市場調查報告書
商品編碼
1466275
相機模組市場:按製程、組件、介面、像素、應用分類 - 2024-2030 年全球預測Camera Module Market by Process (Chip-On-Board (COB) Camera Module, Flip-Chip Camera Module), Component (Digital Signal Processing, Image Sensor, Infrared Filter), Interface, Pixel, Application - Global Forecast 2024-2030 |
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預計2023年相機模組市場規模為363億美元,預計2024年將達390億美元,2030年將達604.4億美元,複合年成長率為7.55%。
全球相機模組市場正在響應家用電子電器和工業應用中對高品質成像和感測解決方案日益成長的需求。這些模組包括影像感測器、鏡頭組件、音圈馬達、紅外線截止濾光片以及捕捉高解析度影像和影片的印刷電路基板。日益嚴重的安全問題和智慧型手機技術的快速發展正在推動對先進監控系統和高品質攝影機的需求。此外,汽車行業擴大採用 ADAS(高級駕駛員輔助系統),這需要高效的相機模組功能。與相機模組生產相關的高成本以及與相機模組相關的品質問題阻礙了市場的成長。智慧城市對視訊監控的需求、3D 深度感測技術的進步以及對穿戴式和物聯網應用相機模組小型化的日益關注預計將創造市場機會。
主要市場統計 | |
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基準年[2023] | 363億美元 |
預測年份 [2024] | 390億美元 |
預測年份 [2030] | 604.4億美元 |
複合年成長率(%) | 7.55% |
小型製程設備中板載晶片(COB)相機模組的普及
板載晶片(COB) 和覆晶技術為相機模組產業的某些應用提供了獨特的優勢。板載晶片(COB) 模組為空間受限的攜帶式設備提供了小型輕量的解決方案。此技術可確保更快的資料傳輸、更好的熱性能以及因減少訊號干擾而提高的影像品質。覆晶相機模組採用一種稱為覆晶接合的先進封裝技術,該技術將影像晶粒晶片直接連接到印刷電路基板(PCB),而無需使用打線接合。其結果是比傳統 COB 設計更矮,組件之間的電氣途徑更短,從而實現更快的資料傳輸和更低的訊號雜訊。選擇 COB 或覆晶相機模組取決於設備尺寸限制、所需的影像品質、資料傳輸速率、功耗要求和成本考慮因素。
組成部分:由於對高解析度影像的需求不斷增加,影像感測器快速成長
相機模組市場的高品質影像和視訊製作依賴數位訊號處理 (DSP)、影像感測器、紅外線濾光片、鏡頭、軟板和印刷電路基板(PCB) 等組件。數位訊號處理 (DSP) 可增強原始影像資料,以確保清晰的影像和準確的色彩再現,並支援降噪和鏡頭失真校正等關鍵功能。影像感測器將光轉換為電子訊號,在決定相機模組的影像品質方面發揮重要作用。紅外線濾光片可去除不必要的紅外線輻射,這些輻射可能會導致戶外應用中的顏色失真。非球面鏡頭因其緊湊的設計和減少球面像差的能力而受到歡迎。軟基板和 PCB 產業對高密度互連 (HDI)基板的需求量很大,以支援相機模組市場的小型化趨勢。了解相機模組中每個組件的重要性可以根據特定應用需求選擇最佳解決方案,同時鼓勵業界不斷創新以突破相機模組技術的界限。
介面相機串列介面(CSI) 的需求量很大,因為它適用於行動裝置、物聯網設備和其他小型應用。
相機並行介面 (CPI) 和相機串列介面(CSI) 是將相機模組連接到主機設備的兩種不同方式。相機並行介面 (CPI) 是一種較古老、更傳統的方法,它使用多條資料線進行高速並行通訊,非常適合工業視覺系統和高速視訊處理等高頻寬、低延遲應用。相機串列介面 (CSI) 使用差分訊號透過更少的訊號線串列傳輸影像資料,從而減少電磁干擾 (EMI)、提高抗雜訊並延長電纜長度。受益於 CSI 的應用包括智慧型手機、平板電腦、無人機和物聯網設備,在這些設備中,更小的外形尺寸和更低的功耗至關重要。 CPI 和 CSI 之間的選擇取決於您的特定應用要求。 CPI 適用於需要最小延遲的高頻寬應用,而降低的功耗、緊湊的設計和卓越的 EMI 性能使 CSI 適用於電源資源有限的小型設備。
應用:智慧型手機、平板電腦和個人電腦中相機模組的使用越來越多。
相機模組是汽車、消費性電子、國防、工業、醫療和個人電腦設備等多個領域的重要組件。在汽車產業,ADAS(高級駕駛輔助系統)、後視攝影機、自動駕駛汽車等功能都依賴相機模組。在消費性電子市場,數位相機、運動攝影機、無人機、 VR頭戴裝置等都需要高品質的相機模組。在國防和航太領域,相機模組對於監視系統、偵察無人機/無人機、衛星成像系統等至關重要。在工業中,相機模組用於機器視覺系統的自動化機器人。在醫療領域,需要用於內視鏡、顯微鏡和診斷設備等眼科設備的專用相機模組。相機模組是智慧型手機、平板電腦和個人電腦拍照和視訊通話的必備組件。
區域洞察
在美洲地區,相機模組的需求主要由智慧型手機、整合ADAS(高級駕駛輔助系統)的汽車應用、安全和監控系統以及消費性電子產品等關鍵產業推動。在美國和加拿大,消費者在購買相機模組時優先考慮高品質的影像捕捉和錄影功能。在EMEA(歐洲、中東和非洲)地區,由於智慧型手機普及的不斷提高和汽車工業的擴張,對相機模組的需求正在穩步成長。特別是在歐洲,我們致力於推出嚴格的法規,要求車輛配備 ADAS,從而推動汽車產業對先進相機模組的需求。在中東和非洲,某些地區的地緣政治不穩定增加了安全疑慮和對有效監控系統的需求。由於快速的都市化、可支配收入的增加推動消費者對智慧型手機和數位相機等電子設備的支出,以及強勁的工業成長推動汽車生產,亞太地區在相機模組的需求方面擁有全球最大的市場佔有率。
FPNV定位矩陣
FPNV定位矩陣對於評估相機模組市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標,以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估,供應商被分為四個成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市場佔有率分析
市場佔有率分析是一個綜合工具,可以對相機模組市場供應商的現狀進行深入而詳細的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻,以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外,該分析還提供了對該行業競爭特徵的寶貴見解,包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略,以獲得市場競爭優勢。
1. 市場滲透率:提供有關主要企業所服務的市場的全面資訊。
2. 市場開拓:我們深入研究利潤豐厚的新興市場,並分析其在成熟細分市場的滲透率。
3. 市場多元化:提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。
4. 競爭評估和情報:對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況和製造能力進行全面評估。
5. 產品開發與創新:提供對未來技術、研發活動和突破性產品開發的見解。
1.相機模組市場規模及預測如何?
2.在相機模組市場預測期間內,有哪些產品、細分市場、應用和領域值得考慮投資?
3.相機模組市場的技術趨勢和法規結構是什麼?
4.相機模組市場主要廠商的市場佔有率是多少?
5.進入相機模組市場合適的型態和策略手段是什麼?
[197 Pages Report] The Camera Module Market size was estimated at USD 36.30 billion in 2023 and expected to reach USD 39.00 billion in 2024, at a CAGR 7.55% to reach USD 60.44 billion by 2030.
The global camera module market caters to the increasing demand for high-quality imaging and sensing solutions in consumer electronics and industrial applications. These modules include image sensors, lens assemblies, voice coil motors, infrared cut filters, and printed circuit boards that capture high-resolution images and videos. Growing security concerns and rapid smartphone technology advancements propel the need for advanced surveillance systems and higher-quality cameras. In addition, the increasing adoption of advanced driver-assistance systems (ADAS) in the automotive industry requires efficient camera modules for functions, heightening the market growth. High costs associated with the production of camera modules and Quality issues related to the camera module hamper the market growth. The introduction of smart cities resulting in the need for video surveillance, advancement in 3D depth-sensing technologies, and growing focus on miniaturizing camera modules for wearables and IoT applications are expected to create opportunities in the market.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 36.30 billion |
Estimated Year [2024] | USD 39.00 billion |
Forecast Year [2030] | USD 60.44 billion |
CAGR (%) | 7.55% |
Process: Proliferation of chip-on-board (COB) camera modules for compact devices
Chip-on-board (COB) and flip-chip technologies offer distinct advantages for specific applications in the camera module industry. Chip-on-board (COB) modules provide compact and lightweight solutions suitable for portable devices with space constraints. This technology ensures high-speed data transfer, better thermal performance, and enhanced image quality due to reduced signal interference. Flip-chip camera modules employ an advanced packaging technique called flip-chip bonding that connects the image sensor die directly to the printed circuit board (PCB) without utilizing wire bonds. This results in slimmer profiles compared to traditional COB designs, enabling faster data transmission and lower signal noise due to shorter electrical paths between components. The choice between COB or Flip-Chip camera modules depends on device size constraints, desired image quality, data transfer speeds, power consumption requirements, and cost considerations.
Component: Rapid growth for image sensors due to rising demand for high-resolution images
High-quality image and video production in the camera module market relies on components including digital signal processing (DSP), image sensor, infrared filter, lens, and soft board or printed circuit board (PCB). Digital signal processing (DSP) enhances raw image data to ensure clear images with accurate color reproduction and support essential features such as noise reduction and lens distortion correction. The image sensor transforms light into electronic signals and recreates a vital role in determining the image quality a camera module produces. Infrared filters eliminate unwanted infrared light that can cause color distortion in outdoor applications. Aspheric lenses have gained popularity due to their ability to reduce spherical aberrations while maintaining a compact design. High-density interconnect (HDI) boards are increasingly in demand in the soft board or PCB industry to support miniaturization trends within the camera module market. Understanding the importance of each component within camera modules enables the selection of optimal solutions based on specific application requirements while fostering constant innovation in the industry to push the boundaries of camera module technology.
Interface: Growing demand for camera serial interface (CSI) as they are more suitable for mobile devices, IoT gadgets, and other small form-factor applications
The camera parallel interface (CPI) and camera serial interface (CSI) are two distinct methods for connecting camera modules to host devices. Camera parallel interface (CPI), an older and more traditional approach, utilizes multiple data lines for high-speed parallel communication, making it ideal for high bandwidth and low latency applications, such as industrial vision systems and high-speed video processing. Camera serial interface (CSI) uses a differential signaling scheme to transmit image data serially over fewer signal lines, which results in reduced electromagnetic interference (EMI), improved noise immunity, and longer cable lengths. Applications that benefit from CSI include smartphones, tablets, drones, and IoT devices, where smaller form factors and reduced power consumption are essential. The preference between CPI and CSI depends on the specific application requirements. While CPI may be preferred for high-bandwidth applications with minimal latency needs, reduced power consumption, compact design, and better EMI performance make CSI more fitting for smaller devices with limited power resources.
Application: Growing use of camera modules in smartphones, tablets, and PCs due to high consumer demand for high-quality photography and integration with various applications
Camera modules are vital components in various sectors, including automotive, consumer electronics, defense, industrial, medical, and personal computing devices. In the automotive industry, advanced driver assistance systems (ADAS), rearview cameras, and autonomous vehicles rely on camera modules for functions, including lane departure warnings and parking assistance. The consumer electronics market demands high-quality camera modules for digital cameras, action cameras, drones, and VR headsets. In defense and space applications, camera modules are essential for surveillance systems, reconnaissance drones/UAVs (Unmanned Aerial Vehicles), and satellite imaging systems, among others. The industrial sector utilizes camera modules in machine vision systems automation robotics. Medical applications require specialized camera modules for endoscopy microscopy ophthalmology devices, among other purposes, such as diagnostics equipment. Camera modules are indispensable components of smartphones, tablets, and PCs for capturing photographs and facilitating video calls.
Regional Insights
In the Americas region, the demand for camera modules is primarily driven by key industries such as smartphones, automotive applications integrating Advanced Driver Assistance Systems (ADAS), security and surveillance systems, and consumer electronics. In the United States and Canada, consumers prioritize high-quality image capture and video recording capabilities when purchasing camera modules. The EMEA region represents steady growth in demand for camera modules due to rising smartphone adoption rates and the expanding automotive sector. Europe, in particular, has been focusing on implementing stringent regulations mandating the use of ADAS features in vehicles, consequently driving the demand for advanced camera modules within the automotive industry. The Middle East and Africa have witnessed increased security concerns and the need for effective surveillance systems due to geopolitical instability in certain regions. The APAC region exhibits the largest market share globally regarding camera module demand attributed to rapid urbanization, increasing disposable income levels driving consumer spending on electronic devices such as smartphones and digital cameras, and strong industrial growth propelling automotive production.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Camera Module Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Camera Module Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Camera Module Market, highlighting leading vendors and their innovative profiles. These include ams-OSRAM AG, Chicony Electronics Co., Ltd., Cowell e Holdings Inc., Fujifilm Holdings Corporation, Guangzhou Luxvisions Innovation Technology Limited, Immervision, JENOPTIK AG, KYOCERA Corporation, LG Electronics Inc., LITE-ON Technology Corp., Mcnex Co., Ltd., OmniVision Technologies, Inc., Partron Co., Ltd., Primax Electronics Ltd., Q Technology (Group) Company Limited, Rayprus Holding Ltd., Samsung Electro-Mechanics Co., Ltd., Sharp Group, Shenzhen Castle Light Technology Co., Ltd, Shenzhen ChuangMu Technology Co., Ltd, SK Hynix Inc., Sony Group Corporation, STMicroelectronics N.V., Toshiba Corporation, and Truly International Holdings Ltd..
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Camera Module Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Camera Module Market?
3. What are the technology trends and regulatory frameworks in the Camera Module Market?
4. What is the market share of the leading vendors in the Camera Module Market?
5. Which modes and strategic moves are suitable for entering the Camera Module Market?