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1718046

按處理器、封裝技術和最終用途分類的晶片市場—2025-2030 年全球預測

Chiplet Market by Processor, Packaging Technology, End-use - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 193 Pages | 商品交期: 最快1-2個工作天內

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預計 2023 年小晶片市場價值將達到 105.3 億美元，到 2024 年將以 36.74% 的複合年成長率成長至 142.2 億美元，到 2030 年將達到 941.7 億美元。

主要市場統計數據
基準年2023年 105.3億美元
預計2024年 142.2億美元
預測年份 2030 941.7億美元
複合年成長率（%） 36.74%

半導體技術的不斷演進，已經迎來了Chiplet架構佔據主導地位的新時代。隨著創新設計範式從傳統的單晶片解決方案轉向模組化系統，高效能運算和先進電子整合領域正在迅速發展。

晶片是經過預先檢驗的小型積體電路，組裝在一起可以在晶片上創建高度複雜的系統。這種方法不僅加快了開發週期，而且還提供了無與倫比的靈活性以滿足不同的應用需求。近年來，業界旨在利用小晶片技術優勢的研究和商業化努力激增。可自訂性、提高的電源效率和更快的上市時間只是推動這一轉變的一些顯著優勢。

隨著全球公司投資新策略以及新興企業帶來新見解，小晶片市場正在成為創新的溫床。企業擴大採用小晶片來克服成本、效能和可擴展性等傳統限制。本介紹性概況清楚地介紹了目前正在發生的重大轉變，並為更深入地探索細分、區域動態、關鍵參與者和策略建議奠定了基礎，這些將決定半導體產業的未來。

改變Chiplet市場

最近的技術進步加上不斷變化的市場需求為小晶片領域帶來了變革性的變化。產業向模組化設計的轉變正在打破傳統的障礙，並在性能、成本效益和適應性方面帶來顯著的改善。

從歷史上看，積體電路被設計為單一單片實體。然而，現代應用程式的日益複雜需要一種更通用的方法。晶片允許設計人員將功能分離到專門的組件中，每個組件都針對其用途進行了最佳化設計。這種實用主義透過使用針對特定功能客製化的技術模組組合來降低開發風險並鼓勵創新。

縮短產品上市時間的動力也加速了小晶片的採用。透過利用檢驗的模組，公司可以簡化其產品開發流程並顯著縮短設計週期。該行業目前正在將代工廠、設計工作室和系統整合商聚集在一起，開發滿足現代計算先進需求的解決方案。在此過程中，半導體格局正在經歷前所未有的轉變，這不僅重新定義了性能指標，而且增強了創新過程的整體永續性。

小晶片市場的關鍵細分洞察

深入研究市場細分可以發現，小晶片領域是如何被仔細分類以瞄準高需求成長領域的。主要的細分之一是基於處理器的類型。透過追蹤應用處理單元、專用於人工智慧應用壓縮機的積體電路、中央處理單元、現場可程式閘陣列和圖形處理單元等各種組件，對市場進行全面分析。這些處理器分類在客製化晶​​片以滿足日益專業化的性能和計算要求方面發揮著至關重要的作用。

另一個重要的分類是基於封裝技術。透過評估各種封裝創新（例如 2.5D 和 3D 結構、覆晶球柵陣列、覆晶規模封裝、系統級封裝解決方案和晶圓級晶片規模封裝）的市場，可以深入了解每種技術提供的整合度和效能效率。這種細分凸顯了製造商在最佳化空間和資源利用的同時，解決溫度控管、互連密度和機械完整性所採取的各種方法。

此外，基於最終用途的細分提供了對應用動態的詳細洞察。汽車、家用電子電器、國防和航太、醫療保健、製造和通訊等行業對性能和可靠性的要求越來越高，而小晶片的設計旨在滿足特定標準和嚴格的特定產業要求。這樣的市場區隔洞察表明，市場不僅技術多樣化，而且還能精細調整以應對各種應用主導的挑戰。

目錄

第1章 引言

第2章調查方法

第3章執行摘要

第4章 市場概述

第5章 市場洞察

  • 市場動態
    • 驅動程式
      • 對更小、更緊湊的電子設備的需求不斷增加
      • 全球資料中心數量不斷增加
      • 對 ADAS 增強型車載處理的需求不斷成長
    • 限制因素
      • Chiplet 互連複雜性問題
    • 機會
      • 先進的處理需求將允許將晶片部署在無人機上
      • 持續投資與部署5G網路
    • 任務
      • 與Chiplet相關的可擴展性和安全性問題
  • 市場區隔分析
    • 處理器：功率效率和多功能性使得應用處理單元在家用電子電器中變得越來越重要。
    • 封裝技術：晶圓級晶片規模封裝的新興應用，具有低成本、高度緊湊、高性能的封裝
    • 最終用途：精度和可靠性屬性將推動晶片在醫療保健領域的應用不斷增加
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社會
    • 技術的
    • 合法的
    • 環境

6. 按處理器分類的Chiplet市場

  • 申請處理單位
  • 人工智慧專用積體電路壓縮機
  • 中央處理器
  • 現場可程式閘陣列
  • 圖形處理單元

7. Chiplet市場封裝技術

  • 2.5D和3D
  • 覆晶球柵陣列
  • 覆晶級封裝
  • 系統級封裝
  • 晶圓級構裝

8. 晶片市場（依最終用途分類）

  • 車
  • 家電
  • 國防與航太
  • 衛生保健
  • 製造業
  • 通訊

第9章美洲Chiplet市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第 10 章亞太地區 Chiplet 市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第 11 章歐洲、中東和非洲 Chiplet 市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第12章競爭格局

  • 2023年市場佔有率分析
  • 2023年FPNV定位矩陣
  • 競爭情境分析
  • 戰略分析與建議

公司名單

  • Achronix Semiconductor Corporation
  • Advanced Micro Devices, Inc.
  • Alphawave IP Group PLC
  • Apple Inc.
  • Arm Holdings PLC
  • ASE Technology Holding Co, Ltd.
  • Ayar Labs, Inc.
  • Beijing ESWIN Technology Group Co., Ltd.
  • Broadcom Inc.
  • Cadence Design Systems, Inc.
  • Chipuller
  • Eliyan Corp
  • GlobalFoundries Inc.
  • Huawei Technologies Co., Ltd.
  • Intel Corporation
  • International Business Machines Corporation
  • JCET Group
  • Kandou Bus, SA
  • Marvell Technology, Inc.
  • Mercury Systems, Inc.
  • Netronome Systems, Inc.
  • NHanced Semiconductors, Inc.
  • NVIDIA Corporation
  • NXP Semiconductors NV
  • Palo Alto Electron, Inc.
  • Qualcomm Incorporated
  • RANVOUS Inc.
  • Samsung Electronics Co., Ltd.
  • Socionext Inc.
  • Synopsys, Inc.
  • Tachyum Sro
  • Taiwan Semiconductor Manufacturing Company Limited
  • Tenstorrent Inc.
  • TongFu Microelectronics Co., Ltd.
  • X-Celeprint by Xtrion NV
Product Code: MRR-E0619F0767CD

The Chiplet Market was valued at USD 10.53 billion in 2023 and is projected to grow to USD 14.22 billion in 2024, with a CAGR of 36.74%, reaching USD 94.17 billion by 2030.

KEY MARKET STATISTICS
Base Year [2023] USD 10.53 billion
Estimated Year [2024] USD 14.22 billion
Forecast Year [2030] USD 94.17 billion
CAGR (%) 36.74%

The continuous evolution of semiconductor technologies has ushered in a new era, one where chiplet architecture takes center stage. As innovative design paradigms shift from traditional monolithic solutions to modular systems, the landscape of high-performance computing and advanced electronic integration is rapidly evolving.

Chiplets are small, pre-validated integrated circuits that combine to create highly sophisticated systems on a chip. This approach not only accelerates development cycles but also offers unparalleled flexibility in meeting diverse application demands. Over the past few years, the industry has witnessed a surge in research and commercialization efforts aimed at exploiting the benefits of chiplet technology. Customization, improved power efficiency, and reduced time-to-market are just a few of the compelling advantages driving this transformation.

As global players invest in new strategies and emerging startups bring fresh insights, the chiplet market is becoming a hotbed for technological breakthroughs. Companies are increasingly embracing chiplets as a way to overcome traditional limitations in cost, performance, and scalability. This introductory overview provides a clear understanding of the significant transformation underway and sets the stage for a detailed exploration of segmentation, regional dynamics, key players, and strategic recommendations that will shape the future of the semiconductor industry.

Transformative Shifts in the Chiplet Landscape

Recent technological progress coupled with evolving market demands has precipitated a transformative shift in the chiplet landscape. The industry's move towards modular design is breaking conventional barriers, introducing substantial improvements in performance, cost efficiency, and adaptability.

Historically, integrated circuits were designed as single, monolithic entities. However, the increasing complexity of modern applications has necessitated a more versatile approach. Chiplets enable designers to segregate functionalities among specialized components, each optimally engineered for its purpose. This pragmatism reduces development risks and fosters innovation by allowing companies to mix and match technology blocks tailored for specific functions.

The drive for faster time-to-market has also accelerated the adoption of chiplets. By leveraging pre-validated modules, organizations can streamline product development processes and considerably shorten design cycles. The industry is now witnessing a surge in collaborative initiatives between foundries, design houses, and system integrators who are working collectively to develop solutions that meet the high demands of modern computing. In doing so, the semiconductor landscape is experiencing an unprecedented transformation that not only redefines performance metrics but also enhances the overall sustainability of the innovation process.

Key Segmentation Insights in the Chiplet Market

A deep dive into market segmentation reveals how the chiplet sector is meticulously categorized to target high-demand growth areas. One major segmentation is based on Processor types. The market is comprehensively analyzed by tracking diverse components such as Application Processing Units, Artificial Intelligence Application-Specific Integrated Circuit Compressors, Central Processing Units, Field-Programmable Gate Arrays, and Graphic Processing Units. These processor classifications play a pivotal role in tailoring chiplets that meet increasingly specific performance and computational requirements.

Another significant segmentation is based on Packaging Technology. Evaluating the market across various packaging innovations like 2.5 & 3D structures, Flip Chip Ball Grid Array, Flip Chip Scale Package, System-in-Package solutions, and Wafer-Level Chip Scale Packages provides vital insights into the integration and performance efficiencies that each technology offers. This segmentation underlines the diverse approaches that manufacturers are adopting to address thermal management, interconnect density, and mechanical integrity while optimizing space and resource utilization.

Furthermore, segmentation based on End-use presents a detailed view into application dynamics. With industries such as Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Manufacturing, and Telecommunications demanding ever higher levels of performance and reliability, chiplets are being engineered to satisfy specific standards and rigorous industry-specific requirements. These segmentation insights collectively illustrate a market that is not only diversified in technical offerings but also finely tuned to cater to a wide array of application-driven challenges.

Based on Processor, market is studied across Application Processing Unit, Artificial Intelligence Application-Specific Integrated Circuit Compressor, Central Processing Unit, Field-Programmable Gate Array, and Graphic Processing Unit.

Based on Packaging Technology, market is studied across 2.5 & 3D, Flip Chip Ball Grid Array, Flip Chip Scale Package, System-in-Package, and Wafer-Level Chip Scale Package.

Based on End-use, market is studied across Automotive, Consumer Electronics, Defense & Aerospace, Healthcare, Manufacturing, and Telecommunications.

Key Regional Insights Shaping the Market

An analysis of regional trends shows that the evolution of chiplet technology is a global phenomenon driven by varied market dynamics and regional innovations. In the Americas, industry leaders are pioneering cutting-edge developments in semiconductor manufacturing and integration. Robust investment in research and development along with strategic collaborations have established this region as a hub for technological breakthroughs and commercialization strategies.

In regions spanning Europe, the Middle East, and Africa, well-established industrial infrastructures and governmental initiatives are driving adoption. These regions are actively focusing on advanced packaging solutions and integrated circuit innovations, ensuring that chiplet technology remains at the forefront of local semiconductor strategies. Meanwhile, in the Asia-Pacific region, rapid industrialization coupled with government support in emerging technology sectors has fostered a fertile environment for the mass adoption of chiplets. Here, a synergy between mature production capabilities and aggressive innovation policies has positioned the region as a central player in the global semiconductor arena.

These regional insights underscore varied yet complementary approaches to technological adoption and highlight opportunities for cross-regional collaboration as the global market converges around chiplet-based design paradigms.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across Arizona, California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Company Insights Driving Innovation

Numerous players are making significant strides in unlocking the full potential of chiplet technology, demonstrating both innovation and strategic acumen. Industry frontrunners include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., and Alphawave IP Group PLC, each excelling in creating solutions that push the boundaries of performance and efficiency. Major technology giants such as Apple Inc., Arm Holdings PLC, as well as ASE Technology Holding Co, Ltd., are reshaping the market narrative by integrating chiplets into next-generation devices, thereby redefining power and speed metrics.

Other influential firms like Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., and Broadcom Inc. have undertaken initiatives that merge traditional semiconductor technology with advanced chiplet architectures. These companies are continuously harnessing the capabilities of chiplets to deliver products that are more scalable and efficient. Noteworthy contributions from Cadence Design Systems, Inc. and Chipuller further bolster design innovation, while companies such as Eliyan Corp, GlobalFoundries Inc., and Huawei Technologies Co., Ltd. are leveraging chiplets to optimize both functionality and energy consumption.

Prominent names like Intel Corporation, International Business Machines Corporation, and JCET Group are driving expansive research in chiplet integration, setting standards through collaborative breakthroughs. Further, Kandou Bus, S.A., Marvell Technology, Inc., Mercury Systems, Inc., and Netronome Systems, Inc. are advancing this field with robust market strategies. Companies such as NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., and Qualcomm Incorporated continue to push the envelope, along with RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., Synopsys, Inc., Tachyum S.r.o., Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint by Xtrion N.V. Their combined efforts highlight a competitive and rapidly progressing industry where strategic investments in chiplets are driving a paradigm shift towards modular and highly integrated system designs.

The report delves into recent significant developments in the Chiplet Market, highlighting leading vendors and their innovative profiles. These include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., Alphawave IP Group PLC, Apple Inc., Arm Holdings PLC, ASE Technology Holding Co, Ltd., Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., Broadcom Inc., Cadence Design Systems, Inc., Chipuller, Eliyan Corp, GlobalFoundries Inc., Huawei Technologies Co., Ltd., Intel Corporation, International Business Machines Corporation, JCET Group, Kandou Bus, S.A., Marvell Technology, Inc., Mercury Systems, Inc., Netronome Systems, Inc., NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., Qualcomm Incorporated, RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., Synopsys, Inc., Tachyum S.r.o., Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint by Xtrion N.V.. Actionable Recommendations for Industry Leaders

For decision-makers and industry experts aiming to remain at the forefront of technological innovation, it is crucial to adapt proactively to the changing dynamics of chiplet integration. Industry leaders are advised to invest in flexible design methodologies that leverage the inherent advantages of chiplet architecture. Embracing a modular approach can significantly reduce time-to-market while providing the agility necessary to meet evolving market demands.

Furthermore, continuous collaboration with research institutions, technological partners, and strategic suppliers is essential for developing state-of-the-art packaging and integration solutions. By adopting cross-functional teams that bring together expertise from software engineering, hardware design, and advanced manufacturing processes, organizations can foster an environment of innovation that drives competitive advantage. It is important to monitor emerging trends and incorporate advanced packaging technologies that promise heightened performance, reliability, and energy efficiency.

Adopting a customer-centric strategy that aligns product development with end-user needs, particularly in high-demand sectors such as Automotive, Consumer Electronics, and Telecommunications, remains paramount. Integrating feedback loops into the development cycle can further optimize chiplet-based solutions. In summary, seizing the opportunities presented by chiplet technologies necessitates a holistic approach that encourages both internal innovation and external collaboration.

Conclusion: Embracing the Chiplet Future

In conclusion, the chiplet revolution is redefining the semiconductor industry by offering advanced, flexible, and scalable solutions. The shift toward modular architectures is not merely a technological upgrade but a strategic move that aligns with the broader trend of rapid innovation and customized performance. Comprehensive segmentation insights reveal specialized approaches based on processors, packaging technologies, and distinct end-use applications. Regional dynamics highlight varied market trends, while leading companies continue to drive transformative changes through innovation and strategic positioning.

This new paradigm necessitates that industry stakeholders reassess their strategies and invest in future-proof solutions to remain competitive. The profound shifts witnessed across manufacturing techniques, market segmentation, and regional influences serve as a testament to the immense potential of chiplets in reshaping the electronics landscape.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing demand for smaller and more compact electronic devices
      • 5.1.1.2. Increase in the number of data centers globally
      • 5.1.1.3. Growing demand to enhance in-vehicle processing for ADAS
    • 5.1.2. Restraints
      • 5.1.2.1. Interconnection complexity issues with chiplets
    • 5.1.3. Opportunities
      • 5.1.3.1. Potential deployment of chiplets in UAVs due to advanced processing needs
      • 5.1.3.2. Continuous investments and roll-out of 5G network
    • 5.1.4. Challenges
      • 5.1.4.1. Scalability and security concerns associated with chiplets
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Processor: Growing significance of application processing units in consumer electronics due to power efficiency and versatility
    • 5.2.2. Packaging Technology: Emerging applications of wafer-level chip scale packages due to highly compact and high-performance packages with low-cost
    • 5.2.3. End-use: Rising adoption of chiplets in the healthcare sector owing to precision and reliability properties
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Chiplet Market, by Processor

  • 6.1. Introduction
  • 6.2. Application Processing Unit
  • 6.3. Artificial Intelligence Application-Specific Integrated Circuit Compressor
  • 6.4. Central Processing Unit
  • 6.5. Field-Programmable Gate Array
  • 6.6. Graphic Processing Unit

7. Chiplet Market, by Packaging Technology

  • 7.1. Introduction
  • 7.2. 2.5 & 3D
  • 7.3. Flip Chip Ball Grid Array
  • 7.4. Flip Chip Scale Package
  • 7.5. System-in-Package
  • 7.6. Wafer-Level Chip Scale Package

8. Chiplet Market, by End-use

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Consumer Electronics
  • 8.4. Defense & Aerospace
  • 8.5. Healthcare
  • 8.6. Manufacturing
  • 8.7. Telecommunications

9. Americas Chiplet Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Chiplet Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Chiplet Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. PseudolithIC Inc. secures USD 6 million seed funding to accelerate compound semiconductor chiplet innovation
    • 12.3.2. Baya Systems secures over USD 36 million in Series B funding
    • 12.3.3. Intel unveiled chiplet at OFC 2024, revolutionizing high-speed data transmission and integrated photonics technology
    • 12.3.4. Rapidus and International Business Machines Corporation expand collaboration on advancing chiplet packaging technology
    • 12.3.5. Advanced Micro Devices, Inc. receives IEEE 2024 Corporate Innovation Award for chiplet technology
    • 12.3.6. Eliyan secures USD 60 million funding to advance chiplet interconnect technology for AI chips
    • 12.3.7. Cadence Design Systems Inc. and Arm revolutionize automotive with advanced chiplet platform for software-defined vehicles and ADAS
    • 12.3.8. Tenstorrent adopts Blue Cheetah's chiplet interconnect IP for enhanced AI and RISC-V solutions
    • 12.3.9. TDK Ventures invests in Silicon Box's chiplet packaging design to drive semiconductor innovation
    • 12.3.10. ASE Technology Holding Co., Ltd. introduces an integrated design ecosystem to halve silicon package design time
    • 12.3.11. Intel unveils a UCIe-connected chiplet-based test chip at Innovation 2023 by integrating Intel and Synopsys IPs using the EMIB interface.
    • 12.3.12. Marvell Technology collaborates with IMEC on automotive chiplet initiative for advanced computing SoCs
    • 12.3.13. Alphawave Semi expands collaboration with Samsung Electronics Co., Ltd. by introducing 3nm connectivity IP solutions
    • 12.3.14. International Business Machines Corporation advances chiplets with hybrid bonding for thinner, smaller connections
  • 12.4. Strategy Analysis & Recommendation
    • 12.4.1. Advanced Micro Devices, Inc.
    • 12.4.2. Intel Corporation
    • 12.4.3. Taiwan Semiconductor Manufacturing Company Limited
    • 12.4.4. NVIDIA Corporation

Companies Mentioned

  • 1. Achronix Semiconductor Corporation
  • 2. Advanced Micro Devices, Inc.
  • 3. Alphawave IP Group PLC
  • 4. Apple Inc.
  • 5. Arm Holdings PLC
  • 6. ASE Technology Holding Co, Ltd.
  • 7. Ayar Labs, Inc.
  • 8. Beijing ESWIN Technology Group Co., Ltd.
  • 9. Broadcom Inc.
  • 10. Cadence Design Systems, Inc.
  • 11. Chipuller
  • 12. Eliyan Corp
  • 13. GlobalFoundries Inc.
  • 14. Huawei Technologies Co., Ltd.
  • 15. Intel Corporation
  • 16. International Business Machines Corporation
  • 17. JCET Group
  • 18. Kandou Bus, S.A.
  • 19. Marvell Technology, Inc.
  • 20. Mercury Systems, Inc.
  • 21. Netronome Systems, Inc.
  • 22. NHanced Semiconductors, Inc.
  • 23. NVIDIA Corporation
  • 24. NXP Semiconductors N.V.
  • 25. Palo Alto Electron, Inc.
  • 26. Qualcomm Incorporated
  • 27. RANVOUS Inc.
  • 28. Samsung Electronics Co., Ltd.
  • 29. Socionext Inc.
  • 30. Synopsys, Inc.
  • 31. Tachyum S.r.o.
  • 32. Taiwan Semiconductor Manufacturing Company Limited
  • 33. Tenstorrent Inc.
  • 34. TongFu Microelectronics Co., Ltd.
  • 35. X-Celeprint by Xtrion N.V.

LIST OF FIGURES

  • FIGURE 1. CHIPLET MARKET MULTI-CURRENCY
  • FIGURE 2. CHIPLET MARKET MULTI-LANGUAGE
  • FIGURE 3. CHIPLET MARKET RESEARCH PROCESS
  • FIGURE 4. CHIPLET MARKET SIZE, 2023 VS 2030
  • FIGURE 5. GLOBAL CHIPLET MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 6. GLOBAL CHIPLET MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 7. GLOBAL CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL CHIPLET MARKET SIZE, BY PROCESSOR, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL CHIPLET MARKET SIZE, BY PROCESSOR, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. GLOBAL CHIPLET MARKET SIZE, BY END-USE, 2023 VS 2030 (%)
  • FIGURE 13. GLOBAL CHIPLET MARKET SIZE, BY END-USE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. AMERICAS CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. AMERICAS CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. UNITED STATES CHIPLET MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 17. UNITED STATES CHIPLET MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. ASIA-PACIFIC CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. ASIA-PACIFIC CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 21. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 22. CHIPLET MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 23. CHIPLET MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. CHIPLET MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL CHIPLET MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL CHIPLET MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. CHIPLET MARKET DYNAMICS
  • TABLE 7. GLOBAL CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL CHIPLET MARKET SIZE, BY APPLICATION PROCESSING UNIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL CHIPLET MARKET SIZE, BY ARTIFICIAL INTELLIGENCE APPLICATION-SPECIFIC INTEGRATED CIRCUIT COMPRESSOR, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL CHIPLET MARKET SIZE, BY CENTRAL PROCESSING UNIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL CHIPLET MARKET SIZE, BY FIELD-PROGRAMMABLE GATE ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL CHIPLET MARKET SIZE, BY GRAPHIC PROCESSING UNIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL CHIPLET MARKET SIZE, BY 2.5 & 3D, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL CHIPLET MARKET SIZE, BY FLIP CHIP BALL GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL CHIPLET MARKET SIZE, BY FLIP CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL CHIPLET MARKET SIZE, BY SYSTEM-IN-PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL CHIPLET MARKET SIZE, BY WAFER-LEVEL CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL CHIPLET MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL CHIPLET MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL CHIPLET MARKET SIZE, BY DEFENSE & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. GLOBAL CHIPLET MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. GLOBAL CHIPLET MARKET SIZE, BY MANUFACTURING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. GLOBAL CHIPLET MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 26. AMERICAS CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 27. AMERICAS CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 28. AMERICAS CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 29. AMERICAS CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 30. ARGENTINA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 31. ARGENTINA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 32. ARGENTINA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 33. BRAZIL CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 34. BRAZIL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 35. BRAZIL CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 36. CANADA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 37. CANADA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 38. CANADA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 39. MEXICO CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 40. MEXICO CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 41. MEXICO CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 42. UNITED STATES CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 43. UNITED STATES CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 44. UNITED STATES CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 45. UNITED STATES CHIPLET MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 46. ASIA-PACIFIC CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 47. ASIA-PACIFIC CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 48. ASIA-PACIFIC CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 49. ASIA-PACIFIC CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 50. AUSTRALIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 51. AUSTRALIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 52. AUSTRALIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 53. CHINA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 54. CHINA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 55. CHINA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 56. INDIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 57. INDIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 58. INDIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 59. INDONESIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 60. INDONESIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 61. INDONESIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 62. JAPAN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 63. JAPAN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 64. JAPAN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 65. MALAYSIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 66. MALAYSIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 67. MALAYSIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 68. PHILIPPINES CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 69. PHILIPPINES CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 70. PHILIPPINES CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 71. SINGAPORE CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 72. SINGAPORE CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 73. SINGAPORE CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 74. SOUTH KOREA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 75. SOUTH KOREA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 76. SOUTH KOREA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 77. TAIWAN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 78. TAIWAN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 79. TAIWAN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 80. THAILAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 81. THAILAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 82. THAILAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 83. VIETNAM CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 84. VIETNAM CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 85. VIETNAM CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 86. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 87. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 88. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 89. EUROPE, MIDDLE EAST & AFRICA CHIPLET MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 90. DENMARK CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 91. DENMARK CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 92. DENMARK CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 93. EGYPT CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 94. EGYPT CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 95. EGYPT CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 96. FINLAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 97. FINLAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 98. FINLAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 99. FRANCE CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 100. FRANCE CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 101. FRANCE CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 102. GERMANY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 103. GERMANY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 104. GERMANY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 105. ISRAEL CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 106. ISRAEL CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 107. ISRAEL CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 108. ITALY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 109. ITALY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 110. ITALY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 111. NETHERLANDS CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 112. NETHERLANDS CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 113. NETHERLANDS CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 114. NIGERIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 115. NIGERIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 116. NIGERIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 117. NORWAY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 118. NORWAY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 119. NORWAY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 120. POLAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 121. POLAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 122. POLAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 123. QATAR CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 124. QATAR CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 125. QATAR CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 126. RUSSIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 127. RUSSIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 128. RUSSIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 129. SAUDI ARABIA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 130. SAUDI ARABIA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 131. SAUDI ARABIA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 132. SOUTH AFRICA CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 133. SOUTH AFRICA CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 134. SOUTH AFRICA CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 135. SPAIN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 136. SPAIN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 137. SPAIN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 138. SWEDEN CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 139. SWEDEN CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 140. SWEDEN CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 141. SWITZERLAND CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 142. SWITZERLAND CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 143. SWITZERLAND CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 144. TURKEY CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 145. TURKEY CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 146. TURKEY CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED ARAB EMIRATES CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 148. UNITED ARAB EMIRATES CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 149. UNITED ARAB EMIRATES CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 150. UNITED KINGDOM CHIPLET MARKET SIZE, BY PROCESSOR, 2018-2030 (USD MILLION)
  • TABLE 151. UNITED KINGDOM CHIPLET MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 152. UNITED KINGDOM CHIPLET MARKET SIZE, BY END-USE, 2018-2030 (USD MILLION)
  • TABLE 153. CHIPLET MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 154. CHIPLET MARKET, FPNV POSITIONING MATRIX, 2023