Product Code: GVR-4-68040-421-9
Die Bonder Equipment Market Size & Trends:
The global die bonder equipment market size was estimated at USD 1.88 billion in 2024 and is projected to grow at a CAGR of 3.6% from 2025 to 2030. The market is currently experiencing robust growth, attributed largely to the increasing demand for semiconductor devices across various industries, including automotive, consumer electronics, and IT & telecommunications. This surge in demand is fueled by ongoing technological advancements and the growing need for high-performance and miniaturized electronic components. As devices become more integrated and complex, the precision and efficiency offered by die bonder equipment become crucial, driving manufacturers to invest in the latest technologies to stay competitive.
Advancements in die bonding technologies, such as the development of automated and semi-automated systems, are significantly contributing to the market's growth. These technologies not only improve the throughput and accuracy of the die bonding process but also reduce the likelihood of human error, ensuring higher product reliability. Furthermore, the push for electric vehicles and the expansion of 5G networks globally are creating substantial opportunities for die bonder equipment manufacturers, as these sectors require sophisticated semiconductors produced with high-precision equipment.
Die bonder equipment varies significantly in terms of precision, speed, and bonding techniques to meet the diverse needs of different semiconductor devices and applications. It is a sophisticated piece of machinery designed to handle the delicate process of placing and securing dies, requiring precision alignment and bonding capabilities to ensure high yields and reliability of the final electronic component.
The exponential growth of the market is fueled by the escalating demand for semiconductor devices across diverse sectors, including automotive, consumer electronics, and healthcare. This surge is significantly attributed to technological advancements, such as the fabrication of intricate microelectronic devices, the ongoing trend of component miniaturization, and the introduction of 5G technology, all of which necessitate refined die bonding techniques. Moreover, the shift towards automation and the incorporation of artificial intelligence in manufacturing processes underscore the need for more sophisticated, efficient, and precise die bonder equipment, bolstering the market's expansion.
With the rapid expansion of the Internet of Things (IoT), wearable technology, and smart devices, there is a significant opportunity for the market to expand its reach. The automotive industry, with its increasing focus on electric vehicles (EVs) and autonomous vehicles, presents another lucrative segment for growth. These sectors require high reliability and quality in semiconductor devices, which can only be achieved with advanced packaging technologies, thereby creating opportunities for innovations and advancements in die-bonding equipment. In addition, the push towards renewable energy and power electronics offers new avenues for the application of die-bonding technology.
Global Die Bonder Equipment Market Report Segmentation
This report forecasts revenue growth at global, regional, and country levels and analyzes the latest industry trends in each sub-segment from 2018 to 2030. For this study, Grand View Research has segmented the global die bonder equipment market report based on type, bonding technique, application, and region:
- Type Outlook (Revenue, USD Million, 2018 - 2030)
- Manual Die Bonders
- Semiautomatic Die Bonders
- Automatic Die Bonders
- Bonding Technique Outlook (Revenue, USD Million, 2018 - 2030)
- Epoxy
- Eutectic
- UV
- Others
- Application Outlook (Revenue, USD Million, 2018 - 2030)
- Consumer Electronics
- Automotive
- Industrial
- Telecommunications
- Others
- Regional Outlook (Revenue, USD Million, 2018 - 2030)
- North America
- Europe
- Germany
- France
- Italy
- Spain
- UK
- Asia Pacific
- China
- India
- Japan
- South Korea
- Australia
- Latin America
- Middle East and Africa
- Saudi Arabia
- UAE
- South Africa
Table of Contents
Chapter 1. Methodology and Scope
- 1.1. Market Segmentation & Scope
- 1.2. Market Definition
- 1.3. Information Procurement
- 1.3.1. Purchased Database
- 1.3.2. GVR's Internal Database
- 1.3.3. Secondary Sources & Third-Party Perspectives
- 1.3.4. Primary Research
- 1.4. Information Analysis
- 1.4.1. Data Analysis Models
- 1.5. Market Formulation & Data Visualization
- 1.6. Data Validation & Publishing
Chapter 2. Executive Summary
- 2.1. Market Snapshot
- 2.2. Segment Snapshot
- 2.3. Competitive Landscape Snapshot
Chapter 3. Die Bonder Equipment Market Variables, Trends & Scope
- 3.1. Market Lineage Outlook
- 3.1.1. Parent Market Outlook
- 3.1.2. Related Market Outlook
- 3.2. Industry Value Chain Analysis
- 3.3. Regulatory Framework
- 3.4. Market Dynamics
- 3.4.1. Market Driver Analysis
- 3.4.2. Market Restraint Analysis
- 3.4.3. Industry Challenges
- 3.4.4. Industry Opportunities
- 3.5. Industry Analysis Tools
- 3.5.1. Porter's Five Forces Analysis
- 3.5.2. Macro-environmental Analysis
Chapter 4. Die Bonder Equipment Market: Type Estimates & Trend Analysis
- 4.1. Segment Dashboard
- 4.2. Die Bonder Equipment Market: Type Movement Analysis & Market Share, 2024 & 2030
- 4.3. Manual Die Bonders
- 4.3.1. Manual Die Bonders Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 4.4. Semiautomatic Die Bonders
- 4.4.1. Semiautomatic Die Bonders Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 4.5. Automatic Die Bonders
- 4.5.1. Automatic Die Bonders Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 5. Die Bonder Equipment Market: Bonding Technique Estimates & Trend Analysis
- 5.1. Segment Dashboard
- 5.2. Die Bonder Equipment Market: Bonding Technique Movement Analysis & Market Share, 2024 & 2030
- 5.3. Epoxy
- 5.3.1. Epoxy Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 5.4. Eutectic
- 5.4.1. Eutectic Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 5.5. UV
- 5.5.1. UV Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 5.6. Others
- 5.6.1. Others Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 6. Die Bonder Equipment Market: Application Estimates & Trend Analysis
- 6.1. Segment Dashboard
- 6.2. Die Bonder Equipment Market: Application Movement Analysis & Market Share, 2024 & 2030
- 6.3. Consumer Electronics
- 6.3.1. Consumer Electronics Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.4. Automotive
- 6.4.1. Automotive Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.5. Industrial
- 6.5.1. Industrial Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.6. Telecommunications
- 6.6.1. Telecommunications Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.7. Others
- 6.7.1. Others Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 7. Die Bonder Equipment Market: Regional Estimates & Trend Analysis
- 7.1. Regional Movement Analysis & Market Share, 2024 & 2030
- 7.2. North America
- 7.2.1. North America Chemical Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.2.2. U.S.
- 7.2.2.1. Key Country Dynamics
- 7.2.2.2. U.S. Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.2.3. Canada
- 7.2.3.1. Key Country Dynamics
- 7.2.3.2. Canada Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.2.4. Mexico
- 7.2.4.1. Key Country Dynamics
- 7.2.4.2. Mexico Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.3. Europe
- 7.3.1. Europe Chemical Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.3.2. Germany
- 7.3.2.1. Key Country Dynamics
- 7.3.2.2. Germany Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.3.3. France
- 7.3.3.1. Key Country Dynamics
- 7.3.3.2. France Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.3.4. Italy
- 7.3.4.1. Key Country Dynamics
- 7.3.4.2. Italy Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.3.5. Spain
- 7.3.5.1. Key Country Dynamics
- 7.3.5.2. Spain Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.3.6. UK
- 7.3.6.1. Key Country Dynamics
- 7.3.6.2. UK Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.4. Asia Pacific
- 7.4.1. Asia Pacific Chemical Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.4.2. China
- 7.4.2.1. Key Country Dynamics
- 7.4.2.2. China Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.4.3. India
- 7.4.3.1. Key Country Dynamics
- 7.4.3.2. India Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.4.4. Japan
- 7.4.4.1. Key Country Dynamics
- 7.4.4.2. Japan Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.4.5. South Korea
- 7.4.5.1. Key Country Dynamics
- 7.4.5.2. South Korea Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.4.6. Australia
- 7.4.6.1. Key Country Dynamics
- 7.4.6.2. Australia Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.5. Latin America
- 7.5.1. Latin America Chemical Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.5.2. Brazil
- 7.5.2.1. Key Country Dynamics
- 7.5.2.2. Brazil Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.5.3. Argentina
- 7.5.3.1. Key Country Dynamics
- 7.5.3.2. Argentina Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.6. Middle East & Africa
- 7.6.1. Middles East & Africa Chemical Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.6.2. Saudi Arabia
- 7.6.2.1. Key Country Dynamics
- 7.6.2.2. Saudi Arabia Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.6.3. UAE
- 7.6.3.1. Key Country Dynamics
- 7.6.3.2. UAE Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
- 7.6.4. South Africa
- 7.6.4.1. Key Country Dynamics
- 7.6.4.2. South Africa Die Bonder Equipment Market Estimates & Forecast, 2018 - 2030 (USD Million)
Chapter 8. Die Bonder Equipment Market - Competitive Landscape
- 8.1. Recent Developments & Impact Analysis, By Key Market Participants
- 8.2. Company Categorization
- 8.3. Company Heat Map/ Position Analysis, 2024
- 8.4. Strategy Mapping
- 8.4.1. Expansion
- 8.4.2. Mergers & Acquisition
- 8.4.3. Partnerships & Collaborations
- 8.4.4. New Type Launches
- 8.4.5. Research and Development
- 8.5. Company Profiles
- 8.5.1. MicroAssembly Technologies, Ltd.
- 8.5.1.1. Participant's Overview
- 8.5.1.2. Financial Performance
- 8.5.1.3. Product Benchmarking
- 8.5.1.4. Recent Developments
- 8.5.2. West*Bond, Inc.
- 8.5.2.1. Participant's Overview
- 8.5.2.2. Financial Performance
- 8.5.2.3. Product Benchmarking
- 8.5.2.4. Recent Developments
- 8.5.3. Kulicke & Soffa Industries
- 8.5.3.1. Participant's Overview
- 8.5.3.2. Financial Performance
- 8.5.3.3. Product Benchmarking
- 8.5.3.4. Recent Developments
- 8.5.4. TRESKY GmbH
- 8.5.4.1. Participant's Overview
- 8.5.4.2. Financial Performance
- 8.5.4.3. Product Benchmarking
- 8.5.4.4. Recent Developments
- 8.5.5. Shibuya Corporation
- 8.5.5.1. Participant's Overview
- 8.5.5.2. Financial Performance
- 8.5.5.3. Product Benchmarking
- 8.5.5.4. Recent Developments
- 8.5.6. ASM Pacific Technology
- 8.5.6.1. Participant's Overview
- 8.5.6.2. Financial Performance
- 8.5.6.3. Product Benchmarking
- 8.5.6.4. Recent Developments
- 8.5.7. Palomar Technologies
- 8.5.7.1. Participant's Overview
- 8.5.7.2. Financial Performance
- 8.5.7.3. Product Benchmarking
- 8.5.7.4. Recent Developments
- 8.5.8. Hybond Inc.
- 8.5.8.1. Participant's Overview
- 8.5.8.2. Financial Performance
- 8.5.8.3. Product Benchmarking
- 8.5.8.4. Recent Developments
- 8.5.9. MRSI Systems
- 8.5.9.1. Participant's Overview
- 8.5.9.2. Financial Performance
- 8.5.9.3. Product Benchmarking
- 8.5.9.4. Recent Developments
- 8.5.10. Finetech GmbH & Co. KG
- 8.5.10.1. Participant's Overview
- 8.5.10.2. Financial Performance
- 8.5.10.3. Product Benchmarking
- 8.5.10.4. Recent Developments
- 8.5.11. Besi
- 8.5.11.1. Participant's Overview
- 8.5.11.2. Financial Performance
- 8.5.11.3. Product Benchmarking
- 8.5.11.4. Recent Developments
- 8.5.12. ITEC
- 8.5.12.1. Participant's Overview
- 8.5.12.2. Financial Performance
- 8.5.12.3. Product Benchmarking
- 8.5.12.4. Recent Developments
- 8.5.13. SHINKAWA Electric Co., Ltd.
- 8.5.13.1. Participant's Overview
- 8.5.13.2. Financial Performance
- 8.5.13.3. Product Benchmarking
- 8.5.13.4. Recent Developments