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市場調查報告書
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1790004

美國有機基板包裝材料市場規模、佔有率和趨勢分析報告:按技術、應用和細分市場預測,2025-2033 年

U.S. Organic Substrate Packaging Material Market Size, Share & Trends Analysis Report By Technology (SO Packages, GA Packages, Flat No-leads Packages), By Application (Consumer Electronics, Automotive), And Segment Forecasts, 2025 - 2033

出版日期: | 出版商: Grand View Research | 英文 120 Pages | 商品交期: 2-10個工作天內

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美國有機基板包裝材料市場摘要

美國有機基板包裝材料市場規模預計在 2024 年為 21.6 億美元,預計到 2033 年將達到 36.2 億美元,2025 年至 2033 年的複合年成長率為 5.9%。電子和半導體應用的激增,尤其是在電動車、自動駕駛汽車、資料中心晶片和電子商務包裝需求的推動下,有利於永續基板並推動市場成長。

有機基板封裝材料市場的主要驅動力之一是對先進半導體封裝技術(例如系統級封裝(SiP)、覆晶和扇出晶圓層次電子構裝(FOWLP))不斷成長的需求。這些先進技術需要能夠支援更高 I/O 密度、小型化和高速訊號傳輸的高性能基板。有機基板主要由樹脂塗層銅、BT 樹脂和味之素積層製造膜 (ABF) 製成,已成為下一代晶片組經濟高效且可靠的解決方案。例如,隨著 5G基地台和 AI 加速器的不斷擴展部署,三星和英特爾等公司擴大採用有機基板進行晶片封裝。

此外,消費性電子產品和行動裝置(尤其是在新興市場)的快速成長,正在推動有機基板市場的擴張。智慧型手機、平板電腦、穿戴式裝置和智慧家庭技術等裝置擴大整合更小、更複雜的積體電路,需要高層數位有機基板。隨著蘋果繼續整合其M系列晶片等客製化SoC,以及安卓製造商專注於支援人工智慧的處理器,對緊湊、耐熱且經濟高效的基板材料的需求持續成長。這些趨勢正在推動基板製造商擴大產能並投資於ABF等先進材料。

汽車電子產業也是一個主要的成長領域,尤其是在向電動車 (EV) 和高級駕駛輔助系統 (ADAS) 轉型的過程中。汽車應用需要堅固、熱穩定且可靠的基板,這使得有機基板非常適合用於電控系統(ECU)、電池管理系統和資訊娛樂系統。主要的汽車原始設備製造商 (OEM) 和一級供應商正擴大與半導體封裝公司合作,以獲取專為惡劣環境設計的有機基板。博世和大陸集團等公司正專注於電動車動力傳動系統電子設備和自動駕駛系統,從而推動需求成長,間接加速了有機基板市場的成長。

目錄

第1章調查方法與範圍

第2章執行摘要

第3章美國有機基板包裝材料市場變數、趨勢與範圍

  • 市場體系展望
    • 母市場展望
    • 相關的市場前景
  • 滲透和成長前景圖
  • 產業價值鏈分析
  • 法律規範
  • 市場動態
    • 市場促進因素分析
    • 市場限制因素分析
    • 市場機會分析
    • 市場問題分析
  • 商業環境分析
    • 波特五力分析
    • PESTEL分析

第4章:美國有機基板包裝材料市場:技術評估與趨勢分析

  • 關鍵要點
  • 2024年及2033年技術變革分析及市場佔有率
    • SO包
    • 通航套餐
    • 扁平無引線封裝
    • 其他

第5章:美國有機基板包裝材料市場:應用評估與趨勢分析

  • 關鍵要點
  • 2024 年及 2033 年應用趨勢分析及市場佔有率
    • 家電
    • 製造業
    • 衛生保健
    • 其他

第6章 競爭態勢

  • 主要企業、最新發展及其對該產業的影響
  • 公司分類
  • 企業市場分析
  • 公司熱圖分析
  • 戰略地圖
    • 擴張
    • 合併與收購
    • 合作
    • 發布新應用程式
    • 其他

第7章 公司列表(概述、財務表現、應用概述)

  • Amkor Technology Inc
  • Kyocera Corporation
  • Microchip Technology Inc.
  • Texas Instruments Incorporated
  • Simmtech Co., Ltd
  • Onto Innovation Inc.
  • LG Innotek Co.Ltd
  • AT&S
  • Daeduck Electronics Co.,Ltd
Product Code: GVR-4-68040-652-8

U.S. Organic Substrate Packaging Material Market Summary

The U.S. organic substrate packaging material market size was estimated at USD 2.16 billion in 2024 and is expected to reach USD 3.62 billion by 2033, growing at a CAGR of 5.9% from 2025 to 2033. Surging electronics and semiconductor applications, especially due to EVs, autonomous vehicles, data center chips, and e commerce packaging needs that favor sustainable substrates, thus driving the market growth.

One of the primary drivers of the organic substrate packaging material market is the growing demand for advanced semiconductor packaging technologies such as System-in-Package (SiP), Flip Chip, and Fan-Out Wafer Level Packaging (FOWLP). These advanced technologies demand high-performance substrates capable of supporting greater I/O densities, miniaturization, and faster signal transmission. Organic substrates-primarily composed of resin-coated copper, BT resin, and Ajinomoto Build-up Film (ABF) have emerged as a cost-effective and reliable solution for next-generation chipsets. For example, the growing deployment of 5G base stations and AI accelerators has led companies like Samsung and Intel to increasingly adopt organic substrates for multi-die packaging.

Furthermore, the rapid growth of consumer electronics and mobile devices, particularly in emerging markets, is driving the expansion of the organic substrate market. Devices such as smartphones, tablets, wearables, and smart home technologies are incorporating increasingly compact and complex integrated circuits, necessitating high-layer-count organic substrates. As Apple continues to integrate custom SoCs like the M-series chips and Android manufacturers focus on AI-enabled processors, the demand for compact, thermally resilient, and cost-efficient substrate materials continues to rise. These trends are compelling substrate manufacturers to expand production capacity and invest in advanced materials like ABF.

The automotive electronics sector also represents a major growth area, especially with the shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS). Automotive applications require substrates that are robust, thermally stable, and reliable-making organic substrates well-suited for use in Electronic Control Units (ECUs), battery management systems, and infotainment systems. Leading automotive OEMs and Tier-1 suppliers are increasingly collaborating with semiconductor packaging firms to obtain organic substrates designed for demanding environments. Companies such as Bosch and Continental are helping to propel demand by focusing on EV powertrain electronics and autonomous driving systems, thereby indirectly accelerating growth in the organic substrate market.

U.S. Organic Substrate Packaging Material Market Report Segmentation

This report forecasts revenue growth at the country level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. organic substrate packaging material market report based on technology, and application:

  • Technology Outlook (Revenue, USD Million 2021 - 2033)
  • SO packages
  • GA packages
  • Flat no-leads packages
  • Others
  • Application Outlook (Revenue, USD Million 2021 - 2033)
  • Consumer Electronics
  • Automotive
  • Manufacturing
  • Healthcare
  • Others

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Research Methodology
    • 1.1.1. Market Segmentation
    • 1.1.2. Market Definition
  • 1.2. Research Scope & Assumptions
  • 1.3. Information Procurement
    • 1.3.1. Purchased Database
    • 1.3.2. GVR's Internal Database
    • 1.3.3. Secondary Sources & Third-Party Perspectives
    • 1.3.4. Primary Research
  • 1.4. Information Analysis
    • 1.4.1. Data Analysis Models
  • 1.5. Market Formulation & Data Visualization
  • 1.6. Data Validation & Publishing
  • 1.7. List of Abbreviations

Chapter 2. Executive Summary

  • 2.1. Market Snapshot, 2024 (USD Million)
  • 2.2. Segmental Snapshot
  • 2.3. Competitive Landscape Snapshot

Chapter 3. U.S. Organic Substrate Packaging Material Market Variables, Trends, and Scope

  • 3.1. Market Lineage Outlook
    • 3.1.1. Parent Market Outlook
    • 3.1.2. Relatable Market Outlook
  • 3.2. Penetration & Growth Prospect Mapping
  • 3.3. Industry Value Chain Analysis
  • 3.4. Regulatory Framework
  • 3.5. Market Dynamics
    • 3.5.1. Market Driver Analysis
    • 3.5.2. Market Restraint Analysis
    • 3.5.3. Market Opportunity Analysis
    • 3.5.4. Market Challenge Analysis
  • 3.6. Business Environment Analysis
    • 3.6.1. Porter's Five Forces Analysis
    • 3.6.2. PESTEL Analysis

Chapter 4. U.S. Organic Substrate Packaging Material Market: Technology Estimates & Trend Analysis

  • 4.1. Key Takeaways
  • 4.2. Technology Movement Analysis & Market Share, 2024 & 2033
    • 4.2.1. SO packages
      • 4.2.1.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 4.2.2. GA packages
      • 4.2.2.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 4.2.3. Flat no-leads packages
      • 4.2.3.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 4.2.4. Others
      • 4.2.4.1. Market estimates and forecasts, 2021 - 2033 (USD Million)

Chapter 5. U.S. Organic Substrate Packaging Material Market: Application Estimates & Trend Analysis

  • 5.1. Key Takeaways
  • 5.2. Application Movement Analysis & Market Share, 2024 & 2033
    • 5.2.1. Consumer Electronics
      • 5.2.1.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 5.2.2. Automotive
      • 5.2.2.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 5.2.3. Manufacturing
      • 5.2.3.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 5.2.4. Healthcare
      • 5.2.4.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
    • 5.2.5. Others
      • 5.2.5.1. Market estimates and forecasts, 2021 - 2033 (USD Million)

Chapter 6. Competitive Landscape

  • 6.1. Key Players & Recent Developments & Their Impact on the Industry
  • 6.2. Company Categorization
  • 6.3. Company Market Position Analysis
  • 6.4. Company Heat Map Analysis
  • 6.5. Strategy Mapping
    • 6.5.1. Expansions
    • 6.5.2. Mergers & Acquisitions
    • 6.5.3. Collaborations
    • 6.5.4. New Application Launches
    • 6.5.5. Others

Chapter 7. Company Listing (Overview, Financial Performance, Applications Overview)

  • 7.1. Amkor Technology Inc
  • 7.2. Kyocera Corporation
  • 7.3. Microchip Technology Inc.
  • 7.4. Texas Instruments Incorporated
  • 7.5. Simmtech Co., Ltd
  • 7.6. Onto Innovation Inc.
  • 7.7. LG Innotek Co.Ltd
  • 7.8. AT&S
  • 7.9. Daeduck Electronics Co.,Ltd

List of Tables

  • Table 1 U.S. Organic Substrate Packaging Material market estimates and forecasts, by Technology, 2021 - 2033 (USD Million)
  • Table 2 U.S. Organic Substrate Packaging Material market estimates and forecasts, by SO packages, 2021 - 2033 (USD Million)
  • Table 3 U.S. Organic Substrate Packaging Material market estimates and forecasts, by GA packages, 2021 - 2033 (USD Million)
  • Table 4 U.S. Organic Substrate Packaging Material market estimates and forecasts, by Flat no-leads packages, 2021 - 2033 (USD Million)
  • Table 5 U.S. Organic Substrate Packaging Material market estimates and forecasts, by Other Containers & Accessories, 2021 - 2033 (USD Million)
  • Table 6 U.S. Organic Substrate Packaging Material market estimates and forecasts, by Application, 2021 - 2033 (USD Million)
  • Table 7 U.S. Organic Substrate Packaging Material market estimates and forecasts, in Consumer Electronics, 2021 - 2033 (USD Million)
  • Table 8 U.S. Organic Substrate Packaging Material market estimates and forecasts, in Automotive, 2021 - 2033 (USD Million)
  • Table 9 U.S. Organic Substrate Packaging Material market estimates and forecasts, in Manufacturing, 2021 - 2033 (USD Million)
  • Table 10 U.S. Organic Substrate Packaging Material market estimates and forecasts, in Healthcare, 2021 - 2033 (USD Million)
  • Table 11 U.S. Organic Substrate Packaging Material market estimates and forecasts, in Others, 2021 - 2033 (USD Million)

List of Figures

  • Fig. 1 Information Procurement
  • Fig. 2 Primary Research Pattern
  • Fig. 3 Primary Research Process
  • Fig. 4 Market Research Approaches - Bottom-Up Approach
  • Fig. 5 Market Research Approaches - Top-Down Approach
  • Fig. 6 Market Research Approaches - Combined Approach
  • Fig. 7 U.S. Organic Substrate Packaging Material Market- Market Snapshot
  • Fig. 8 U.S. Organic Substrate Packaging Material Market- Segment Snapshot (1/2)
  • Fig. 9 U.S. Organic Substrate Packaging Material Market- Segment Snapshot (2/2)
  • Fig. 10 U.S. Organic Substrate Packaging Material Market- Competitive Landscape Snapshot
  • Fig. 11 U.S. Organic Substrate Packaging Material Market: Penetration & Growth Prospect Mapping
  • Fig. 12 U.S. Organic Substrate Packaging Material Market: Value Chain Analysis
  • Fig. 13 U.S. Organic Substrate Packaging Material Market: Porter's Five Force Analysis
  • Fig. 14 U.S. Organic Substrate Packaging Material Market: PESTEL Analysis
  • Fig. 15 U.S. Organic Substrate Packaging Material Market: Technology Movement Analysis, 2024 & 2033
  • Fig. 16 U.S. Organic Substrate Packaging Material Market: Application Movement Analysis, 2024 & 2033
  • Fig. 17 U.S. Organic Substrate Packaging Material Market: Key Company Categorization
  • Fig. 18 U.S. Organic Substrate Packaging Material Market: Company Positioning Analysis
  • Fig. 19 U.S. Organic Substrate Packaging Material Market: Company Heat Map Analysis
  • Fig. 20 U.S. Organic Substrate Packaging Material Market: Strategy Mapping