2026-2030年全球藍牙積體電路市場

預計從 2025 年到 2030 年，全球藍牙積體電路市場規模將成長至 293.42 億美元，預測期內複合年成長率為 11.0%。

本報告對全球藍牙積體電路市場進行了全面分析，包括市場規模和預測、趨勢、成長要素、挑戰以及涵蓋約 25 家供應商的供應商分析。

本報告對當前市場狀況、最新趨勢和促進因素以及整體市場環境進行了最新分析。該市場的成長主要受以下因素驅動：物聯網設備的日益普及、家用電子電器對無線連接需求的不斷成長，以及連網技術在汽車和工業應用領域的廣泛應用。

本研究客觀地結合了一手和二手訊息，包括來自主要行業相關人員的信息。報告內容涵蓋主要公司分析、全面的市場規模資料、細分市場數據及區域分析，以及供應商格局。報告包含歷史數據和預測數據。

這項研究表明，低功耗藍牙（BLE）和邊緣智慧功能的日益融合將成為未來幾年全球藍牙積體電路市場成長的主要驅動力之一。此外，更高數據吞吐量和增強型語音通訊標準的採用，以及多重通訊協定無線連接平台的融合，預計也將產生顯著的市場需求。

目錄

第1章：執行摘要

第2章 Technavio 分析

• 分析定價、生命週期、顧客購買籃子、採用率和購買標準。
• 輸入的重要性及差異化因素
• 干擾因素
• 促進因素和挑戰的影響

第3章 市場狀況

• 市場生態系統
• 市場特徵
• 價值鏈分析

第4章 市場規模

• 市場的定義
• 市場區隔分析
• 2025年市場規模
• 市場展望，2025-2030年

第5章 市場規模與表現

• 2020-2024年全球藍牙積體電路市場
• 2020-2024年基於階層的細分市場分析
• 基於應用領域的細分市場分析，2020-2024 年
• 按類型分類的細分市場分析，2020-2024 年
• 區域區隔市場分析，2020-2024 年
• 2020-2024年各國細分市場分析

第6章 定性分析

• 人工智慧的影響：全球藍牙積體電路市場
• 地緣政治衝突的影響：全球藍牙積體電路市場。

第7章：五力分析

第8章 按類別分類的市場區隔

• 按班級比較
• 二類
• 一級
• 三級
• 按類別分類的市場機會

第9章 市場區隔：依應用

• 比較：按應用
• 信標
• 音響設備
• 智慧家庭
• 車
• 其他
• 市場機會：依應用領域分類

第10章 市場區隔：依類型

• 比較：按類型
• 雙模藍牙晶片
• Bluetooth Low Energy IC
• 藍牙經典IC
• 市場機會：按類型分類

第11章 客戶情況

第12章 區域情勢

• 區域細分
• 區域比較
• 亞太地區
  • 中國
  • 日本
  • 印度
  • 韓國
  • 澳洲
  • 印尼
• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 歐洲
  • 德國
  • 英國
  • 法國
  • 義大利
  • 西班牙
  • 荷蘭
• 中東和非洲
  • 沙烏地阿拉伯
  • UAE
  • 南非
  • 以色列
  • 土耳其
• 南美洲
  • 巴西
  • 阿根廷
  • 智利
• 市場機會：按地區分類

第13章 促進因素、挑戰與機遇

• 市場促進因素
• 市場挑戰
• 促進因素和挑戰的影響
• 市場機遇

第14章 競爭格局

• 概述
• 競爭格局
• 混亂局面
• 產業風險

第15章 競爭分析

• 公司簡介
• 公司排名指標
• 企業市場定位
• Broadcom Inc.
• Infineon Technologies AG
• MediaTek Inc.
• Microchip Technology Inc.
• NXP Semiconductors NV
• ON Semiconductor Corp.
• Qualcomm Inc.
• Realtek Semiconductor Corp.
• Renesas Electronics Corp.
• ROHM Co. Ltd.
• Shenzhen Goodix Technology Co.
• Sony Group Corp.
• STMicroelectronics NV
• Texas Instruments Inc.
• Toshiba Corp.

第16章附錄

The global bluetooth integrated circuit (IC) market is forecasted to grow by USD 29304.2 mn during 2025-2030, accelerating at a CAGR of 11.0% during the forecast period. The report on the global bluetooth integrated circuit (IC) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing adoption of iot devices, expanding demand for wireless connectivity in consumer electronics, advancing deployment of connected technologies in automotive and industrial applications.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global bluetooth integrated circuit (IC) market is segmented as below:

By Class Type

• Class II
• Class I
• Class III

By Application

• Beacons
• Audio devices
• Smart homes
• Automotive
• Others

By Type

• Dual-mode bluetooth ICs
• Bluetooth low energy ICs
• Bluetooth classic ICs

Geography

• APAC
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
• Middle East and Africa
  • UAE
  • South Africa
  • Turkey
• South America
  • Brazil
  • Argentina
  • Chile
• Rest of World (ROW)

This study identifies the advancing integration of ble and edge intelligence capabilities as one of the prime reasons driving the global bluetooth integrated circuit (IC) market growth during the next few years. Also, evolving adoption of higher data throughput and enhanced audio communication standards and increasing convergence of multi-protocol wireless connectivity platforms will lead to sizable demand in the market.

The report on the global bluetooth integrated circuit (IC) market covers the following areas:

• Global bluetooth integrated circuit (IC) market sizing
• Global bluetooth integrated circuit (IC) market forecast
• Global bluetooth integrated circuit (IC) market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global bluetooth integrated circuit (IC) market vendors that include Broadcom Inc., Espressif Systems Shanghai, Infineon Technologies AG, MediaTek Inc., Microchip Technology Inc., Nordic Semiconductor ASA, NXP Semiconductors NV, ON Semiconductor Corp., Qualcomm Inc., Realtek Semiconductor Corp., Renesas Electronics Corp., ROHM Co. Ltd., Shenzhen Goodix Technology Co., Silicon Laboratories Inc., Sony Group Corp., STMicroelectronics NV, Synaptics Inc., Texas Instruments Inc., Toshiba Corp.. Also, the global bluetooth integrated circuit (IC) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Class Type
  • Executive Summary - Chart on Market Segmentation by Application
  • Executive Summary - Chart on Market Segmentation by Type
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2025
• 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

• 5.1 Global Bluetooth Integrated Circuit (IC) Market 2020 - 2024
  • Historic Market Size - Data Table on Global Bluetooth Integrated Circuit (IC) Market 2020 - 2024 ($ million)
• 5.2 Class Type segment analysis 2020 - 2024
  • Historic Market Size - Class Type Segment 2020 - 2024 ($ million)
• 5.3 Application segment analysis 2020 - 2024
  • Historic Market Size - Application Segment 2020 - 2024 ($ million)
• 5.4 Type segment analysis 2020 - 2024
  • Historic Market Size - Type Segment 2020 - 2024 ($ million)
• 5.5 Geography segment analysis 2020 - 2024
  • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
• 5.6 Country segment analysis 2020 - 2024
  • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI on global bluetooth integrated circuit (IC) market
• 6.2 Impact of geopolitical conflicts on global bluetooth integrated circuit (IC) market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2025 and 2030
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2025 and 2030
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2025 and 2030
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2025 and 2030
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2025 and 2030
• 7.7 Market condition

8 Market Segmentation by Class Type

• 8.1 Market segments
• 8.2 Comparison by Class Type
• 8.3 Class II - Market size and forecast 2025-2030
• 8.4 Class I - Market size and forecast 2025-2030
• 8.5 Class III - Market size and forecast 2025-2030
• 8.6 Market opportunity by Class Type
  • Market opportunity by Class Type ($ million)

9 Market Segmentation by Application

• 9.1 Market segments
• 9.2 Comparison by Application
• 9.3 Beacons - Market size and forecast 2025-2030
• 9.4 Audio devices - Market size and forecast 2025-2030
• 9.5 Smart homes - Market size and forecast 2025-2030
• 9.6 Automotive - Market size and forecast 2025-2030
• 9.7 Others - Market size and forecast 2025-2030
• 9.8 Market opportunity by Application
  • Market opportunity by Application ($ million)

10 Market Segmentation by Type

• 10.1 Market segments
• 10.2 Comparison by Type
• 10.3 Dual-mode bluetooth ICs - Market size and forecast 2025-2030
• 10.4 Bluetooth low energy ICs - Market size and forecast 2025-2030
• 10.5 Bluetooth classic ICs - Market size and forecast 2025-2030
• 10.6 Market opportunity by Type
  • Market opportunity by Type ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2025-2030
  • 12.3.1 China - Market size and forecast 2025-2030
  • 12.3.2 Japan - Market size and forecast 2025-2030
  • 12.3.3 India - Market size and forecast 2025-2030
  • 12.3.4 South Korea - Market size and forecast 2025-2030
  • 12.3.5 Australia - Market size and forecast 2025-2030
  • 12.3.6 Indonesia - Market size and forecast 2025-2030
• 12.4 North America - Market size and forecast 2025-2030
  • 12.4.1 US - Market size and forecast 2025-2030
  • 12.4.2 Canada - Market size and forecast 2025-2030
  • 12.4.3 Mexico - Market size and forecast 2025-2030
• 12.5 Europe - Market size and forecast 2025-2030
  • 12.5.1 Germany - Market size and forecast 2025-2030
  • 12.5.2 UK - Market size and forecast 2025-2030
  • 12.5.3 France - Market size and forecast 2025-2030
  • 12.5.4 Italy - Market size and forecast 2025-2030
  • 12.5.5 Spain - Market size and forecast 2025-2030
  • 12.5.6 The Netherlands - Market size and forecast 2025-2030
• 12.6 Middle East and Africa - Market size and forecast 2025-2030
  • 12.6.1 Saudi Arabia - Market size and forecast 2025-2030
  • 12.6.2 UAE - Market size and forecast 2025-2030
  • 12.6.3 South Africa - Market size and forecast 2025-2030
  • 12.6.4 Israel - Market size and forecast 2025-2030
  • 12.6.5 Turkey - Market size and forecast 2025-2030
• 12.7 South America - Market size and forecast 2025-2030
  • 12.7.1 Brazil - Market size and forecast 2025-2030
  • 12.7.2 Argentina - Market size and forecast 2025-2030
  • 12.7.3 Chile - Market size and forecast 2025-2030
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Growing adoption of IoT devices
  • Expanding demand for wireless connectivity in consumer electronics
  • Advancing deployment of connected technologies in automotive and industrial applications
• 13.2 Market challenges
  • Complex semiconductor supply chain dependencies
  • Rising integration complexity across connected ecosystems
  • Stringent regulatory and certification requirements
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2025 and 2030
• 13.4 Market opportunities
  • Advancing integration of BLE and edge intelligence capabilities
  • Evolving adoption of higher data throughput and enhanced audio communication standards
  • Increasing convergence of multi-protocol wireless connectivity platforms

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 Broadcom Inc.
  • Broadcom Inc. - Overview
  • Broadcom Inc. - Business segments
  • Broadcom Inc. - Key news
  • Broadcom Inc. - Key offerings
  • Broadcom Inc. - Segment focus
  • SWOT
• 15.5 Infineon Technologies AG
  • Infineon Technologies AG - Overview
  • Infineon Technologies AG - Business segments
  • Infineon Technologies AG - Key news
  • Infineon Technologies AG - Key offerings
  • Infineon Technologies AG - Segment focus
  • SWOT
• 15.6 MediaTek Inc.
  • MediaTek Inc. - Overview
  • MediaTek Inc. - Business segments
  • MediaTek Inc. - Key news
  • MediaTek Inc. - Key offerings
  • MediaTek Inc. - Segment focus
  • SWOT
• 15.7 Microchip Technology Inc.
  • Microchip Technology Inc. - Overview
  • Microchip Technology Inc. - Business segments
  • Microchip Technology Inc. - Key offerings
  • Microchip Technology Inc. - Segment focus
  • SWOT
• 15.8 NXP Semiconductors NV
  • NXP Semiconductors NV - Overview
  • NXP Semiconductors NV - Business segments
  • NXP Semiconductors NV - Key news
  • NXP Semiconductors NV - Key offerings
  • NXP Semiconductors NV - Segment focus
  • SWOT
• 15.9 ON Semiconductor Corp.
  • ON Semiconductor Corp. - Overview
  • ON Semiconductor Corp. - Business segments
  • ON Semiconductor Corp. - Key news
  • ON Semiconductor Corp. - Key offerings
  • ON Semiconductor Corp. - Segment focus
  • SWOT
• 15.10 Qualcomm Inc.
  • Qualcomm Inc. - Overview
  • Qualcomm Inc. - Business segments
  • Qualcomm Inc. - Key news
  • Qualcomm Inc. - Key offerings
  • Qualcomm Inc. - Segment focus
  • SWOT
• 15.11 Realtek Semiconductor Corp.
  • Realtek Semiconductor Corp. - Overview
  • Realtek Semiconductor Corp. - Product / Service
  • Realtek Semiconductor Corp. - Key offerings
  • SWOT
• 15.12 Renesas Electronics Corp.
  • Renesas Electronics Corp. - Overview
  • Renesas Electronics Corp. - Business segments
  • Renesas Electronics Corp. - Key news
  • Renesas Electronics Corp. - Key offerings
  • Renesas Electronics Corp. - Segment focus
  • SWOT
• 15.13 ROHM Co. Ltd.
  • ROHM Co. Ltd. - Overview
  • ROHM Co. Ltd. - Business segments
  • ROHM Co. Ltd. - Key news
  • ROHM Co. Ltd. - Key offerings
  • ROHM Co. Ltd. - Segment focus
  • SWOT
• 15.14 Shenzhen Goodix Technology Co.
  • Shenzhen Goodix Technology Co. - Overview
  • Shenzhen Goodix Technology Co. - Product / Service
  • Shenzhen Goodix Technology Co. - Key offerings
  • SWOT
• 15.15 Sony Group Corp.
  • Sony Group Corp. - Overview
  • Sony Group Corp. - Business segments
  • Sony Group Corp. - Key news
  • Sony Group Corp. - Key offerings
  • Sony Group Corp. - Segment focus
  • SWOT
• 15.16 STMicroelectronics NV
  • STMicroelectronics NV - Overview
  • STMicroelectronics NV - Business segments
  • STMicroelectronics NV - Key news
  • STMicroelectronics NV - Key offerings
  • STMicroelectronics NV - Segment focus
  • SWOT
• 15.17 Texas Instruments Inc.
  • Texas Instruments Inc. - Overview
  • Texas Instruments Inc. - Business segments
  • Texas Instruments Inc. - Key news
  • Texas Instruments Inc. - Key offerings
  • Texas Instruments Inc. - Segment focus
  • SWOT
• 15.18 Toshiba Corp.
  • Toshiba Corp. - Overview
  • Toshiba Corp. - Product / Service
  • Toshiba Corp. - Key offerings
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations