.2. Bottom-Up Approach
  • 2.5. Data Triangulation
  • 2.6. Research Outcomes
  • 2.7. Research Assumptions
  • 2.8. Research Limitations

3. Executive Summary

  • 3.1. Introduction
  • 3.2. CXO Perspective
  • 3.3. Market Size & Growth Trends
  • 3.4. Market Share Analysis, 2025
  • 3.5. FPNV Positioning Matrix, 2025
  • 3.6. New Revenue Opportunities
  • 3.7. Next-Generation Business Models
  • 3.8. Industry Roadmap

4. Market Overview

  • 4.1. Introduction
  • 4.2. Industry Ecosystem & Value Chain Analysis
    • 4.2.1. Supply-Side Analysis
    • 4.2.2. Demand-Side Analysis
    • 4.2.3. Stakeholder Analysis
  • 4.3. Porter's Five Forces Analysis
  • 4.4. PESTLE Analysis
  • 4.5. Market Outlook
    • 4.5.1. Near-Term Market Outlook (0-2 Years)
    • 4.5.2. Medium-Term Market Outlook (3-5 Years)
    • 4.5.3. Long-Term Market Outlook (5-10 Years)
  • 4.6. Go-to-Market Strategy

5. Market Insights

  • 5.1. Consumer Insights & End-User Perspective
  • 5.2. Consumer Experience Benchmarking
  • 5.3. Opportunity Mapping
  • 5.4. Distribution Channel Analysis
  • 5.5. Pricing Trend Analysis
  • 5.6. Regulatory Compliance & Standards Framework
  • 5.7. ESG & Sustainability Analysis
  • 5.8. Disruption & Risk Scenarios
  • 5.9. Return on Investment & Cost-Benefit Analysis

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. CMP Materials for Wafers Market, by Product Type

  • 8.1. Pad Materials
  • 8.2. Reagent Chemicals
  • 8.3. Slurry Materials
    • 8.3.1. Alumina Based
    • 8.3.2. Composite Abrasives
    • 8.3.3. Silica Based
    • 8.3.4. Specialty Abrasives

9. CMP Materials for Wafers Market, by Wafer Size

  • 9.1. 200 Mm
  • 9.2. 300 Mm
  • 9.3. Below 200 Mm

10. CMP Materials for Wafers Market, by Particle Size

  • 10.1. 1-3 μm
  • 10.2. Above 3 μm
  • 10.3. Submicron

11. CMP Materials for Wafers Market, by Application

  • 11.1. Foundry Services
  • 11.2. LED Devices
  • 11.3. Logic Devices
  • 11.4. Memory Devices
    • 11.4.1. DRAM
    • 11.4.2. NAND Flash

12. CMP Materials for Wafers Market, by End Use Industry

  • 12.1. Automotive Electronics
  • 12.2. Consumer Electronics
  • 12.3. Telecommunications

13. CMP Materials for Wafers Market, by Region

  • 13.1. Americas
    • 13.1.1. North America
    • 13.1.2. Latin America
  • 13.2. Europe, Middle East & Africa
    • 13.2.1. Europe
    • 13.2.2. Middle East
    • 13.2.3. Africa
  • 13.3. Asia-Pacific

14. CMP Materials for Wafers Market, by Group

  • 14.1. ASEAN
  • 14.2. GCC
  • 14.3. European Union
  • 14.4. BRICS
  • 14.5. G7
  • 14.6. NATO

15. CMP Materials for Wafers Market, by Country

  • 15.1. United States
  • 15.2. Canada
  • 15.3. Mexico
  • 15.4. Brazil
  • 15.5. United Kingdom
  • 15.6. Germany
  • 15.7. France
  • 15.8. Russia
  • 15.9. Italy
  • 15.10. Spain
  • 15.11. China
  • 15.12. India
  • 15.13. Japan
  • 15.14. Australia
  • 15.15. South Korea

16. United States CMP Materials for Wafers Market

17. China CMP Materials for Wafers Market

18. Competitive Landscape

  • 18.1. Market Concentration Analysis, 2025
    • 18.1.1. Concentration Ratio (CR)
    • 18.1.2. Herfindahl Hirschman Index (HHI)
  • 18.2. Recent Developments & Impact Analysis, 2025
  • 18.3. Product Portfolio Analysis, 2025
  • 18.4. Benchmarking Analysis, 2025
  • 18.5. 3M Company
  • 18.6. AGC Inc.
  • 18.7. Anjimirco Shanghai
  • 18.8. BASF SE
  • 18.9. Cabot Corporation
  • 18.10. DuPont de Nemours, Inc.
  • 18.11. Entegris, Inc.
  • 18.12. Fujibo Holdings
  • 18.13. Fujifilm Holdings Corporation
  • 18.14. Fujimi Incorporated
  • 18.15. Hitachi High-Technologies Corporation
  • 18.16. Hubei Dinglong
  • 18.17. JSR Corporation
  • 18.18. KC Tech
  • 18.19. Merck KGaA

LIST OF FIGURES

  • FIGURE 1. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 2. GLOBAL CMP MATERIALS FOR WAFERS MARKET SHARE, BY KEY PLAYER, 2025
  • FIGURE 3. GLOBAL CMP MATERIALS FOR WAFERS MARKET, FPNV POSITIONING MATRIX, 2025
  • FIGURE 4. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 5. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 6. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 7. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 8. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 9. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REGION, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 10. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY GROUP, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 11. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 12. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 13. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)

LIST OF TABLES

  • TABLE 1. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 2. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 3. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PAD MATERIALS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 4. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PAD MATERIALS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 5. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PAD MATERIALS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 6. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REAGENT CHEMICALS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 7. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REAGENT CHEMICALS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 8. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REAGENT CHEMICALS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 9. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 10. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 11. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 12. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 13. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ALUMINA BASED, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 14. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ALUMINA BASED, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 15. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ALUMINA BASED, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 16. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COMPOSITE ABRASIVES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 17. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COMPOSITE ABRASIVES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 18. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COMPOSITE ABRASIVES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 19. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SILICA BASED, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 20. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SILICA BASED, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 21. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SILICA BASED, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 22. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SPECIALTY ABRASIVES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 23. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SPECIALTY ABRASIVES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 24. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SPECIALTY ABRASIVES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 25. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 26. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 200 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 27. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 200 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 28. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 200 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 29. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 300 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 30. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 300 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 31. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 300 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 32. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY BELOW 200 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 33. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY BELOW 200 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 34. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY BELOW 200 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 35. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 36. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 1-3 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 37. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 1-3 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 38. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 1-3 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 39. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ABOVE 3 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 40. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ABOVE 3 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 41. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ABOVE 3 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 42. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBMICRON, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 43. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBMICRON, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 44. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBMICRON, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 45. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 46. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY FOUNDRY SERVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 47. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY FOUNDRY SERVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 48. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY FOUNDRY SERVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 49. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LED DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 50. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LED DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 51. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LED DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 52. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LOGIC DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 53. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LOGIC DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 54. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LOGIC DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 55. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 56. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 57. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 58. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 59. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY DRAM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 60. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY DRAM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 61. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY DRAM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 62. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY NAND FLASH, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 63. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY NAND FLASH, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 64. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY NAND FLASH, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 65. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 66. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 67. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 68. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 69. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 70. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 71. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 72. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 73. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY TELECOMMUNICATIONS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 74. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY TELECOMMUNICATIONS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 75. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 76. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBREGION, 2018-2032 (USD MILLION)
  • TABLE 77. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 78. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 79. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 80. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 81. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 82. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 83. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 84. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 85. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 86. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 87. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 88. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 89. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 90. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 91. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 92. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 93. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 94. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 95. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 96. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 97. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 98. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 99. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 100. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBREGION, 2018-2032 (USD MILLION)
  • TABLE 101. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 102. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 103. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 104. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 105. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 106. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 107. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 108. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 109. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 110. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 111. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 112. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 113. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 114. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 115. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 116. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 117. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 118. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 119. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 120. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 121. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 122. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 123. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 124. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 125. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 126. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 127. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 128. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 129. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 130. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 131. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 132. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 133. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 134. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 135. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 136. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 137. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 138. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 139. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 140. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 141. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 142. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 143. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 144. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 145. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 146. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 147. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 148. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 149. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 150. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 151. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 152. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 153. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 154. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 155. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 156. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 157. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 158. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 159. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 160. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 161. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 162. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 163. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 164. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 165. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 166. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 167. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 168. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 169. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 170. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 171. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 172. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 173. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 174. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 175. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 176. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 177. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 178. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 179. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 180. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 181. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 182. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 183. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 184. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 185. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 186. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 187. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 188. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 189. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 190. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 191. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 192. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 193. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 194. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 195. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 196. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 197. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 198. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 199. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 200. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 201. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 202. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 203. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 204. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 205. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)