全球晶圓基板上晶片封裝（COWOS）市場，2025-2029年

全球晶圓基板晶片（COWOS）市場預計在 2024-2029 年預測期內達到 14.023 億美元，複合年成長率為 9.4%。

本報告對全球晶圓基板基板（COWOS）市場進行了全面分析，涵蓋市場規模和預測、趨勢、成長要素、挑戰，以及對約 25 家公司的供應商分析。

本報告對當前市場格局、最新趨勢和促進因素以及整體市場環境進行了最新分析。市場成長的促進因素包括人工智慧 (AI) 和高效能運算 (HPC) 需求的爆炸性成長、莫耳定律放緩和異質整合的興起，以及資料中心基礎設施的快速擴張。

本研究採用客觀的方法，結合一手和二手訊息，包括來自主要行業相關人員的意見。報告包含全面的市場規模數據、區域細分分析、供應商格局以及對主要企業的分析。報告提供歷史數據和預測數據。

研究指出，採用有機基板的封裝解決方案多樣化是未來幾年推動全球晶片基板（COWOS）市場成長的主要因素之一。此外，更大尺寸的中介層和封裝的普及，以及混合鍵結和真正3D堆疊技術的演進，預計也將顯著提升市場需求。

目錄

第1章執行摘要

第2章 Technavio 分析

• 價格、生命週期、顧客購買籃、採用率和購買標準分析
• 投入與差異化因素的重要性
• 混淆來源
• 促進因素和挑戰的影響

第3章 市場情勢

• 市場生態系統
• 市場特徵
• 價值鏈分析

第4章 市場規模

• 市場定義
• 市場區隔分析
• 2024年市場規模
• 2024-2029年市場展望

第5章 市場規模表現

• 2019-2023年全球晶片基板（COWOS）市場
• 2019-2023年技術細分市場分析
• 2019-2023年組件細分市場分析
• 2019-2023年最終用戶細分市場分析
• 2019-2023年區域細分市場分析
• 2019-2023年國家細分市場分析

第6章 定性分析

• 人工智慧的影響：全球晶圓基板晶片基板（COWOS）市場

第7章五力分析

• 五力分析概述
• 買方的議價能力
• 供應商的議價能力
• 新進入者的威脅
• 替代品的威脅
• 競爭威脅
• 市場狀況

8. 按技術分類的市場細分

• 比較：按技術
• CoWoS S
• CoWoS R
• CoWoS L
• 按技術分類的市場機遇

9. 按組件進行市場細分

• 比較：按組件
• GPU
• CPU
• FPGA
• 其他
• 按組件分類的市場機會

第10章 按最終用戶進行市場細分

• 比較：按最終用戶
• 雲端服務供應商
• 公司
• 政府機構
• 其他
• 按最終用戶分類的市場機會

第11章 客戶情況

第12章 區域情勢

• 區域細分
• 區域比較
• 亞太地區
  • 台灣
  • 韓國
  • 中國
  • 日本
  • 新加坡
  • 澳洲
• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 歐洲
  • 德國
  • 法國
  • 義大利
  • 英國
  • 荷蘭
  • 西班牙
• 南美洲
  • 巴西
  • 智利
  • 阿根廷
• 中東和非洲
  • 以色列
  • 阿拉伯聯合大公國
  • 沙烏地阿拉伯
  • 南非
  • 埃及
• 各區域的市場機遇

第13章：促進因素、挑戰與機遇

• 市場促進因素
• 市場挑戰
• 促進因素和挑戰的影響
• 市場機遇

第14章 競爭格局

• 概述
• 競爭格局
• 令人困惑的局面
• 產業風險

第15章 競爭分析

• 公司簡介
• 企業排名指數
• 公司市場定位
• Advanced Micro Devices Inc.
• Alchip Technologies Ltd.
• Amkor Technology Inc.
• ASE Technology Holding Co. Ltd.
• GlobalFoundries
• Intel Corp.
• Jiangsu Changdian Technology Co. Ltd.
• Micron Technology Inc.
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd.
• Sanechips Co. Ltd.
• SK hynix Co. Ltd.
• Taiwan Semiconductor Co. Ltd.
• Tongfu Microelectronics Co.
• United Microelectronics Corp.

第16章附錄

The global chip-on-wafer-on-substrate (cowos) market is forecasted to grow by USD 1402.3 mn during 2024-2029, accelerating at a CAGR of 9.4% during the forecast period. The report on the global chip-on-wafer-on-substrate (cowos) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by explosive demand from artificial intelligence and high performance computing, slowing of moores law and rise of heterogeneous integration, rapid expansion of data center infrastructure.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global chip-on-wafer-on-substrate (cowos) market is segmented as below:

By Technology

• CoWoS S
• CoWoS R
• CoWoS L

By Component

• GPU
• CPU
• FPGA
• Others

By End-User

• Cloud service providers
• Enterprises
• Government organizations
• Others

Geography

• APAC
  • Taiwan
  • South Korea
  • China
  • Japan
  • Singapore
  • Australia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • Italy
  • UK
  • The Netherlands
  • Spain
• South America
  • Brazil
  • Chile
  • Argentina
• Middle East and Africa
  • UAE
  • South Africa
  • Egypt
• Rest of World (ROW)

This study identifies the diversification of packaging solutions with organic substrates as one of the prime reasons driving the global chip-on-wafer-on-substrate (cowos) market growth during the next few years. Also, adoption of larger interposers and package sizes and evolution towards hybrid bonding and true 3d stacking will lead to sizable demand in the market.

The report on the global chip-on-wafer-on-substrate (cowos) market covers the following areas:

• Global chip-on-wafer-on-substrate (cowos) market sizing
• Global chip-on-wafer-on-substrate (cowos) market forecast
• Global chip-on-wafer-on-substrate (cowos) market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global chip-on-wafer-on-substrate (cowos) market vendors that include Advanced Micro Devices Inc., Alchip Technologies Ltd., Amkor Technology Inc., ASE Technology Holding Co. Ltd., GlobalFoundries, Intel Corp., Jiangsu Changdian Technology Co. Ltd., Micron Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd., Sanechips Co. Ltd., SK hynix Co. Ltd., Taiwan Semiconductor Co. Ltd., Tongfu Microelectronics Co., United Microelectronics Corp.. Also, the global chip-on-wafer-on-substrate (cowos) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Technology
  • Executive Summary - Chart on Market Segmentation by Component
  • Executive Summary - Chart on Market Segmentation by End-user
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2024
• 4.4 Market outlook: Forecast for 2024-2029

5 Historic Market Size

• 5.1 Global Chip-On-Wafer-On-Substrate (CoWoS) Market 2019 - 2023
  • Historic Market Size - Data Table on Global Chip-On-Wafer-On-Substrate (CoWoS) Market 2019 - 2023 ($ million)
• 5.2 Technology segment analysis 2019 - 2023
  • Historic Market Size - Technology Segment 2019 - 2023 ($ million)
• 5.3 Component segment analysis 2019 - 2023
  • Historic Market Size - Component Segment 2019 - 2023 ($ million)
• 5.4 End-user segment analysis 2019 - 2023
  • Historic Market Size - End-user Segment 2019 - 2023 ($ million)
• 5.5 Geography segment analysis 2019 - 2023
  • Historic Market Size - Geography Segment 2019 - 2023 ($ million)
• 5.6 Country segment analysis 2019 - 2023
  • Historic Market Size - Country Segment 2019 - 2023 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI in global chip-on-wafer-on-substrate (CoWoS) market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2024 and 2029
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2024 and 2029
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2024 and 2029
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2024 and 2029
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2024 and 2029
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2024 and 2029
• 7.7 Market condition

8 Market Segmentation by Technology

• 8.1 Market segments
• 8.2 Comparison by Technology
• 8.3 CoWoS S - Market size and forecast 2024-2029
• 8.4 CoWoS R - Market size and forecast 2024-2029
• 8.5 CoWoS L - Market size and forecast 2024-2029
• 8.6 Market opportunity by Technology
  • Market opportunity by Technology ($ million)

9 Market Segmentation by Component

• 9.1 Market segments
• 9.2 Comparison by Component
• 9.3 GPU - Market size and forecast 2024-2029
• 9.4 CPU - Market size and forecast 2024-2029
• 9.5 FPGA - Market size and forecast 2024-2029
• 9.6 Others - Market size and forecast 2024-2029
• 9.7 Market opportunity by Component
  • Market opportunity by Component ($ million)

10 Market Segmentation by End-user

• 10.1 Market segments
• 10.2 Comparison by End-user
• 10.3 Cloud service providers - Market size and forecast 2024-2029
• 10.4 Enterprises - Market size and forecast 2024-2029
• 10.5 Government organizations - Market size and forecast 2024-2029
• 10.6 Others - Market size and forecast 2024-2029
• 10.7 Market opportunity by End-user
  • Market opportunity by End-user ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2024-2029
  • 12.3.1 Taiwan - Market size and forecast 2024-2029
  • 12.3.2 South Korea - Market size and forecast 2024-2029
  • 12.3.3 China - Market size and forecast 2024-2029
  • 12.3.4 Japan - Market size and forecast 2024-2029
  • 12.3.5 Singapore - Market size and forecast 2024-2029
  • 12.3.6 Australia - Market size and forecast 2024-2029
• 12.4 North America - Market size and forecast 2024-2029
  • 12.4.1 US - Market size and forecast 2024-2029
  • 12.4.2 Canada - Market size and forecast 2024-2029
  • 12.4.3 Mexico - Market size and forecast 2024-2029
• 12.5 Europe - Market size and forecast 2024-2029
  • 12.5.1 Germany - Market size and forecast 2024-2029
  • 12.5.2 France - Market size and forecast 2024-2029
  • 12.5.3 Italy - Market size and forecast 2024-2029
  • 12.5.4 UK - Market size and forecast 2024-2029
  • 12.5.5 The Netherlands - Market size and forecast 2024-2029
  • 12.5.6 Spain - Market size and forecast 2024-2029
• 12.6 South America - Market size and forecast 2024-2029
  • 12.6.1 Brazil - Market size and forecast 2024-2029
  • 12.6.2 Chile - Market size and forecast 2024-2029
  • 12.6.3 Argentina - Market size and forecast 2024-2029
• 12.7 Middle East and Africa - Market size and forecast 2024-2029
  • 12.7.1 Israel - Market size and forecast 2024-2029
  • 12.7.2 UAE - Market size and forecast 2024-2029
  • 12.7.3 Saudi Arabia - Market size and forecast 2024-2029
  • 12.7.4 South Africa - Market size and forecast 2024-2029
  • 12.7.5 Egypt - Market size and forecast 2024-2029
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Explosive demand from artificial intelligence and high performance computing
  • Slowing of Moores law and rise of heterogeneous integration
  • Rapid expansion of data center infrastructure
• 13.2 Market challenges
  • Limited production capacity and supply chain bottlenecks
  • High manufacturing cost and complexity
  • Thermal management and power delivery challenges
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2024 and 2029
• 13.4 Market opportunities
  • Diversification of packaging solutions with organic substrates
  • Adoption of larger interposers and package sizes
  • Evolution towards hybrid bonding and true 3D stacking

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 Advanced Micro Devices Inc.
  • Advanced Micro Devices Inc. - Overview
  • Advanced Micro Devices Inc. - Business segments
  • Advanced Micro Devices Inc. - Key news
  • Advanced Micro Devices Inc. - Key offerings
  • Advanced Micro Devices Inc. - Segment focus
  • SWOT
• 15.5 Alchip Technologies Ltd.
  • Alchip Technologies Ltd. - Overview
  • Alchip Technologies Ltd. - Product / Service
  • Alchip Technologies Ltd. - Key offerings
  • SWOT
• 15.6 Amkor Technology Inc.
  • Amkor Technology Inc. - Overview
  • Amkor Technology Inc. - Business segments
  • Amkor Technology Inc. - Key news
  • Amkor Technology Inc. - Key offerings
  • Amkor Technology Inc. - Segment focus
  • SWOT
• 15.7 ASE Technology Holding Co. Ltd.
  • ASE Technology Holding Co. Ltd. - Overview
  • ASE Technology Holding Co. Ltd. - Business segments
  • ASE Technology Holding Co. Ltd. - Key offerings
  • ASE Technology Holding Co. Ltd. - Segment focus
  • SWOT
• 15.8 GlobalFoundries
  • GlobalFoundries - Overview
  • GlobalFoundries - Product / Service
  • GlobalFoundries - Key offerings
  • SWOT
• 15.9 Intel Corp.
  • Intel Corp. - Overview
  • Intel Corp. - Business segments
  • Intel Corp. - Key news
  • Intel Corp. - Key offerings
  • Intel Corp. - Segment focus
  • SWOT
• 15.10 Jiangsu Changdian Technology Co. Ltd.
  • Jiangsu Changdian Technology Co. Ltd. - Overview
  • Jiangsu Changdian Technology Co. Ltd. - Product / Service
  • Jiangsu Changdian Technology Co. Ltd. - Key offerings
  • SWOT
• 15.11 Micron Technology Inc.
  • Micron Technology Inc. - Overview
  • Micron Technology Inc. - Business segments
  • Micron Technology Inc. - Key news
  • Micron Technology Inc. - Key offerings
  • Micron Technology Inc. - Segment focus
  • SWOT
• 15.12 Powertech Technology Inc.
  • Powertech Technology Inc. - Overview
  • Powertech Technology Inc. - Business segments
  • Powertech Technology Inc. - Key offerings
  • Powertech Technology Inc. - Segment focus
  • SWOT
• 15.13 Samsung Electronics Co. Ltd.
  • Samsung Electronics Co. Ltd. - Overview
  • Samsung Electronics Co. Ltd. - Business segments
  • Samsung Electronics Co. Ltd. - Key news
  • Samsung Electronics Co. Ltd. - Key offerings
  • Samsung Electronics Co. Ltd. - Segment focus
  • SWOT
• 15.14 Sanechips Co. Ltd.
  • Sanechips Co. Ltd. - Overview
  • Sanechips Co. Ltd. - Product / Service
  • Sanechips Co. Ltd. - Key offerings
  • SWOT
• 15.15 SK hynix Co. Ltd.
  • SK hynix Co. Ltd. - Overview
  • SK hynix Co. Ltd. - Product / Service
  • SK hynix Co. Ltd. - Key news
  • SK hynix Co. Ltd. - Key offerings
  • SWOT
• 15.16 Taiwan Semiconductor Co. Ltd.
  • Taiwan Semiconductor Co. Ltd. - Overview
  • Taiwan Semiconductor Co. Ltd. - Product / Service
  • Taiwan Semiconductor Co. Ltd. - Key news
  • Taiwan Semiconductor Co. Ltd. - Key offerings
  • SWOT
• 15.17 Tongfu Microelectronics Co.
  • Tongfu Microelectronics Co. - Overview
  • Tongfu Microelectronics Co. - Product / Service
  • Tongfu Microelectronics Co. - Key offerings
  • SWOT
• 15.18 United Microelectronics Corp.
  • United Microelectronics Corp. - Overview
  • United Microelectronics Corp. - Product / Service
  • United Microelectronics Corp. - Key offerings
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations