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市場調查報告書
商品編碼
1579783

G.Fast晶片組全球市場

G.Fast Chipsets
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 223 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

到 2030 年，G.Fast 晶片組的全球市場將達到 169 億美元

預計 2023 年全球 G.Fast 晶片組市場規模為 35 億美元，預計到 2030 年將達到 169 億美元，2023-2030 年分析期間複合年成長率為 25.5%。 CPE 部署是本報告分析的細分市場之一，預計複合年成長率為 22.9%，到分析期結束時將達到 95 億美元。在分析期間，DPU 部署部分的複合年成長率預計為 29.4%。

美國市場預估成長10億美元，中國複合年成長率24.5%

預計2023年美國G.Fast晶片組市場規模將達10億美元。中國作為全球第二大經濟體，預計2030年市場規模將達29億美元，2023-2030年分析期間複合年成長率為24.5%。其他值得注意的區域市場包括日本和加拿大，在分析期間預計複合年成長率分別為 22.9% 和 22.2%。在歐洲，德國的複合年成長率預計約為 17.8%。

全球 G.Fast 晶片組市場 – 主要趨勢與促進因素總結

G.Fast 晶片組將如何改變寬頻連線和通訊？

G.Fast 晶片組透過現有銅質電話線實現超高速網際網路，從而徹底改變了寬頻連接，使電信業者能夠連接Gigabit位元。 G.fast 技術代表“千兆位元快速”，是數位用戶線路(DSL) 技術，旨在利用大多數都市區現有的銅纜基礎設施。 G.Fast 晶片組是實現這一目標的核心組件，使網際網路服務提供商 (ISP) 能夠利用更短的銅纜環路提供類似光纖的高速寬頻服務。

對於升級到全光纖到府 (FTTH) 網路成本高或物流困難的地區，引進 G.Fast 晶片組尤其重要。 G.fast 允許通訊業者將光纖引入路邊機櫃等分配點，並使用銅線進行最終連接，從而顯著減少對新基礎設施的需求。 G.Fast 晶片組提供高達 1Gbps 的速度，支援 4K 視訊串流、線上遊戲、雲端運算和智慧家庭技術等需要頻寬的應用。隨著全球對高速網路的需求不斷增加，G.Fast 晶片組在彌合數位落差和加速Gigabit寬頻服務的推出方面發揮關鍵作用。

哪些技術進步正在提升 G.Fast 晶片組的效能？

G.Fast晶片組的效能和功能透過多項技術進步得到了顯著提高，使其更有效率並能夠適應各種網路環境。其中一項關鍵創新是向量化技術的發展，該技術有助於減少相鄰銅線之間的干擾（也稱為串擾）。在多用戶住宅(MDU) 和密集的都市區，多根銅線緊密相連，串擾會顯著降低訊號品質。採用向量化技術的 G.Fast 晶片組可主動消除此干擾，從而實現更穩定、更快速的連接。因此，即使在充滿挑戰的環境中，G.fast 網路也能夠實現更高的頻寬和更高的可靠性。

另一個重大進步是在 G.Fast 晶片組中引入動態時間分配 (DTA)。 DTA允許晶片組動態分配上行和下行頻寬，以滿足使用者的即時需求。例如，當家庭將大檔案上傳到雲端時，晶片組會暫時增加上傳頻寬以適應資料傳輸，然後下載頻寬以完成視訊串流等任務，您可以轉移優先順序。這種靈活性改善了整體用戶體驗，並使 G.fast 成為更通用的高速寬頻解決方案，尤其是在頻寬需求不對稱的環境中。

進一步的創新包括增強 G.fast 以支援更高的頻率和更長的距離。 G.fast 的早期版本在非常短的銅環（通常為 300 公尺或更短）上效果最佳，限制了其在某些環境中的應用。然而，晶片組設計的進步使G.fast的覆蓋範圍增加到約500公尺或更長，使其能夠部署在更廣泛的場景中，包括農村地區和大型建築。此外，新的G.Fast晶片組的運作頻率高達212MHz，可實現更快的資料傳輸和更高的頻寬利用率。這些技術改進使G.Fast晶片組能夠適應各種網路情況，使ISP能夠在各種部署場景中提供可靠的Gigabit寬頻。

G.Fast晶片如何支援都市區Gigabit寬頻部署？

G.Fast晶片組在支援都市區Gigabit寬頻業務部署方面發揮關鍵作用。在都市區，特別是公寓和公寓等多用戶住宅(MDU)，G.fast 是實現光纖般速度且無需更換現有銅基礎設施的理想解決方案。電訊可以透過在建築物中安裝光纖並使用 G.Fast 晶片組透過連接各個公寓的短銅環路提供超高速網際網路來節省安裝時間和成本。

G.fast 利用現有基礎設施的能力使其成為人口稠密地區的一個有吸引力的選擇，因為在這些地區挖掘道路來安裝新的光纖電纜成本高昂且具有破壞性。透過在城市環境中部署G.fast技術，電信業者可以提供與FTTH相當的Gigabit速度，使居民能夠存取4K和8K視訊串流、線上遊戲和雲端基礎的應用程式等寬頻服務。 G.fast 網路的部署速度比全光纖網路更快，使 ISP 能夠快速滿足對更快寬頻不斷成長的需求。

在升級到全光纖網路在經濟和物流方面都存在困難的農村地區，G.Fast 晶片組提供了有效的解決方案，為服務不足的地區帶來更快的網路速度。透過將光纖覆蓋範圍擴展到附近的分配點和節點，並在現有銅線上使用 G.fast 進行最終連接，通訊業者可以避免與遠距光纖安裝相關的高成本，從而顯著提高速度。這使得 G.fast 成為解決數位落差的關鍵技術，為網路存取傳統上落後於城市中心的農村和偏遠地區帶來Gigabit寬頻。隨著越來越多的國家開始建立全國性的Gigabit網路，越來越多的國家開始部署 G.Fast 晶片組，為都市區和農村地區提供可擴展且經濟實惠的超高速寬頻途徑。

推動G.fast晶片組市場成長的因素有哪些？

G.fast 晶片組市場的成長受到多種因素的推動，包括全球對高速網際網路需求的增加、銅線網路升級成本效益的提高以及旨在擴大寬頻接入的政府舉措。隨著消費者擴大採用串流媒體服務、雲端運算、線上遊戲和視訊會議等頻寬密集型應用，對更快、更可靠的寬頻服務的需求是關鍵促進因素之一。隨著 4K 和 8K 視訊、虛擬實境和智慧家居設備的興起，傳統 DSL 和較舊的銅基技術已不足以滿足高速網際網路的需求。 G.fast通訊業者為營運商提供了實用的解決方案，可將其網路升級到Gigabit位元速度，而無需進行全光纖部署所需的巨額投資。

G.fast的具成本效益也是推動市場成長的重要因素。與需要大量基礎設施投資的光纖到戶 (FTTH) 部署不同，G.fast 利用現有的銅纜基礎設施進行最後一英里連接，從而減少了部署時間和成本。這使得 G.fast 對於希望增強寬頻服務同時降低成本的電信業者來說成為一個有吸引力的選擇。隨著對Gigabit速度的需求增加，G.fast 將傳統銅網路與完整的光纖基礎設施連接起來，使營運商能夠在新光纖安裝不切實際或成本過高的情況下連接新的光纖安裝。

政府擴大寬頻接入和彌合數位鴻溝的努力也推動了 G.Fast 晶片組的採用。許多國家都有雄心勃勃的目標，即向所有公民提供Gigabit位元網際網路，特別是在服務不足的地區。 G.fast 技術使通訊業者能夠快速、經濟地升級其網路以實現這些目標，而無需用光纖替換整個銅纜網路。隨著各國政府繼續推動普及寬頻接入，G.Fast 晶片組將在幫助通訊業者實現這些目標方面發揮關鍵作用，特別是在光纖安裝昂貴且困難的地區。

G.Fast晶片組的未來趨勢是什麼？

一些新趨勢正在塑造 G.Fast 晶片組的未來發展，包括 5G 技術的整合、多GigabitG.fast 解決方案的進步以及混合光纖和銅纜網路的融合。最重要的趨勢之一是 G.fast 和 5G 網路的交叉。隨著通訊業者部署 5G 基礎設施，他們越來越依賴回程傳輸光纖來支援 5G 所需的高資料傳輸和低延遲。 G.fast 技術被用作補充解決方案，允許通訊業者將光纖延伸到家庭和建築物，而無需到處安裝光纖。透過使用 G.fast 為銅線的最終連接提供動力，即使在無法部署光纖的地區，營運商也可以為固定和行動用戶提供Gigabit速度的 5G 服務。

多GigabitG.fast 技術的進步也正在塑造該市場的未來。目前的 G.fast 解決方案通常提供高達 1Gbps 的速度，但新版本的 G.fast 正在開發中，以支援更快的速度，接近 2Gbps 甚至更高。這種多Gigabit的能力對於滿足雲端遊戲、虛擬實境和 8K 視訊串流等資料密集型應用程式不斷成長的需求至關重要。隨著消費者對超高速網際網路的需求不斷成長，多GigabitG.Fast晶片組的開發將使通訊業者能夠在不安裝光纖的情況下提供尖端的寬頻服務，從而使G.Fast在業界保持競爭力。

另一個重要趨勢是混合光纖和銅纜網路的融合，G.fast 在彌合光纖和銅纜基礎設施之間的差距方面發揮著重要作用。為了更有效地提供Gigabit速度，通訊業者擴大採用混合網路模型，將光纖的優勢與銅纜的靈活性結合起來。 G.fast 允許營運商將光纖延伸到鄰近的節點和街道機櫃，使用現有的銅線最終連接到家庭和企業。這種混合方法降低了全光纖部署的成本和複雜性，同時提供現代應用所需的高速網路。隨著混合網路模型變得越來越普遍，G.Fast 晶片組將繼續發展以支援更快的速度、遠距和更靈活的網路架構。

在這些趨勢中，G.Fast 晶片組的未來將由多Gigabit功能的演進、與 5G 網路的整合以及光纖和銅纜網路的持續融合來定義。這些創新確保 G.fast 仍然是從城市高層建築到農村社區的各種部署場景中提供高速寬頻的重要技術。隨著晶片組設計的不斷發展，G.fast 技術將在推動Gigabit寬頻連接領域發揮更重要的作用。

受訪企業範例（共46家）

  • Broadcom Ltd.
  • BT Group PLC
  • CenturyLink, Inc.
  • Chongqing Polycomp International Corporation
  • Marvell Technology Group Ltd.
  • Mediatek, Inc.
  • Metanoia Communications, Inc.
  • Qualcomm, Inc.
  • Sckipio Technologies
  • Swisscom AG

目錄

第1章調查方法

第 2 章執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 其他領域

第4章 比賽

簡介目錄
Product Code: MCP12110

Global G.Fast Chipsets Market to Reach US$16.9 Billion by 2030

The global market for G.Fast Chipsets estimated at US$3.5 Billion in the year 2023, is expected to reach US$16.9 Billion by 2030, growing at a CAGR of 25.5% over the analysis period 2023-2030. CPE Deployment, one of the segments analyzed in the report, is expected to record a 22.9% CAGR and reach US$9.5 Billion by the end of the analysis period. Growth in the DPU Deployment segment is estimated at 29.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.0 Billion While China is Forecast to Grow at 24.5% CAGR

The G.Fast Chipsets market in the U.S. is estimated at US$1.0 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$2.9 Billion by the year 2030 trailing a CAGR of 24.5% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 22.9% and 22.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 17.8% CAGR.

Global G.Fast Chipsets Market - Key Trends and Drivers Summarized

How Are G.fast Chipsets Transforming Broadband Connectivity and Telecommunications?

G.fast chipsets are revolutionizing broadband connectivity by enabling ultra-fast internet speeds over existing copper telephone lines, helping telecommunications companies deliver gigabit-level speeds without the need for costly fiber optic installations to every home. G.fast technology, which stands for "Gigabit fast," is a digital subscriber line (DSL) technology designed to leverage the copper infrastructure that already exists in most urban areas. G.fast chipsets are the core components that make this possible, allowing internet service providers (ISPs) to offer high-speed broadband services, similar to fiber optic performance, by utilizing shorter copper loops.

The introduction of G.fast chipsets has been particularly significant in areas where upgrading to full fiber-to-the-home (FTTH) networks is cost-prohibitive or logistically challenging. By using G.fast, telecom operators can bring fiber to distribution points like street cabinets and use copper lines for the final connection, drastically reducing the need for new infrastructure. G.fast chipsets deliver speeds of up to 1 Gbps, supporting bandwidth-intensive applications like 4K video streaming, online gaming, cloud computing, and smart home technologies. As global demand for high-speed internet grows, G.fast chipsets are playing a crucial role in bridging the digital divide and accelerating the rollout of gigabit broadband services.

What Technological Advancements Are Improving the Performance of G.fast Chipsets?

Several technological advancements are significantly enhancing the performance and capabilities of G.fast chipsets, making them more efficient and adaptable to varying network environments. One of the key innovations is the development of vectoring technology, which helps reduce interference between neighboring copper lines—also known as crosstalk. In multi-dwelling units (MDUs) and dense urban areas, where multiple copper lines run close together, crosstalk can significantly degrade signal quality. G.fast chipsets equipped with vectoring technology actively cancel this interference, allowing for more stable and higher-speed connections. As a result, G.fast networks can achieve higher bandwidths with improved reliability, even in challenging environments.

Another major advancement is the introduction of dynamic time allocation (DTA) in G.fast chipsets, which enables more efficient use of bandwidth based on network demand. DTA allows the chipset to allocate upstream and downstream bandwidth dynamically, adjusting to the real-time needs of the user. For example, if a household is uploading large files to the cloud, the chipset can temporarily increase upstream capacity to accommodate the data transfer, and then shift back to prioritizing downstream bandwidth for tasks like video streaming. This flexibility improves the overall user experience, making G.fast a more versatile solution for high-speed broadband, especially in environments with asymmetric bandwidth demands.

Further innovations include the expansion of G.fast to support higher frequencies and longer distances. Early versions of G.fast worked best over very short copper loops, typically under 300 meters, limiting its application in certain settings. However, advancements in chipset design have extended the reach of G.fast to approximately 500 meters or more, allowing it to be deployed in a wider range of scenarios, such as in rural areas or larger buildings. In addition, newer G.fast chipsets can operate at frequencies up to 212 MHz, enabling even faster data transmission and higher bandwidth availability. These technological improvements are making G.fast chipsets more adaptable to a variety of network conditions, ensuring that ISPs can deliver reliable gigabit broadband across different deployment scenarios.

How Are G.fast Chipsets Supporting the Rollout of Gigabit Broadband in Urban and Rural Areas?

G.fast chipsets are playing a crucial role in supporting the rollout of gigabit broadband services in both urban and rural areas, providing a cost-effective and efficient way to deliver high-speed internet without the need for full fiber deployment. In urban areas, especially in multi-dwelling units (MDUs) like apartment buildings and condominiums, G.fast is an ideal solution for delivering fiber-like speeds without the need to replace existing copper infrastructure. Telecom operators can deploy fiber to the building and use G.fast chipsets to deliver ultra-fast internet over the short copper loops that connect individual apartments, significantly reducing installation time and costs.

This ability to leverage existing infrastructure makes G.fast an attractive option in densely populated areas, where digging up streets to lay new fiber cables is both expensive and disruptive. By deploying G.fast technology in urban environments, telecom companies can offer gigabit speeds comparable to FTTH, enabling residents to access high-bandwidth services such as 4K and 8K video streaming, online gaming, and cloud-based applications. This approach also speeds up the rollout of high-speed internet services, as G.fast networks can be deployed more quickly than full fiber installations, allowing ISPs to meet growing demand for faster broadband in a shorter time frame.

In rural areas, where upgrading to full fiber is often financially or logistically challenging, G.fast chipsets provide an effective solution for bringing faster internet speeds to underserved communities. By extending the reach of fiber to nearby distribution points or nodes and using G.fast over the existing copper lines for the final connection, telecom operators can offer significant speed improvements without the high costs associated with laying fiber across long distances. This makes G.fast a key technology in addressing the digital divide, bringing gigabit broadband to rural and remote areas where internet access has traditionally lagged behind urban centers. As more countries push for nationwide gigabit-capable networks, G.fast chipsets are increasingly being deployed to provide a scalable, affordable path to ultra-fast broadband in both urban and rural regions.

What’s Driving the Growth of the G.fast Chipset Market?

Several factors are driving the growth of the G.fast chipset market, including the rising global demand for high-speed internet, the increasing cost-effectiveness of upgrading copper networks, and government initiatives aimed at expanding broadband access. One of the primary drivers is the growing need for faster and more reliable broadband services as consumers adopt bandwidth-intensive applications such as streaming services, cloud computing, online gaming, and video conferencing. With the rise of 4K and 8K video, virtual reality, and smart home devices, traditional DSL and older copper-based technologies are no longer sufficient to meet the demand for high-speed internet. G.fast technology provides telecom operators with a practical solution to upgrade their networks to gigabit speeds without the massive investments required for full fiber deployment.

The cost-effectiveness of G.fast is another key factor contributing to market growth. Unlike fiber-to-the-home (FTTH) installations, which require significant infrastructure investment, G.fast leverages the existing copper infrastructure for the last-mile connection, reducing both deployment time and costs. This makes G.fast an attractive option for telecom companies looking to enhance broadband services while keeping costs manageable. As the demand for gigabit speeds increases, G.fast provides a bridge between legacy copper networks and full fiber infrastructure, allowing operators to deliver high-speed internet in areas where laying new fiber is either impractical or cost-prohibitive.

Government initiatives to expand broadband access and close the digital divide are also driving the adoption of G.fast chipsets. Many countries have set ambitious goals to provide gigabit-capable internet to all citizens, especially in underserved and rural areas. G.fast technology allows telecom operators to quickly and affordably upgrade their networks to meet these goals without having to replace entire copper networks with fiber. As governments continue to push for universal broadband access, G.fast chipsets will play a critical role in helping telecom providers achieve these objectives, particularly in areas where fiber installation is too expensive or difficult.

What Future Trends Are Shaping the Development of G.fast Chipsets?

Several emerging trends are shaping the future development of G.fast chipsets, including the integration of 5G technology, advancements in multi-gigabit G.fast solutions, and the convergence of hybrid fiber-copper networks. One of the most significant trends is the intersection of G.fast and 5G networks. As telecom operators roll out 5G infrastructure, they are increasingly relying on fiber for backhaul to support the high data rates and low latency required by 5G. G.fast technology is being used as a complementary solution, enabling operators to extend fiber to the premises or buildings without the need for full fiber deployment. By using G.fast to enhance the final connection over copper lines, operators can deliver gigabit speeds for 5G services in areas where it is not feasible to deploy fiber, creating a seamless, high-speed broadband experience for both fixed and mobile users.

Advancements in multi-gigabit G.fast technology are also shaping the future of this market. While current G.fast solutions typically offer speeds of up to 1 Gbps, newer versions of G.fast are being developed to support even higher speeds, approaching 2 Gbps and beyond. This multi-gigabit capability is critical for meeting the growing demands of data-intensive applications such as cloud gaming, virtual reality, and 8K video streaming. As consumer demand for ultra-fast internet continues to rise, the development of multi-gigabit G.fast chipsets will enable telecom operators to deliver cutting-edge broadband services without the need for full fiber installations, ensuring that G.fast remains a competitive technology in the evolving broadband landscape.

Another key trend is the convergence of hybrid fiber-copper networks, where G.fast plays an essential role in bridging the gap between fiber and copper infrastructure. Telecom operators are increasingly adopting hybrid network models that combine the strengths of fiber optics with the flexibility of copper to deliver gigabit speeds more efficiently. G.fast allows operators to extend fiber to neighborhood nodes or street cabinets and use existing copper wiring for the final connection to homes and businesses. This hybrid approach reduces the cost and complexity of full fiber deployment while still providing the high-speed internet required for modern applications. As the hybrid network model becomes more widespread, G.fast chipsets will continue to evolve to support higher speeds, longer distances, and more flexible network architectures.

As these trends unfold, the future of G.fast chipsets will be defined by advancements in multi-gigabit capabilities, integration with 5G networks, and the continued convergence of fiber and copper networks. These innovations will ensure that G.fast remains a vital technology for delivering high-speed broadband in a variety of deployment scenarios, from urban high-rises to rural communities. With ongoing developments in chipset design, G.fast technology is poised to play an even more prominent role in the global push for gigabit broadband connectivity.

Select Competitors (Total 46 Featured) -

  • Broadcom Ltd.
  • BT Group PLC
  • CenturyLink, Inc.
  • Chongqing Polycomp International Corporation
  • Marvell Technology Group Ltd.
  • Mediatek, Inc.
  • Metanoia Communications, Inc.
  • Qualcomm, Inc.
  • Sckipio Technologies
  • Swisscom AG

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • G.Fast Chipsets - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for High-Speed Internet Services Drives Growth in G.Fast Chipset Market
    • Consumer Trends Toward Streaming Services and High-Bandwidth Applications
    • Role of G.Fast in Reducing Digital Divide in Urban and Rural Areas
    • Economic Analysis of G.Fast Deployment Compared to Full Fiber Solutions
    • Global Expansion of G.Fast Technology in Developing Telecom Markets
    • Role of G.Fast in Smart Home and IoT Connectivity
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World G.Fast Chipsets Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for G.Fast Chipsets by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 3: World 7-Year Perspective for G.Fast Chipsets by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for CPE Deployment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World 7-Year Perspective for CPE Deployment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for DPU Deployment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 7: World 7-Year Perspective for DPU Deployment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Residential End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 9: World 7-Year Perspective for Residential End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Commercial End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World 7-Year Perspective for Commercial End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 12: USA Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 13: USA 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 14: USA Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 15: USA 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • CANADA
    • TABLE 16: Canada Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 17: Canada 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 18: Canada Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 19: Canada 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • JAPAN
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 20: Japan Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 21: Japan 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 22: Japan Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 23: Japan 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • CHINA
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 24: China Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 25: China 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 26: China Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: China 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • EUROPE
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 28: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: Europe 7-Year Perspective for G.Fast Chipsets by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
    • TABLE 30: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 31: Europe 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 32: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Europe 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • FRANCE
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 34: France Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 35: France 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 36: France Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 37: France 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • GERMANY
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 38: Germany Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: Germany 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 40: Germany Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 41: Germany 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • ITALY
    • TABLE 42: Italy Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 43: Italy 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 44: Italy Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Italy 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • UNITED KINGDOM
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 46: UK Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 47: UK 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 48: UK Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 49: UK 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • REST OF EUROPE
    • TABLE 50: Rest of Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Rest of Europe 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 52: Rest of Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 53: Rest of Europe 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • ASIA-PACIFIC
    • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 54: Asia-Pacific Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 55: Asia-Pacific 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 56: Asia-Pacific Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: Asia-Pacific 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
  • REST OF WORLD
    • TABLE 58: Rest of World Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 59: Rest of World 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
    • TABLE 60: Rest of World Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 61: Rest of World 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030

IV. COMPETITION