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市場調查報告書
商品編碼
1528120

全球雲端 EDA 市場

Cloud EDA
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 218 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計2030年全球雲端EDA市場將達到137億美元

全球雲端 EDA 市場預計 2023 年為 92 億美元，預計到 2030 年將達到 137 億美元，2023-2030 年分析期間複合年成長率為 5.9%。半導體智慧財產權 (SIP) 是本報告分析的細分市場之一，預計複合年成長率為 6.4%，到分析期結束時將達到 51 億美元。分析期內，電腦輔助工程 (CAE) 領域的複合年成長率預計為 6.9%。

美國市場預估成長23億美元，中國複合年成長率為7.0%

預計 2023 年美國雲端 EDA 市場規模將達 23 億美元。中國作為全球第二大經濟體，預計2030年市場規模將達19億美元，2023-2030年分析期間複合年成長率為7.0%。其他值得注意的區域市場包括日本和加拿大，在分析期間預計複合年成長率分別為 4.8% 和 5.4%。在歐洲，德國的複合年成長率預計為 5.1%。

全球雲端 EDA 市場 - 主要趨勢與促進因素總結

什麼是雲端 EDA？

電子設計自動化 (EDA) 工具對於設計和製造複雜的電子系統和積體電路至關重要。傳統上，EDA 工具一直存儲在本機伺服器和系統上，但它們擴大遷移到雲端，提供以前不可能的功能，例如靈活性、擴充性和協作功能。雲端 EDA 允許多個使用者從不同地點同時存取和處理同一個計劃，從而提高生產力並縮短新電子產品的上市時間。此外，雲端環境可以消除對昂貴硬體和專門 IT 維護團隊的需求，從而將成本結構從資本支出模型轉變為更易於管理的營運支出模型，從而顯著降低資本支出。

科技進步如何增強雲端 EDA？

雲端處理技術的進步為雲端 EDA 產業帶來了福音。雲端服務中提供的高效能運算 (HPC) 功能可以更快地處理對 EDA 至關重要的複雜設計和模擬任務。鑑於智慧型手機和物聯網設備等電子設備的複雜性日益增加，這一點尤其重要，這些設備需要大量的模擬來確保功能和可靠性。此外，雲端中安全通訊協定的進步緩解了許多資料隱私和安全問題，這些問題曾經被認為是採用雲端 EDA 解決方案的主要障礙。更強大的加密方法和改進的資料處理程序使企業能夠利用雲端 EDA 工具，而不會損害其智慧財產權。

雲端EDA在現代電子開發中扮演什麼角色？

雲端 EDA 不僅僅是一種操作工具；它也是快速發展的電子產業的策略資產。隨著設備變得更加高度整合和多功能，電路的複雜性急劇增加。雲端 EDA 提供了有效管理這種複雜性所需的運算能力和靈活性。對於新興企業和小型企業來說，雲端 EDA 的初始成本較低，使小型團隊能夠處理雄心勃勃的電子計劃，而無需承擔傳統 EDA 工具的財務負擔。對於大型企業來說，雲端資源的可擴展性使他們能夠動態分配運算資源以滿足計劃需求，從而最佳化成本和開發進度。此外，雲端 EDA 支援全球團隊之間的即時協作。這是全球化市場的一個重要特徵，因為開發通常在多個海外地點進行。

雲端EDA市場成長的驅動力是什麼？

雲端 EDA 市場的成長受到多種因素的推動，包括電子設計複雜性的增加、電子市場的全球擴張以及整個技術領域向基於雲端基礎的解決方案的轉變。在消費性電子、汽車和航太等產業，對更有效率、更具成本效益和更快的設計週期的需求尤其重要，這些產業的創新壓力很大且持續。此外，消費行為向個人化和高效能電子產品的轉變需要更複雜的設計和測試，而雲端 EDA 工具可以有效促進這一點。此外，隨著世界技術基礎設施的成熟，​​寬頻的普及和網路安全性的增強證明了這一點，更多的公司將轉向雲端 EDA 解決方案。這些趨勢，加上雲端運算和電子設計領域的持續技術進步，預示著雲端 EDA 產業將出現強勁的成長軌跡。

受訪企業範例（共36家）

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

目錄

第1章調查方法

第 2 章執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 世界其他地區

第4章 比賽

簡介目錄
Product Code: MCP11069

Global Cloud EDA Market to Reach US$13.7 Billion by 2030

The global market for Cloud EDA estimated at US$9.2 Billion in the year 2023, is expected to reach US$13.7 Billion by 2030, growing at a CAGR of 5.9% over the analysis period 2023-2030. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is expected to record a 6.4% CAGR and reach US$5.1 Billion by the end of the analysis period. Growth in the Computer Aided Engineering (CAE) segment is estimated at 6.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.3 Billion While China is Forecast to Grow at 7.0% CAGR

The Cloud EDA market in the U.S. is estimated at US$2.3 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$1.9 Billion by the year 2030 trailing a CAGR of 7.0% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 4.8% and 5.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.1% CAGR.

Global Cloud EDA Market - Key Trends & Drivers Summarized

What Is Cloud EDA, and How Is It Transforming the Design Landscape?

Electronic Design Automation (EDA) tools are critical for the design and production of complex electronic systems and integrated circuits. Traditionally housed on local servers and systems, EDA tools are increasingly being migrated to the cloud, providing flexibility, scalability, and collaborative capabilities that were previously unattainable. Cloud EDA enables multiple users to access and work on the same project simultaneously from different locations, enhancing productivity and reducing the time to market for new electronic products. Moreover, the cloud environment can significantly cut down capital expenditure as it eliminates the need for expensive hardware and dedicated IT maintenance teams, shifting the cost structure from a capex model to a more manageable opex model.

How Are Technological Advancements Enhancing Cloud EDA?

The advancement of cloud computing technologies has been a boon for the Cloud EDA sector. High-performance computing (HPC) capabilities available via cloud services allow for faster processing of complex design and simulation tasks that are fundamental to EDA. This is particularly important given the growing complexity of electronic devices, such as smartphones and IoT devices, which require extensive simulation to ensure functionality and reliability. Furthermore, advancements in security protocols in the cloud have alleviated many of the concerns related to data sensitivity and security, which were once seen as major barriers to the adoption of cloud EDA solutions. With stronger encryption methods and improved data handling procedures, firms can now take advantage of cloud EDA tools without compromising their intellectual property.

What Role Does Cloud EDA Play in Modern Electronics Development?

Cloud EDA is not just an operational tool; it is a strategic asset in the rapidly evolving electronics industry. As devices become more integrated and feature-rich, the underlying complexity of circuits grows exponentially. Cloud EDA provides the necessary computational power and flexibility to manage this complexity effectively. For startups and smaller firms, the lower upfront costs associated with cloud EDA mean that smaller teams can undertake ambitious electronics projects without the financial burden of traditional EDA tools. For larger enterprises, the scalability of cloud resources allows for the dynamic allocation of computing resources to match project demands, optimizing both costs and development timelines. Additionally, cloud EDA supports real-time collaboration across global teams, an indispensable feature in a globalized market where development often occurs across multiple international sites.

What Drives the Growth in the Cloud EDA Market?

The growth in the Cloud EDA market is driven by several factors, including the increasing complexity of electronic device design, the global expansion of the electronics market, and the overall shift towards cloud-based solutions across the technology sector. The need for more efficient, cost-effective, and faster design cycles is particularly critical in industries like consumer electronics, automotive, and aerospace, where the pressure to innovate is high and continuous. Additionally, the shift in consumer behavior towards personalized and high-performance electronic devices requires more sophisticated design and testing, which cloud EDA tools facilitate effectively. Moreover, as the technology infrastructure globally continues to mature—exemplified by wider broadband availability and stronger network security—more firms are likely to transition to cloud EDA solutions. These trends, coupled with ongoing technological advancements in both cloud computing and electronic design, forecast a robust growth trajectory for the Cloud EDA industry.

Select Competitors (Total 36 Featured) -

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Cloud EDA - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
    • Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
    • Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Global Economic Outlook
    • Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
    • Companies Move EDA Into the Cloud. Here's Why
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
    • EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
    • IP Cores per SoC
    • The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
    • Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
    • Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
    • Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
    • EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
    • Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
    • Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
    • With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
    • Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
    • Healthy Demand for PCBs Bodes Well for Market Growth
    • Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Challenges to Cloud EDA & How They Can be Overcome
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
    • TABLE 3: World Recent Past, Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 9: World Recent Past, Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 15: World Recent Past, Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 21: World Cloud EDA Market Analysis of Annual Sales in US$ Million for Years 2020 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 22: USA Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 23: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 24: USA Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 25: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 28: Canada Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 29: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • JAPAN
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 30: Japan Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 31: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CHINA
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 34: China Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 35: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 36: China Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 37: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • EUROPE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 38: Europe Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 39: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
    • TABLE 40: Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 41: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 43: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • FRANCE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 44: France Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 46: France Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 47: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • GERMANY
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 48: Germany Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 49: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 50: Germany Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ITALY
    • TABLE 52: Italy Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 53: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 54: Italy Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 55: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • UNITED KINGDOM
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 56: UK Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 58: UK Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 59: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF EUROPE
    • TABLE 60: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 61: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 62: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ASIA-PACIFIC
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 64: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 65: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 66: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 67: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF WORLD
    • TABLE 68: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 70: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 71: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030

IV. COMPETITION