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市場調查報告書
商品編碼
1790004
美國有機基板包裝材料市場規模、佔有率和趨勢分析報告:按技術、應用和細分市場預測,2025-2033 年U.S. Organic Substrate Packaging Material Market Size, Share & Trends Analysis Report By Technology (SO Packages, GA Packages, Flat No-leads Packages), By Application (Consumer Electronics, Automotive), And Segment Forecasts, 2025 - 2033 |
美國有機基板包裝材料市場摘要
美國有機基板包裝材料市場規模預計在 2024 年為 21.6 億美元,預計到 2033 年將達到 36.2 億美元,2025 年至 2033 年的複合年成長率為 5.9%。電子和半導體應用的激增,尤其是在電動車、自動駕駛汽車、資料中心晶片和電子商務包裝需求的推動下,有利於永續基板並推動市場成長。
有機基板封裝材料市場的主要驅動力之一是對先進半導體封裝技術(例如系統級封裝(SiP)、覆晶和扇出晶圓層次電子構裝(FOWLP))不斷成長的需求。這些先進技術需要能夠支援更高 I/O 密度、小型化和高速訊號傳輸的高性能基板。有機基板主要由樹脂塗層銅、BT 樹脂和味之素積層製造膜 (ABF) 製成,已成為下一代晶片組經濟高效且可靠的解決方案。例如,隨著 5G基地台和 AI 加速器的不斷擴展部署,三星和英特爾等公司擴大採用有機基板進行晶片封裝。
此外,消費性電子產品和行動裝置(尤其是在新興市場)的快速成長,正在推動有機基板市場的擴張。智慧型手機、平板電腦、穿戴式裝置和智慧家庭技術等裝置擴大整合更小、更複雜的積體電路,需要高層數位有機基板。隨著蘋果繼續整合其M系列晶片等客製化SoC,以及安卓製造商專注於支援人工智慧的處理器,對緊湊、耐熱且經濟高效的基板材料的需求持續成長。這些趨勢正在推動基板製造商擴大產能並投資於ABF等先進材料。
汽車電子產業也是一個主要的成長領域,尤其是在向電動車 (EV) 和高級駕駛輔助系統 (ADAS) 轉型的過程中。汽車應用需要堅固、熱穩定且可靠的基板,這使得有機基板非常適合用於電控系統(ECU)、電池管理系統和資訊娛樂系統。主要的汽車原始設備製造商 (OEM) 和一級供應商正擴大與半導體封裝公司合作,以獲取專為惡劣環境設計的有機基板。博世和大陸集團等公司正專注於電動車動力傳動系統電子設備和自動駕駛系統,從而推動需求成長,間接加速了有機基板市場的成長。
U.S. Organic Substrate Packaging Material Market Summary
The U.S. organic substrate packaging material market size was estimated at USD 2.16 billion in 2024 and is expected to reach USD 3.62 billion by 2033, growing at a CAGR of 5.9% from 2025 to 2033. Surging electronics and semiconductor applications, especially due to EVs, autonomous vehicles, data center chips, and e commerce packaging needs that favor sustainable substrates, thus driving the market growth.
One of the primary drivers of the organic substrate packaging material market is the growing demand for advanced semiconductor packaging technologies such as System-in-Package (SiP), Flip Chip, and Fan-Out Wafer Level Packaging (FOWLP). These advanced technologies demand high-performance substrates capable of supporting greater I/O densities, miniaturization, and faster signal transmission. Organic substrates-primarily composed of resin-coated copper, BT resin, and Ajinomoto Build-up Film (ABF) have emerged as a cost-effective and reliable solution for next-generation chipsets. For example, the growing deployment of 5G base stations and AI accelerators has led companies like Samsung and Intel to increasingly adopt organic substrates for multi-die packaging.
Furthermore, the rapid growth of consumer electronics and mobile devices, particularly in emerging markets, is driving the expansion of the organic substrate market. Devices such as smartphones, tablets, wearables, and smart home technologies are incorporating increasingly compact and complex integrated circuits, necessitating high-layer-count organic substrates. As Apple continues to integrate custom SoCs like the M-series chips and Android manufacturers focus on AI-enabled processors, the demand for compact, thermally resilient, and cost-efficient substrate materials continues to rise. These trends are compelling substrate manufacturers to expand production capacity and invest in advanced materials like ABF.
The automotive electronics sector also represents a major growth area, especially with the shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS). Automotive applications require substrates that are robust, thermally stable, and reliable-making organic substrates well-suited for use in Electronic Control Units (ECUs), battery management systems, and infotainment systems. Leading automotive OEMs and Tier-1 suppliers are increasingly collaborating with semiconductor packaging firms to obtain organic substrates designed for demanding environments. Companies such as Bosch and Continental are helping to propel demand by focusing on EV powertrain electronics and autonomous driving systems, thereby indirectly accelerating growth in the organic substrate market.
U.S. Organic Substrate Packaging Material Market Report Segmentation
This report forecasts revenue growth at the country level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. organic substrate packaging material market report based on technology, and application: