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市場調查報告書
商品編碼
1765432

全球底部填充材料市場

Underfill Materials
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 273 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計到 2030 年全球底部填充市場規模將達到 6.488 億美元

全球底部填充材料市場規模預計在2024年為4.344億美元，預計到2030年將達到6.488億美元，在2024-2030年的分析期內，複合年成長率為6.9%。毛細管底部填充材料（CUF）是本報告分析的細分市場之一，預計其複合年成長率為7.5%，到分析期結束時將達到3.846億美元。無流動底部填充材料（NUF）細分市場在分析期間的複合年成長率預計為6.4%。

美國市場規模估計為 1.208 億美元，而中國市場預計複合年成長率為 6.4%

美國底部填充材料市場規模預計在2024年達到1.208億美元。作為世界第二大經濟體，中國預計在2024-2030年的分析期內實現6.4%的複合年成長率，並在2030年達到1億美元的市場規模。其他值得關注的區域市場包括日本和加拿大，預計在分析期間的複合年成長率分別為6.5%和5.5%。在歐洲，預計德國的複合年成長率為5.5%。

全球底部填充材料市場—關鍵趨勢與促進因素

為什麼底部填充材料在現代電子製造中如此重要？

底部填充材料在提高電子設備的性能、可靠性和使用壽命方面發揮著至關重要的作用，使其成為電子製造業的重要組成部分。但這些材料究竟是什麼呢？底部填充材料是專門的環氧樹脂或樹脂化合物，用於填充覆晶、球柵陣列 (BGA) 和晶片級封裝 (CSP) 組件中微晶片與其基板之間的空間。此過程稱為底部填充，可顯著增強焊點的機械完整性，保護焊點免受晶片和基板之間的熱膨脹不匹配而導致的應力和熱故障。隨著電子設備變得更小、更強大，對能夠承受機械衝擊、熱循環和濕氣侵入的堅固互連的需求呈指數級成長。底部填充材料能夠在整個微電子封裝中均勻分佈應力，已成為確保設備可靠性和性能的重要解決方案。

高密度電子封裝的快速發展和積體電路 (IC) 日益複雜的特性推動了底部填充材料的採用。隨著對更小、更輕、更強大設備的需求不斷成長，製造商依賴覆晶和 3D 封裝等先進封裝技術，這些技術需要底部填充材料來穩定結構，防止運行過程中發生翹曲和開裂。在智慧型手機、平板電腦、汽車電子產品和物聯網設備等機械穩定性和溫度控管至關重要的應用中，底部填充材料可幫助關鍵組件在惡劣條件下保持其功能。微型化和更高性能的趨勢進一步推動了市場成長，這給焊點帶來了額外的壓力，需要更先進的底部填充解決方案。隨著電子元件尺寸越來越小，功率密度越來越高，底部填充材料在提供結構支撐和增強散熱方面的作用變得更加突出。

技術進步如何影響底部填充材料的發展？

底部填充材料市場已取得重大技術進步，以滿足現代電子製造不斷發展的需求。但推動這些發展的關鍵創新是什麼呢？一項重大突破是低溫固化和高流動性底部填充材料的開發，這提高了底部填充工藝的簡易性和效率。傳統底部填充材料通常需要在高溫下長時間固化，這會導致敏感元件產生熱應力和翹曲。相較之下，固化溫度更低、流動更快的新配方使底部填充製程更加可控、更加高效，最大限度地降低了損壞精密基板的風險並縮短了週期時間。這些進步在涉及細間距元件和高密度互連的應用方面尤其有益，因為在這些應用中，底部填充的精確應用和均勻分佈至關重要。

此外，無流動底部填充材料的推出徹底改變了覆晶封裝組裝，它省去了傳統底部填充材料通常需要的單獨分配和固化步驟。無流動底部填充材料在晶片放置前直接應用於基板，並與回流焊接焊接製程同時固化。這項創新簡化了製造工作流程，減少了步驟並提高了生產效率。可返工底部填充材料的開發進一步擴展了這些材料的多功能性和適用性，因為這樣可以輕鬆移除和更換有缺陷的部件，而不會損壞基板。可返工底部填充材料在高成本組件中尤其有價值，例如用於航太、國防和通訊的組件，在這些組件中，零件的維修和再利用對於保持生產產量比率和降低總成本至關重要。這些技術進步推動了下一代底部填充材料的開發，這些材料不僅符合現代電子封裝的高成本要求，而且具有更大的靈活性和性能。

推動電子製造業採用底部填充材料的市場趨勢是什麼？

電子製造業中底部填充材料的採用受到多種新興市場趨勢的影響，這些趨勢反映了製造商和消費者不斷變化的優先考慮。最突出的趨勢之一是電子設備逐漸轉向更小、功能更多的設備。隨著消費性電子產品的不斷發展，對更小、更輕、處理能力更強、消費量更低的設備的需求日益成長。這一趨勢導致了覆晶和 3D 積體電路等先進封裝技術的廣泛採用，與傳統的引線鍵引線接合法方法相比，這些技術提供了更高的空間效率和性能。底部填充材料在這些封裝技術中發揮著至關重要的作用，它提供機械加固並保護精密焊點免受熱應力和機械應力的影響，從而提高整體設備可靠性。穿戴式裝置、可攜式醫療設備和物聯網設備等應用對小型化電子產品的需求不斷成長，這加速了底部填充材料在電子組件中的應用。

推動底部填充材料應用的另一個關鍵趨勢是車載電子設備日益複雜。隨著汽車互聯化、自動化和電氣化程度不斷提高，嵌入在車輛中的電控系統(ECU) 和感測器的數量呈指數級成長。這些組件在惡劣的環境條件下運行，包括劇烈的溫度變化、機械振動以及暴露在潮濕和化學物質中。底部填充材料廣泛用於汽車電子設備，以保護關鍵組件免受這些應力的影響，並確保長期可靠性和性能。電動車 (EV) 和自動駕駛系統的興起進一步推動了對能夠承受高功率密度並提供有效溫度控管的先進底部填充材料的需求。隨著汽車製造商不斷突破汽車技術的極限，底部填充材料正成為保護複雜電子系統完整性的重要元素。

哪些因素推動了全球底部填充材料市場的成長？

全球底部填充材料市場的成長受到多種因素的推動，包括電子封裝技術的進步、高可靠性應用的日益普及以及對電子設備小型化日益成長的需求。主要成長要素之一是覆晶和 3D 封裝技術的日益普及，以滿足對更小但更強大的電子設備的需求。這些先進的封裝解決方案在提高性能和功能的同時，需要堅固的底部填充材料來確保結構完整性和熱穩定性。隨著電子設備變得越來越小、越來越複雜，對能夠提供機械增強和溫度控管的高性能底部填充材料的需求變得越來越重要。家用電子電器、通訊和汽車電子等行業的擴張也促進了底部填充材料市場的成長，因為這些行業需要可靠的互連，能夠承受日常操作和環境暴露的嚴酷考驗。

底部填充材料也因其在航太、國防和醫療設備等高可靠性應用中日益廣泛的應用而成為主要的成長要素，因為在這些應用中，產品故障是不允許的。在這些行業中，底部填充材料用於提高關鍵電子組件的機械強度和可靠性，確保即使在惡劣條件下也能保持穩定的性能。電動車和自動駕駛技術的興起進一步增加了汽車產業對底部填充材料的需求，因為這些系統中的電子元件必須承受高功率負載和嚴苛的熱環境。此外，可返工和無流動底部填充材料的開發拓寬了其應用範圍，並降低了製造流程的成本和複雜性。這些材料在組件組裝和維修方面提供了更大的靈活性，對於希望最佳化產量比率和減少浪費的製造商來說，它們是一個相當吸引力的選擇。隨著技術進步不斷突破電子封裝的界限，全球底部填充材料市場預計將在技術創新、行業需求和不斷變化的應用需求的動態相互作用的推動下實現持續成長。

部分

應用（覆晶、球柵陣列 (BGA)、晶片級封裝 (CSP)）、產品類型（毛細管底部填充 (CUF)、無流動底部填充 (NUF)、模製底部填充 (MUF)）。

受訪公司範例

  • ELANTAS GmbH
  • Epoxy Technology, Inc.
  • HB Fuller Company
  • Henkel AG & Co. KGaA
  • Inkron Limited
  • MacDermid Alpha Electronics Solutions
  • NAMICS Corporation
  • NORDSON Corporation
  • Panasonic Industry Co., Ltd.
  • VIETNAM PROS TECHNOLOGY CO., LTD.

人工智慧整合

我們正在利用檢驗的專家內容和人工智慧工具來改變市場和競爭情報。

Global 特定產業SLM 的典型規範，而是建立了一個從全球專家收集的內容庫，其中包括視訊錄影、部落格、搜尋引擎研究以及大量的公司、產品/服務和市場數據。

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地、進出口狀況（成品和原始OEM）預測其競爭態勢的變化。這種複雜且多面向的市場動態預計將以多種方式影響競爭對手，包括銷貨成本成本 (COGS) 上升、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

目錄

第1章調查方法

第2章執行摘要

  • 市場概覽
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 其他地區

第4章 競賽

簡介目錄
Product Code: MCP16876

Global Underfill Materials Market to Reach US$648.8 Million by 2030

The global market for Underfill Materials estimated at US$434.4 Million in the year 2024, is expected to reach US$648.8 Million by 2030, growing at a CAGR of 6.9% over the analysis period 2024-2030. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is expected to record a 7.5% CAGR and reach US$384.6 Million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at 6.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$120.8 Million While China is Forecast to Grow at 6.4% CAGR

The Underfill Materials market in the U.S. is estimated at US$120.8 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$100.0 Million by the year 2030 trailing a CAGR of 6.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.5% and 5.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.

Global Underfill Materials Market - Key Trends & Growth Drivers Explored

Why Are Underfill Materials Crucial in Modern Electronics Manufacturing?

Underfill materials have become indispensable in the electronics manufacturing industry, serving a critical role in enhancing the performance, reliability, and longevity of electronic devices. But what exactly are these materials, and why are they so essential? Underfill materials are specialized epoxy or resin compounds used to fill the space between a microchip and its substrate in flip-chip, ball grid array (BGA), and chip-scale package (CSP) assemblies. This process, known as underfilling, significantly strengthens the mechanical integrity of solder joints, protecting them from stress and thermal-induced failures caused by mismatched thermal expansion between the chip and substrate. As electronic devices become increasingly miniaturized and powerful, the need for robust interconnects that can withstand mechanical shocks, thermal cycling, and moisture ingress has grown exponentially. Underfill materials, with their ability to distribute stress evenly across the microelectronic package, have emerged as a vital solution in ensuring device reliability and performance.

The adoption of underfill materials is driven by the rapid development of high-density electronic packages and the growing complexity of integrated circuits (ICs). As the demand for smaller, lighter, and more powerful devices increases, manufacturers are relying on advanced packaging technologies like flip-chip and 3D packaging, which necessitate the use of underfill materials to stabilize the structure and prevent warpage or cracking during operation. In applications such as smartphones, tablets, automotive electronics, and IoT devices, where mechanical stability and thermal management are crucial, underfill materials help maintain the functionality of critical components even under challenging conditions. The market’s growth is further propelled by the trend towards increased miniaturization and higher performance requirements, which place additional stress on solder joints and necessitate more advanced underfill solutions. As electronic components become smaller and their power density increases, the role of underfill materials in providing structural support and enhancing heat dissipation is becoming even more prominent.

How Are Technological Advancements Shaping the Development of Underfill Materials?

The underfill materials market has witnessed significant technological advancements aimed at meeting the evolving demands of modern electronics manufacturing. But what are the key innovations driving these developments? One major breakthrough is the development of low-temperature cure and high-flow underfill materials, which have enhanced the ease and efficiency of underfilling processes. Traditional underfill materials often required prolonged curing times at high temperatures, which could lead to thermal stress and warping in sensitive components. In contrast, new formulations with lower curing temperatures and faster flow characteristics enable a more controlled and efficient underfilling process, minimizing the risk of damage to delicate substrates and reducing cycle times. These advancements have been particularly beneficial in applications involving fine-pitch components and high-density interconnects, where precise application and uniform distribution of underfill are critical.

Additionally, the introduction of no-flow underfills has revolutionized the assembly of flip-chip packages by eliminating the separate dispensing and curing steps typically required in traditional underfilling. No-flow underfills are applied directly to the substrate before the placement of the chip, and they cure simultaneously with the reflow soldering process. This innovation simplifies the manufacturing workflow, reduces process steps, and enhances production efficiency. The development of reworkable underfill materials, which allow for the easy removal and replacement of defective components without damaging the substrate, has further expanded the versatility and applicability of these materials. Reworkable underfills are particularly valuable in high-cost assemblies, such as those used in aerospace, defense, and telecommunications, where component repair and reusability are essential for maintaining production yield and reducing overall costs. These technological advancements have enabled the development of next-generation underfill materials that meet the stringent requirements of modern electronic packaging while offering greater flexibility and performance.

What Market Trends Are Driving the Adoption of Underfill Materials in Electronics Manufacturing?

The adoption of underfill materials in the electronics manufacturing industry is being shaped by several emerging market trends that reflect the changing priorities of manufacturers and consumers alike. One of the most prominent trends is the increasing shift towards miniaturization and higher functionality in electronic devices. As consumer electronics continue to evolve, there is a growing need for compact, lightweight devices with enhanced processing power and reduced energy consumption. This trend has led to the widespread adoption of advanced packaging technologies, such as flip-chip and 3D integrated circuits, which provide greater space efficiency and performance compared to traditional wire-bonding methods. Underfill materials play a critical role in these packaging technologies by providing mechanical reinforcement, protecting delicate solder joints from thermal and mechanical stress, and enhancing overall device reliability. The growing demand for miniaturized electronics in applications such as wearable devices, portable medical equipment, and IoT devices has therefore accelerated the use of underfill materials in electronic assemblies.

Another significant trend driving the adoption of underfill materials is the increasing complexity of automotive electronics. As vehicles become more connected, automated, and electrified, the number of electronic control units (ECUs) and sensors integrated into vehicles has surged. These components operate under harsh environmental conditions, including wide temperature variations, mechanical vibrations, and exposure to moisture and chemicals. Underfill materials are being used extensively in automotive electronics to protect critical components from these stresses, ensuring long-term reliability and performance. The rise of electric vehicles (EVs) and autonomous driving systems has further increased the demand for advanced underfill materials that can withstand high power densities and provide effective thermal management. As automotive manufacturers continue to push the boundaries of vehicle technology, underfill materials are becoming an essential element in safeguarding the integrity of complex electronic systems.

What Factors Are Driving the Growth of the Global Underfill Materials Market?

The growth in the global underfill materials market is driven by several factors, including advancements in electronic packaging technologies, increased adoption in high-reliability applications, and the growing demand for miniaturized electronics. One of the primary growth drivers is the rising adoption of flip-chip and 3D packaging technologies in response to the need for more compact and powerful electronic devices. These advanced packaging solutions provide enhanced performance and functionality but also require robust underfill materials to ensure structural integrity and thermal stability. As electronic devices continue to shrink in size and increase in complexity, the need for high-performance underfill materials that can provide mechanical reinforcement and thermal management has become more critical. The expansion of industries such as consumer electronics, telecommunications, and automotive electronics has also contributed to the growth of the underfill materials market, as these sectors require reliable interconnects that can withstand the rigors of daily operation and environmental exposure.

Another key growth driver is the increasing use of underfill materials in high-reliability applications, such as aerospace, defense, and medical devices, where product failure is not an option. In these industries, underfill materials are used to enhance the mechanical robustness and reliability of critical electronic assemblies, ensuring consistent performance under extreme conditions. The rise of electric vehicles and autonomous driving technologies has further boosted the demand for underfill materials in the automotive sector, as electronic components in these systems must withstand high power loads and challenging thermal environments. Moreover, the development of reworkable and no-flow underfill materials has expanded their applicability and reduced the cost and complexity of manufacturing processes. These materials offer greater flexibility in component assembly and repair, making them an attractive choice for manufacturers looking to optimize production yields and reduce waste. As technological advancements continue to push the boundaries of electronic packaging, the global underfill materials market is poised for sustained growth, driven by a dynamic interplay of innovation, industry demand, and evolving application requirements.

SCOPE OF STUDY:

The report analyzes the Underfill Materials market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Application (Flip Chips, Ball Grid Array (BGA), Chip Scale Packaging (CSP)); Product Type (Capillary Underfill Material (CUF), No Flow Underfill Material (NUF), Molded Underfill Material (MUF))

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 42 Featured) -

  • ELANTAS GmbH
  • Epoxy Technology, Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • Inkron Limited
  • MacDermid Alpha Electronics Solutions
  • NAMICS Corporation
  • NORDSON Corporation
  • Panasonic Industry Co., Ltd.
  • VIETNAM PROS TECHNOLOGY CO., LTD.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Underfill Materials - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased Adoption of Underfill Materials in Semiconductor Packaging Expands Addressable Market
    • Surge in Use of Underfill Materials in Flip-Chip and Ball Grid Array (BGA) Applications Fuels Market Growth
    • Rising Adoption of Underfill Materials in Mobile and Consumer Electronics Sets the Stage for Market Growth
    • Surge in Demand for Underfill Materials in Automotive and Advanced Driver Assistance Systems (ADAS) Fuels Market Demand
    • Innovations in Low-Temperature and Fast-Curing Underfill Formulations Propel Market Growth
    • Rising Adoption of Underfill Materials in LED and Display Technologies Expands Market Opportunities
    • Surge in Demand for Underfill Materials in Flexible and Wearable Electronics Fuels Market Growth
    • Growing Use of Underfill Materials in Military and Aerospace Electronics Strengthens Business Case
    • Surge in Demand for Underfill Materials in Data Centers and Networking Equipment Expands Market Opportunities
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Underfill Materials Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Capillary Underfill Material (CUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for No Flow Underfill Material (NUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Molded Underfill Material (MUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Flip Chips by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Ball Grid Array (BGA) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Chip Scale Packaging (CSP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 23: USA Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 26: USA Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: USA 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Canada 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • JAPAN
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 38: Japan Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: Japan 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • CHINA
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 41: China Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 44: China Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: China 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • EUROPE
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • FRANCE
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 56: France Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 59: France Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: France Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: France 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • GERMANY
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 65: Germany Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Germany 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 71: Italy Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: Italy 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 74: UK Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 77: UK Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: UK 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 83: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Rest of Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Rest of Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 89: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Asia-Pacific Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Asia-Pacific 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 95: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Rest of World Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 97: Rest of World 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030

IV. COMPETITION