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市場調查報告書
商品編碼
1458917

全球印刷基板(PCB) 市場

Printed Circuit Boards (PCBs)
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 441 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

到 2030 年，全球印刷電路基板(PCB) 市場將達到 901 億美元

全球印刷電路基板（PCB）市場預計到2023年將達到634億美元，預計2023年至2030年複合年成長率為4.5%，到2030年將達到901億美元。多層PCB是本報告分析的細分市場之一，預計複合年成長率為4.8%，到分析期結束時將達到599億美元。預計未來八年雙面 PCB 領域的複合年成長率為 3.6%。

美國市場預估成長70億美元，中國複合年成長率5.3%

預計到 2023 年，美國印刷電路基板(PCB) 市場將達到 70 億美元。中國作為全球第二大經濟體，預計2030年市場規模將達240億美元，2023年至2030年分析期間複合年成長率為5.3%。其他值得注意的地理市場包括日本和加拿大，預計 2023 年至 2030 年將分別成長 3.3% 和 4%。在歐洲，德國的複合年成長率預計約為 3.7%。

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2024 年世界經濟有何預期

貨幣緊縮和相關利率上升導致的地緣政治和經濟不穩定將在 2024 年造成動盪的局面。一些因素將繼續給復甦之路帶來壓力，包括中東的敵對行動和日益頻繁的氣候災害。儘管存在風險，但一些積極因素正在顯現，包括通貨緊縮徵兆更加明顯、對頑固通膨的擔憂有所緩解、供應鏈正常化以及儘管能源成本波動但價格仍有所回落。這一切已經開始發生。印度和美國等二十一國集團國家的選舉可能會影響資本流動和投資策略。儘管印度作為全球投資目的地的地位日益突出，但在充滿活力的人才和資本生態系統的推動下，美國科技公司將繼續佔據主導地位。儘管該國經濟放緩，但由於國內經濟富有彈性和有利的法規環境，高科技機會（尤其是矽谷）仍然對尋求高成長潛力的投資者俱有吸引力。歐洲持續應對緊縮的貨幣政策和景氣衰退風險，但英國的前景最嚴峻，2024 年景氣衰退的風險最高。中國仍然是通用憑證，其成長預計將受到政府支出和消費者支出改善的支持。動盪的環境可能為投資者和公司帶來機會和挑戰。指導投資決策的靈活性和策略遠見，以及將波動性視為成長的催化劑，對於生存仍然至關重要。

受訪企業範例

  • Amphenol Corporation
  • Amperex Technology Ltd.
  • Apex Microelectronics Company Limited
  • Autosplice, Inc.
  • Auter Elektronics Ltd.
  • Advance Circuit Technology, Inc.
  • Altron, Inc.
  • Applied Magnetics Corporation
  • Atrenne Integrated Solutions, Inc.
  • Arbell Electronics Inc.
  • Advantech Technology Australia Pty Limited
  • Advanced Graphene Solutions, Inc.
  • Addcom Solution Pte Ltd
  • Arround Inc.
  • ASM Assembly Systems GmbH & Co. KG

目錄

第1章調查方法

第 2 章執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 韓國
  • 台灣
  • 其他亞太地區
  • 世界其他地區

第4章 比賽

簡介目錄
Product Code: MCP-1883

Global Printed Circuit Boards (PCBs) Market to Reach $90.1 Billion by 2030

The global market for Printed Circuit Boards (PCBs) estimated at US$63.4 Billion in the year 2023, is expected to reach US$90.1 Billion by 2030, growing at a CAGR of 4.5% over the period 2023-2030. Multi-Layer PCBs, one of the segments analyzed in the report, is expected to record 4.8% CAGR and reach US$59.9 Billion by the end of the analysis period. Growth in the Double-Sided PCBs segment is estimated at 3.6% CAGR for the next 8-year period.

The U.S. Market is Estimated at $7 Billion, While China is Forecast to Grow at 5.3% CAGR

The Printed Circuit Boards (PCBs) market in the U.S. is estimated at US$7 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$24 Billion by the year 2030 trailing a CAGR of 5.3% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.3% and 4% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 3.7% CAGR.

Introducing Our Exciting New Report Features for 2024

Full access to influencer engagement stats

Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.

Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities

Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas

Complimentary report updates for one year

Competitor coverage with global market shares of major players

Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies

Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 225 Featured) -

  • Amphenol Corporation
  • Amperex Technology Ltd.
  • Apex Microelectronics Company Limited
  • Autosplice, Inc.
  • Auter Elektronics Ltd.
  • Advance Circuit Technology, Inc.
  • Altron, Inc.
  • Applied Magnetics Corporation
  • Atrenne Integrated Solutions, Inc.
  • Arbell Electronics Inc.
  • Advantech Technology Australia Pty Limited
  • Advanced Graphene Solutions, Inc.
  • Addcom Solution Pte Ltd
  • Arround Inc.
  • ASM Assembly Systems GmbH & Co. KG

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • What are PCBs, Where are they Used & Why are they the Backbone of Electronics?
    • PCBs Are a Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity
    • Printed Circuit Boards (PCBs) - Global Key Competitors Percentage Market Share in 2023 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
    • Recent Market Activity
    • World Brands
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Digital Transformation Catalyzed by the Pandemic Provides the Perfect Platform for Growth in the Post COVID-19 Period.
    • The Scenario Bodes Well for All Things Electronic & Digital. Special Focus on PCBs for Electronic Wearables
    • It's Not CIOs or CFOs, its COVID-19 Leading Digital Transformation Globally: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
    • Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation
    • As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers) for the Years 2019 & 2023
    • As Telemedicine Storms into the Spotlight in the Post COVID-19 Period, Medical Wearables to Offer Opportunities for Rigid-flex PCBs
    • COVID-19 Pandemic Catalyzes Migration to New Models of Remote Care Delivery & Boosts Importance of Electronics Subsystems Supporting Smart Wearables: Global Number of Telemedicine Patients (In Million) for the Years 2016, 2018, 2020, 2023 & 2025
    • A Return to Economic Normalcy Will Reignite Growth Drivers in the Consumer Electronics End-Use Sector
    • Smart Homes Emerge as a Disruptive Trend Enhancing Lives of Homeowners & Also Creating New Market Opportunities Players in the Electronics Value Chain: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
    • The Coming Era of Electronification of Medical Devices to Bring Attractive Opportunities for Medical PCBs
    • A 47.1% Increase in Growth in the Post COVID-19 Period for the Medical Devices Industry Encourages an Optimistic Outlook for Medical PCBs: Global Medical Devices Industry (In US$ Billion) for the Years 2000, 2023 & 2025
    • PCBs are the Core of IoT Devices. Disruptions Caused by the Pandemic & the Push for Connected Tech to Benefit Market Growth
    • A Review of the IoT Opportunity for Flex and HDI PCBs
    • IoT to Take a Quantum Leap With the Pandemic Highlighting the Importance of Remote Operations in Ensuring Business Resiliency: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
    • Coronavirus Outbreak Makes Driverless Cars Attractive. Autonomous Cars Hold Robust Potential for Growth of PCBs in the Post COVID Period
    • Non-Contact Deliveries Made Popular by the Pandemic Will Ready the PCB Market for the Coming Age of Drones
    • What Does this Mean for PCB Designers and Manufacturers?
    • In the "Touch-Me-Not" Environment to Follow in the Post Pandemic Period, Use of Drones Will Rise to New Highs: Number of Countries Worldwide Using Drones/UAVs by Type 2019 & 2025
    • As Post Pandemic Economic Rebuilding Efforts Get Underway, Focus on Pandemic Ready Smart Cities Will Create a Hotbed of Opportunities for PCBs
    • Focus on Reshaping City Resilience to Future Pandemics & Crisis Will Spur Rejuvenated Spending on Smart City Projects in the Post COVID-19 Period, Providing a Goldmine of Opportunities for Electronic Technologies: Global Smart City Spending (In US$ Billion) for the Years 2021, 2023 & 2025
    • It's a Slower & Longer Road to Recovery for PCBs Used in Defense & Avionics
    • With the Aviation Industry on the Brink of Annihilation, Pre-Pandemic Digitalization Plans Will Take a Long Time to Witness a Return to Implementation: Expected Revenue Losses in Global Aviation (In US$ Billion)
    • Integration of Artificial Intelligence Into PCB Design & Production Comes of Age
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for Multi-Layer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for Double-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for Single-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Standard Multilayer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for High-Density Interconnect (HDI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for IC Substrate by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Rigid 1-2 Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Rigid-Flex by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Other Substrate Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World Recent Past, Current & Future Analysis for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 32: World Historic Review for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 33: World 16-Year Perspective for Computer & Peripherals by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 34: World Recent Past, Current & Future Analysis for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 35: World Historic Review for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 36: World 16-Year Perspective for Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 37: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 38: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 39: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 40: World Recent Past, Current & Future Analysis for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 41: World Historic Review for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 42: World 16-Year Perspective for Industrial Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 43: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 44: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 45: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 46: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 47: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 48: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 49: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 50: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 51: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 52: World Printed Circuit Boards (PCBs) Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • Semiconductor Industry in the U.S.
    • TABLE 53: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: USA Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: USA 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 56: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: USA Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: USA 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 59: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 60: USA Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: USA 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 62: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Canada Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Canada 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 65: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Canada Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Canada 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 68: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Canada Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: Canada 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • JAPAN
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • Semiconductor Industry in Japan
    • TABLE 71: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: Japan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: Japan 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 74: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Japan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Japan 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 77: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Japan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Japan 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CHINA
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 80: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: China Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: China 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 83: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: China Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: China 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 86: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: China Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: China 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • EUROPE
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 89: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 90: Europe Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 92: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 95: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 98: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • FRANCE
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 101: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: France Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: France 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 104: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: France Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: France 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 107: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: France Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: France 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • GERMANY
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 110: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 111: Germany Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 112: Germany 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 113: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 114: Germany Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 115: Germany 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 116: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 117: Germany Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 118: Germany 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 119: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 120: Italy Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 121: Italy 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 122: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 123: Italy Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 124: Italy 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 125: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 126: Italy Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 127: Italy 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 128: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 129: UK Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 130: UK 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 131: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 132: UK Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 133: UK 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 134: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 135: UK Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 136: UK 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 137: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 138: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 139: Rest of Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 141: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 142: Rest of Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 144: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 145: Rest of Europe 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 146: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 147: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 148: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
    • TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 150: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 151: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 153: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 154: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 156: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 157: Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • SOUTH KOREA
    • TABLE 158: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 159: South Korea Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 160: South Korea 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 161: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 162: South Korea Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 163: South Korea 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 164: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 165: South Korea Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 166: South Korea 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • TAIWAN
    • Taiwan, a Semiconductor Behemoth
    • TABLE 167: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 168: Taiwan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 169: Taiwan 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 170: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 171: Taiwan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 172: Taiwan 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 173: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 174: Taiwan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 175: Taiwan 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 176: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 177: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 178: Rest of Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 179: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 180: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 181: Rest of Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 182: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 183: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 184: Rest of Asia-Pacific 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 185: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 186: Rest of World Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 187: Rest of World 16-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2014, 2024 & 2030
    • TABLE 188: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 189: Rest of World Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 190: Rest of World 16-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2014, 2024 & 2030
    • TABLE 191: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 192: Rest of World Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 193: Rest of World 16-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030

IV. COMPETITION