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市場調查報告書
商品編碼
1871230

汽車柵極驅動器IC市場機會、成長促進因素、產業趨勢分析及2025-2034年預測

Automotive Gate Driver ICs Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034

出版日期: | 出版商: Global Market Insights Inc. | 英文 180 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2024 年全球汽車閘極驅動器 IC 市場價值為 14 億美元,預計到 2034 年將以 5.2% 的複合年成長率成長至 23 億美元。

汽車閘極驅動IC市場 - IMG1

汽車產業的快速電氣化仍然是推動閘極驅動積體電路需求的主要因素之一。隨著電動車在新生產線上佔據主導地位,對馬達、電池系統和逆變器的精確控制需求日益成長。閘極驅動積體電路是管理功率電晶體的關鍵組件,能夠提升效率、耐熱性和開關性能,這對最佳化電動車的續航里程和可靠性至關重要。對零排放交通和全球碳中和目標的推動加速了電動車的普及,導致高性能、高壓驅動積體電路的需求顯著增加了40%。汽車製造商和零件製造商正在整合先進的電力電子技術,以提高續航里程、減少能量損耗,並提供符合政府永續發展要求的快速充電系統。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 14億美元
預測值 23億美元
複合年成長率 5.2%

隨著碳化矽 (SiC) 和氮化鎵 (GaN) 半導體的應用,汽車產業正經歷一場重大的技術變革,徹底改變了電力電子裝置的設計方式。這些寬禁帶材料相比傳統矽材料,具有更高的能量效率、功率密度和更快的開關速度。隨著汽車製造商開發出更緊湊、更有效率的平台,專為 SiC 和 GaN 裝置最佳化的閘極驅動器對於下一代電動車架構而言變得至關重要。

2024年,隔離式閘極驅動器IC市場規模達到2.892億美元,主要得益於電動和混合動力車的日益普及,這些車輛對安全性和性能提出了更高的電氣隔離要求。這些IC能夠實現功率級和控制級之間的可靠通訊,同時還能處理高瞬態電壓,因此在牽引逆變器、先進動力總成和能量管理系統中不可或缺。

2024年,矽MOSFET(標準矽MOSFET)市場規模達4.726億美元。由於其成本效益高、供應鏈成熟且可靠性高,市場對這類積體電路的需求保持穩定。它們廣泛應用於低壓和中壓汽車應用,例如車載充電器、輔助電源系統和汽車電子產品。其與傳統設計的兼容性和穩定的性能使其成為汽車電氣系統的首選。

2024年美國汽車閘極驅動器IC市場規模將達到3.88億美元,預計2034年將以4.6%的複合年成長率成長。市場擴張的主要驅動力是聯邦政府大力推行清潔能源技術政策以及電動車製造業的快速發展。美國本土汽車製造商正大力投資創新電動車動力總成系統,從而帶動了對高效閘極驅動器IC的需求成長,這些IC需與高壓牽引和充電解決方案中使用的SiC和GaN功率模組相容。

全球汽車閘極驅動器IC市場的主要參與者包括NXP Semiconductors NV、三菱電機株式會社、英飛凌科技股份公司、瑞薩電子株式會社、Monolithic Power Systems (MPS)、Power Integrations Inc.、博通公司、Analog Devices, Inc.、德州儀器公司、義大利化學儀器公司、東芝電子導體(onsemi)、羅姆半導體、Diodes Incorporated、MACOM Technology Solutions Inc.、Microchip Technology Inc.、Semtech Corporation、Vishay Intertechnology, Inc.和Skyworks Solutions, Inc.。這些領先企業正致力於創新、產品差異化和技術合作,以鞏固其市場地位。各公司正大力投資開發針對SiC和GaN電晶體最佳化的IC,以提高電動車系統的效率、功率密度和熱管理性能。與汽車製造商和一級供應商的策略合作,正推動高壓IC更快地整合到牽引和充電系統中。

目錄

第1章:方法論與範圍

第2章:執行概要

第3章:行業洞察

  • 產業生態系分析
    • 供應商格局
    • 利潤率
    • 成本結構
    • 每個階段的價值增加
    • 影響價值鏈的因素
    • 中斷
  • 產業影響因素
    • 成長促進因素
      • 電動車(EV)普及率不斷提高
      • 向更高功率密度和SiC/GaN技術轉型
      • ADAS與自動駕駛系統的日益整合
      • 車輛電氣化(48V系統、混合動力平台)的擴展
      • 熱管理和隔離技術的進步
      • 對節能型和緊湊型電力電子產品的需求日益成長
    • 產業陷阱與挑戰
      • SiC/GaN閘極驅動器設計複雜度高且成本高
      • 熱可靠性和電磁干擾 (EMI) 問題
  • 成長潛力分析
  • 監管環境
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 中東和非洲
  • 波特的分析
  • PESTEL 分析
  • 技術與創新格局
    • 當前技術趨勢
    • 新興技術
  • 價格趨勢
    • 歷史價格分析(2021-2024)
    • 價格趨勢促進因素
    • 區域價格差異
    • 價格預測(2025-2034)
  • 定價策略
  • 新興商業模式
  • 合規要求
  • 永續性措施
    • 永續材料評估
    • 碳足跡分析
    • 循環經濟實施
    • 永續性認證和標準
    • 永續性投資報酬率分析
  • 全球消費者情緒分析
  • 專利分析

第4章:競爭格局

  • 介紹
  • 公司市佔率分析
    • 按地區
      • 北美洲
      • 歐洲
      • 亞太地區
      • 拉丁美洲
      • 中東和非洲
    • 市場集中度分析
  • 對主要參與者進行競爭基準分析
    • 財務績效比較
      • 收入
      • 利潤率
      • 研發
    • 產品組合比較
      • 產品範圍廣度
      • 科技
      • 創新
    • 地理位置比較
      • 全球足跡分析
      • 服務網路覆蓋
      • 按地區分類的市場滲透率
    • 競爭定位矩陣
      • 領導人
      • 挑戰者
      • 追蹤者
      • 小眾玩家
    • 戰略展望矩陣
  • 2021-2024 年主要發展動態
    • 併購
    • 夥伴關係與合作
    • 技術進步
    • 擴張和投資策略
    • 永續發展舉措
    • 數位轉型計劃
  • 新興/新創企業競爭對手格局

第5章:市場估算與預測:依產品類型分類,2021-2034年

  • 主要趨勢
  • 隔離式閘極驅動器積體電路
  • 非隔離式閘極驅動器積體電路

第6章:市場估算與預測:依交換器分類,2021-2034年

  • 主要趨勢
  • 矽MOSFET(標準矽MOSFET)
  • IGBT(絕緣柵雙極型電晶體)
  • 碳化矽(SiC)MOSFET
  • 氮化鎵(GaN)場效電晶體
  • 混合式/模組化(Si + SiC / Si + IGBT / 共封裝驅動器)
  • 其他

第7章:市場估算與預測:依拓樸結構分類,2021-2034年

  • 主要趨勢
  • 單側驅動
  • 橋樑駕駛員
  • 多相/三相驅動器
  • 其他

第8章:市場估算與預測:依汽車應用領域分類,2021-2034年

  • 主要趨勢
  • 牽引逆變器(電動車/混合動力汽車馬達驅動器)
  • 車用充電器(OBC)
  • DC-DC轉換器(高/低電壓)
  • 電動車充電站(車用/車載電源階段)
  • 電動輔助轉向/馬達控制器
  • 執行器/線控系統
  • 其他

第9章:市場估計與預測:依地區分類,2021-2034年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 西班牙
    • 義大利
    • 荷蘭
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中東和非洲
    • 沙烏地阿拉伯
    • 南非
    • 阿拉伯聯合大公國

第10章:公司簡介

  • Analog Devices, Inc.
  • Broadcom Inc.
  • Diodes Incorporated
  • Infineon Technologies AG
  • MACOM Technology Solutions Inc.
  • Microchip Technology Inc.
  • Mitsubishi Electric Corporation
  • Monolithic Power Systems (MPS)
  • NXP Semiconductors NV
  • ON Semiconductor Corporation (onsemi)
  • Power Integrations Inc.
  • Renesas Electronics Corporation
  • ROHM Semiconductor
  • Semtech Corporation
  • Skyworks Solutions, Inc.
  • STMicroelectronics NV
  • Texas Instruments Incorporated
  • Toshiba Electronic Devices & Storage Corporation
  • Vishay Intertechnology, Inc.
簡介目錄
Product Code: 15027

The Global Automotive Gate Driver ICs Market was valued at USD 1.4 Billion in 2024 and is estimated to grow at a CAGR of 5.2% to reach USD 2.3 Billion by 2034.

Automotive Gate Driver ICs Market - IMG1

Rapid electrification across the automotive sector remains one of the main factors driving demand for gate driver ICs. As electric vehicles continue to dominate new production lines, the need for precise control of electric motors, battery systems, and inverters is growing. Gate driver ICs are fundamental components that manage power transistors, enhancing efficiency, heat resistance, and switching performance vital for optimizing electric vehicle range and reliability. The push for zero-emission transportation and global carbon-neutral goals has accelerated EV adoption, driving a significant 40% increase in demand for high-performance, high-voltage driver ICs. Automakers and component manufacturers are integrating advanced power electronics to improve range, reduce energy loss, and deliver faster charging systems that meet government sustainability mandates.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$1.4 Billion
Forecast Value$2.3 Billion
CAGR5.2%

The industry is undergoing a significant technological shift with the adoption of silicon carbide (SiC) and gallium nitride (GaN) semiconductors, transforming how power electronics are designed for vehicles. These wide-bandgap materials provide superior energy efficiency, greater power density, and faster switching speeds than traditional silicon. As automotive manufacturers develop more compact and high-efficiency platforms, gate drivers specifically optimized for SiC and GaN devices are becoming essential for next-generation EV architectures.

In 2024, the isolated gate driver ICs segment generated USD 289.2 million, supported by the growing use of electric and hybrid vehicles that demand strong electrical isolation for safety and performance. These ICs enable reliable communication between power and control stages while managing high transient voltages, making them indispensable in traction inverters, advanced powertrains, and energy management systems.

The silicon MOSFET (Standard Si MOSFET) segment generated USD 472.6 million in 2024. Demand for these ICs remains steady due to their cost efficiency, established supply chain, and high reliability. They are extensively utilized in low- and mid-voltage vehicle applications such as onboard chargers, auxiliary power systems, and automotive electronics. Their compatibility with conventional designs and consistent performance continues to make them a preferred option in automotive electrical systems.

United States Automotive Gate Driver ICs Market is USD 388 million in 2024, growing at a CAGR of 4.6% through 2034. Market expansion is driven by strong federal policies promoting clean energy technologies and the rapid growth of EV manufacturing. Domestic automakers are heavily investing in innovative EV powertrain systems, generating increased demand for efficient gate driver ICs compatible with SiC and GaN power modules used in high-voltage traction and charging solutions.

Prominent companies operating in the Global Automotive Gate Driver ICs Market include NXP Semiconductors N.V., Mitsubishi Electric Corporation, Infineon Technologies AG, Renesas Electronics Corporation, Monolithic Power Systems (MPS), Power Integrations Inc., Broadcom Inc., Analog Devices, Inc., Texas Instruments Incorporated, STMicroelectronics N.V., Toshiba Electronic Devices & Storage Corporation, ON Semiconductor Corporation (onsemi), ROHM Semiconductor, Diodes Incorporated, MACOM Technology Solutions Inc., Microchip Technology Inc., Semtech Corporation, Vishay Intertechnology, Inc., and Skyworks Solutions, Inc. Leading players in the Automotive Gate Driver ICs Market are focusing on innovation, product differentiation, and technology partnerships to reinforce their market position. Companies are investing heavily in the development of ICs optimized for SiC and GaN transistors to enhance efficiency, power density, and thermal management in EV systems. Strategic collaborations with automakers and Tier-1 suppliers are enabling faster integration of high-voltage ICs in traction and charging systems.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/Country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast model
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry snapshot
  • 2.2 Key market trends
    • 2.2.1 Packaging type trends
    • 2.2.2 Material trends
    • 2.2.3 Application trends
    • 2.2.4 Regional
  • 2.3 TAM Analysis, 2025-2034 (USD Billion)
  • 2.4 CXO perspectives: Strategic imperatives
    • 2.4.1 Executive decision points
    • 2.4.2 critical success factors
  • 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier Landscape
    • 3.1.2 Profit Margin
    • 3.1.3 Cost structure
    • 3.1.4 Value addition at each stage
    • 3.1.5 Factor affecting the value chain
    • 3.1.6 Disruptions
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Rising adoption of electric vehicles (EVs)
      • 3.2.1.2 Shift toward higher power density and SiC/GaN technologies
      • 3.2.1.3 Growing integration of ADAS and autonomous driving systems
      • 3.2.1.4 Expansion of vehicle electrification (48V systems, hybrid platforms)
      • 3.2.1.5 Advancements in thermal management and isolation technologies
      • 3.2.1.6 Increasing demand for energy-efficient and compact power electronics
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High design complexity and cost of SiC/GaN gate drivers
      • 3.2.2.2 Thermal reliability and EMI (electromagnetic interference) issues
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
    • 3.4.1 North America
    • 3.4.2 Europe
    • 3.4.3 Asia Pacific
    • 3.4.4 Latin America
    • 3.4.5 Middle East & Africa
  • 3.5 Porter's analysis
  • 3.6 PESTEL analysis
  • 3.7 Technology and innovation landscape
    • 3.7.1 Current technological trends
    • 3.7.2 Emerging technologies
  • 3.8 Price trends
    • 3.8.1 Historical price analysis (2021-2024)
    • 3.8.2 Price trend drivers
    • 3.8.3 Regional price variations
    • 3.8.4 Price forecast (2025-2034)
  • 3.9 Pricing strategies
  • 3.10 Emerging business models
  • 3.11 Compliance requirements
  • 3.12 Sustainability measures
    • 3.12.1 Sustainable materials assessment
    • 3.12.2 Carbon footprint analysis
    • 3.12.3 Circular economy implementation
    • 3.12.4 Sustainability certifications and standards
    • 3.12.5 Sustainability ROI analysis
  • 3.13 Global consumer sentiment analysis
  • 3.14 Patent analysis

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 By region
      • 4.2.1.1 North America
      • 4.2.1.2 Europe
      • 4.2.1.3 Asia Pacific
      • 4.2.1.4 Latin America
      • 4.2.1.5 Middle East & Africa
    • 4.2.2 Market Concentration Analysis
  • 4.3 Competitive benchmarking of key players
    • 4.3.1 Financial performance comparison
      • 4.3.1.1 Revenue
      • 4.3.1.2 Profit margin
      • 4.3.1.3 R&D
    • 4.3.2 Product portfolio comparison
      • 4.3.2.1 Product range breadth
      • 4.3.2.2 Technology
      • 4.3.2.3 Innovation
    • 4.3.3 Geographic presence comparison
      • 4.3.3.1 Global footprint analysis
      • 4.3.3.2 Service network coverage
      • 4.3.3.3 Market penetration by region
    • 4.3.4 Competitive positioning matrix
      • 4.3.4.1 Leaders
      • 4.3.4.2 Challengers
      • 4.3.4.3 Followers
      • 4.3.4.4 Niche players
    • 4.3.5 Strategic outlook matrix
  • 4.4 Key developments, 2021-2024
    • 4.4.1 Mergers and acquisitions
    • 4.4.2 Partnerships and collaborations
    • 4.4.3 Technological advancements
    • 4.4.4 Expansion and investment strategies
    • 4.4.5 Sustainability initiatives
    • 4.4.6 Digital transformation initiatives
  • 4.5 Emerging/ startup competitors landscape

Chapter 5 Market Estimates and Forecast, By Product type, 2021 - 2034 (USD Million & Units)

  • 5.1 Key trends
  • 5.2 Isolated Gate Driver ICs
  • 5.3 Non-isolated Gate Driver ICs

Chapter 6 Market Estimates and Forecast, By Switch, 2021 - 2034 (USD Million & Units)

  • 6.1 Key trends
  • 6.2 Silicon MOSFET (Standard Si MOSFET)
  • 6.3 IGBT (Insulated Gate Bipolar Transistor)
  • 6.4 Silicon-Carbide (SiC) MOSFET
  • 6.5 Gallium-Nitride (GaN) FET
  • 6.6 Hybrid / Module-Based (Si + SiC / Si + IGBT / Co-packaged drivers)
  • 6.7 Others

Chapter 7 Market Estimates and Forecast, By Topology, 2021 - 2034 (USD Million & Units)

  • 7.1 Key trends
  • 7.2 Single-side drivers
  • 7.3 bridge drivers
  • 7.4 Multi-phase / three-phase drivers
  • 7.5 Others

Chapter 8 Market Estimates and Forecast, By Automotive Application, 2021 - 2034 (USD Million & Units)

  • 8.1 Key trends
  • 8.2 Traction inverters (EV/HEV motor drives)
  • 8.3 On-Board Charger (OBC)
  • 8.4 DC-DC converters (high-/low-voltage)
  • 8.5 EV charging stations (onboard/offboard power stages)
  • 8.6 Electric power steering / motor controllers
  • 8.7 Actuators / drive-by-wire systems
  • 8.8 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 - 2034 (USD Million & Units)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 France
    • 9.3.4 Spain
    • 9.3.5 Italy
    • 9.3.6 Netherlands
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 Australia
    • 9.4.5 South Korea
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Argentina
  • 9.6 Middle East and Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 South Africa
    • 9.6.3 UAE

Chapter 10 Company Profiles

  • 10.1 Analog Devices, Inc.
  • 10.2 Broadcom Inc.
  • 10.3 Diodes Incorporated
  • 10.4 Infineon Technologies AG
  • 10.5 MACOM Technology Solutions Inc.
  • 10.6 Microchip Technology Inc.
  • 10.7 Mitsubishi Electric Corporation
  • 10.8 Monolithic Power Systems (MPS)
  • 10.9 NXP Semiconductors N.V.
  • 10.10 ON Semiconductor Corporation (onsemi)
  • 10.11 Power Integrations Inc.
  • 10.12 Renesas Electronics Corporation
  • 10.13 ROHM Semiconductor
  • 10.14 Semtech Corporation
  • 10.15 Skyworks Solutions, Inc.
  • 10.16 STMicroelectronics N.V.
  • 10.17 Texas Instruments Incorporated
  • 10.18 Toshiba Electronic Devices & Storage Corporation
  • 10.19 Vishay Intertechnology, Inc.