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市場調查報告書
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1750331

功率分立元件和模組市場機會、成長動力、產業趨勢分析及 2025 - 2034 年預測

Power Discrete and Modules Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034

出版日期: | 出版商: Global Market Insights Inc. | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年,全球功率分立元件和模組市場規模達298億美元,預計到2034年將以6.1%的複合年成長率成長,達到534億美元,這得益於消費電子、資料中心和5G基礎設施等高成長產業不斷成長的需求。在這些應用中,採用先進的電力電子技術對於提高效率、小型化和性能至關重要。隨著設備變得更加智慧和功率密度更高,IGBT、MOSFET和功率模組等元件對於管理能耗、熱效率和開關速度至關重要。

功率分立元件和模組市場 - IMG1

在川普政府時期實施的貿易關稅提高了關鍵材料和零件的進口成本,給美國半導體製造商帶來了壓力。許多在美國市場營運的公司採取了本地化生產、重組供應鏈以及投資區域晶圓製造設施的措施。全球企業,尤其是亞洲企業,也加大了對GaN和SiC技術的研發力度,以減少對外國的依賴。這些地緣政治變化顯著影響了整個產業的採購模式、定價策略和創新時間表。此外,從個人設備到智慧家電,消費性電子產品的持續崛起,強化了分立電源解決方案在高頻緊湊環境中的作用。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 298億美元
預測值 534億美元
複合年成長率 6.1%

2024年,功率模組市場規模達124億美元。其高需求源自於其卓越的散熱性能、緊湊的設計和強大的功率處理能力,這些特性對於電動車、工業驅動和再生能源系統至關重要。隨著風力渦輪機、太陽能發電場和電動車充電網路的不斷發展,高壓功率模組(尤其是基於SiC的模組)的部署正在迅速擴展。

功率分立元件和模組市場中的MOSFET細分市場在2024年達到87億美元,這得益於其在中低功率應用的高效率和可靠性。 MOSFET在消費性電子、汽車控制單元和快速充電技術中的突出地位反映了其在外形尺寸和開關性能方面的多功能性和持續創新。基於GaN的MOSFET變體推動了需要緊湊型高速開關的應用的成長。

2024年,美國功率分立元件和模組市場規模達79億美元,這得益於電動車需求的成長、太陽能和風能基礎設施的大規模投資,以及國防和航太應用中功率模組的使用增加。工業自動化是另一個關鍵促進因素,分離式元件可協助打造節能高效、反應迅速的智慧工廠系統。美國向清潔能源和電動出行的轉變加速了高性能功率元件的整合,尤其是在電動車充電站、電池管理系統和可再生能源逆變器等應用中。

該行業的主要參與者包括Powerex、Littelfuse、英飛凌科技、丹佛斯、意法半導體、富士電機、德州儀器、羅姆半導體、瑞薩電子、賽米控、微芯科技、東芝、安森美半導體、威世科技、Wolfspeed、三菱電機和三墾電氣。為了維持競爭優勢,領導企業正在推動寬禁帶技術(SiC/GaN),以提高產品效率和熱性能。他們也正在擴大製造能力,組成供應鏈聯盟,並進行策略性合併,以加強垂直整合並服務高成長的區域市場。

目錄

第1章:方法論與範圍

第2章:執行摘要

第3章:行業洞察

  • 產業生態系統分析
  • 川普政府關稅
    • 對貿易的影響
      • 貿易量中斷
      • 報復措施
    • 對產業的影響
      • 供應方影響(原料)
        • 主要材料價格波動
        • 供應鏈重組
        • 生產成本影響
      • 需求面影響(售價)
        • 價格傳導至終端市場
        • 市佔率動態
        • 消費者反應模式
    • 受影響的主要公司
    • 策略產業反應
      • 供應鏈重組
      • 定價和產品策略
      • 政策參與
    • 展望與未來考慮
  • 產業衝擊力
    • 成長動力
      • 智慧電網和智慧電錶的普及率不斷上升
      • 擴大再生能源基礎設施
      • 5G基礎設施和資料中心的擴展
      • 消費性電子產品的成長
      • 寬頻隙半導體的進展
    • 產業陷阱與挑戰
      • 寬頻隙技術成本高
      • 設計複雜性和整合問題
  • 成長潛力分析
  • 監管格局
  • 技術格局
  • 未來市場趨勢
  • 差距分析
  • 波特的分析
  • PESTEL分析

第4章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 主要市場參與者的競爭分析
  • 競爭定位矩陣
  • 策略儀表板

第5章:市場估計與預測:按類型,2021 年至 2034 年

  • 主要趨勢
  • 功率分立元件
  • 電源模組

第6章:市場估計與預測:按組件,2021 年至 2034 年

  • 主要趨勢
  • 閘流管
  • 二極體
  • 整流器
  • 場效電晶體
  • 絕緣柵雙極電晶體(IGBT)
  • 其他

第7章:市場估計與預測:按材料,2021 年至 2034 年

  • 主要趨勢
  • 碳化矽
  • 氮化鎵
  • 其他

第 8 章:市場估計與預測:按應用,2021 年至 2034 年

  • 主要趨勢
  • 電信和資料中心
  • 工業的
  • 汽車
  • 再生能源
  • 消費性電子產品
  • 其他

第9章:市場估計與預測:按地區,2021 年至 2034 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 西班牙
    • 義大利
    • 荷蘭
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中東和非洲
    • 沙烏地阿拉伯
    • 南非
    • 阿拉伯聯合大公國

第10章:公司簡介

  • Danfoss
  • Fuji Electric
  • Infineon Technologies
  • Littelfuse
  • Microchip Technology
  • Mitsubishi Electric
  • ON Semiconductor
  • Powerex
  • Renesas Electronics
  • ROHM Semiconductor
  • Sanken Electric
  • Semikron
  • STMicroelectronics
  • Texas Instruments
  • Toshiba
  • Vishay Intertechnology
  • Wolfspeed
簡介目錄
Product Code: 13770

The Global Power Discrete and Modules Market was valued at USD 29.8 billion in 2024 and is estimated to grow at a CAGR of 6.1% to reach USD 53.4 billion by 2034, fueled by rising demand from high-growth industries such as consumer electronics, data centers, and 5G infrastructure. Adopting advanced power electronics has become critical in these applications to support efficiency, miniaturization, and performance. As devices become smarter and power-dense, components like IGBTs, MOSFETs, and power modules are essential to managing energy use, thermal efficiency, and switching speed.

Power Discrete and Modules Market - IMG1

Trade tariffs enacted during the Trump administration placed pressure on US-based semiconductor manufacturers by raising import costs for critical materials and components. Many companies operating in the US market responded by localizing production, reengineering their supply chains, and investing in regional wafer fabrication facilities. Global players, particularly in Asia, also ramped up R&D around GaN and SiC technologies to reduce foreign dependency. These geopolitical shifts significantly influenced procurement patterns, pricing strategies, and innovation timelines across the industry. Moreover, the continued rise of consumer electronics, from personal devices to smart appliances, reinforces the role of discrete power solutions in high-frequency, compact environments.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$29.8 Billion
Forecast Value$53.4 Billion
CAGR6.1%

In 2024, the power module segment generated USD 12.4 billion. Its high demand stems from superior heat dissipation, compact design, and power-handling capability critical in EVs, industrial drives, and renewable energy systems. With the continued development of wind turbines, solar farms, and EV charging networks, the deployment of high-voltage power modules, especially those based on SiC, is expanding rapidly.

MOSFETs segment in the power discrete and modules market accounted for USD 8.7 billion in 2024 due to their high efficiency and reliability in low- to mid-power applications. Their prominence in consumer gadgets, automotive control units, and fast-charging technologies reflects their versatility and ongoing innovation in form factor and switching performance. GaN-based variants push growth in applications requiring compact high-speed switching.

U.S. Power Discrete and Modules Market was valued at USD 7.9 billion in 2024, driven by rising EV demand, large-scale investments in solar and wind infrastructure, and increased use of power modules in defense and aerospace applications. Industrial automation is another key driver, where discrete components enable power-efficient, responsive smart factory systems. The country's shift toward clean energy and electrified mobility has accelerated the integration of high-performance power devices, particularly in applications like EV charging stations, battery management systems, and renewable inverters.

Key players in the industry include Powerex, Littelfuse, Infineon Technologies, Danfoss, STMicroelectronics, Fuji Electric, Texas Instruments, ROHM Semiconductor, Renesas Electronics, Semikron, Microchip Technology, Toshiba, ON Semiconductor, Vishay Intertechnology, Wolfspeed, Mitsubishi Electric, and Sanken Electric. To maintain a competitive edge, leading firms are advancing wide-bandgap technology (SiC/GaN), enhancing product efficiency and thermal performance. They are also expanding fabrication capacity, forming supply chain alliances, and pursuing strategic mergers to strengthen vertical integration and serve high-growth regional markets.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definitions
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Base estimates and calculations
    • 1.3.1 Base year calculation
    • 1.3.2 Key trends for market estimation
  • 1.4 Forecast model
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
    • 1.5.2 Data mining sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Trump administration tariffs
    • 3.2.1 Impact on trade
      • 3.2.1.1 Trade volume disruptions
      • 3.2.1.2 Retaliatory measures
    • 3.2.2 Impact on the industry
      • 3.2.2.1 Supply-side impact (raw materials)
        • 3.2.2.1.1 Price volatility in key materials
        • 3.2.2.1.2 Supply chain restructuring
        • 3.2.2.1.3 Production cost implications
      • 3.2.2.2 Demand-side impact (selling price)
        • 3.2.2.2.1 Price transmission to end markets
        • 3.2.2.2.2 Market share dynamics
        • 3.2.2.2.3 Consumer response patterns
    • 3.2.3 Key companies impacted
    • 3.2.4 Strategic industry responses
      • 3.2.4.1 Supply chain reconfiguration
      • 3.2.4.2 Pricing and product strategies
      • 3.2.4.3 Policy engagement
    • 3.2.5 Outlook and future considerations
  • 3.3 Industry impact forces
    • 3.3.1 Growth drivers
      • 3.3.1.1 Rising adoption of smart grids & smart meters
      • 3.3.1.2 Expansion of renewable energy infrastructure
      • 3.3.1.3 Expansion of 5G infrastructure & data centres
      • 3.3.1.4 Growth in consumer electronics
      • 3.3.1.5 Advancements in wide-bandgap semiconductors
    • 3.3.2 Industry pitfalls and challenges
      • 3.3.2.1 High cost of wide-bandgap technologies
      • 3.3.2.2 Design complexity and integration issues
  • 3.4 Growth potential analysis
  • 3.5 Regulatory landscape
  • 3.6 Technology landscape
  • 3.7 Future market trends
  • 3.8 Gap analysis
  • 3.9 Porter's analysis
  • 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategy dashboard

Chapter 5 Market Estimates and Forecast, By Type, 2021 – 2034 (USD Billion & Million Units)

  • 5.1 Key trends
  • 5.2 Power discrete
  • 5.3 Power module

Chapter 6 Market Estimates and Forecast, By Component, 2021 – 2034 (USD Billion & Million Units)

  • 6.1 Key trends
  • 6.2 Thyristor
  • 6.3 Diode
  • 6.4 Rectifier
  • 6.5 MOSFET
  • 6.6 IGBT
  • 6.7 Others

Chapter 7 Market Estimates and Forecast, By Material, 2021 – 2034 (USD Billion & Million Units)

  • 7.1 Key trends
  • 7.2 Si
  • 7.3 SiC
  • 7.4 GaN
  • 7.5 Others

Chapter 8 Market Estimates and Forecast, By Application, 2021 – 2034 (USD Billion & Million Units)

  • 8.1 Key trends
  • 8.2 Telecom & data centers
  • 8.3 Industrial
  • 8.4 Automotive
  • 8.5 Renewable energy
  • 8.6 Consumer electronics
  • 8.7 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 – 2034 (USD Billion & Million Units)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 France
    • 9.3.4 Spain
    • 9.3.5 Italy
    • 9.3.6 Netherlands
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 Australia
    • 9.4.5 South Korea
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Argentina
  • 9.6 Middle East and Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 South Africa
    • 9.6.3 UAE

Chapter 10 Company Profiles

  • 10.1 Danfoss
  • 10.2 Fuji Electric
  • 10.3 Infineon Technologies
  • 10.4 Littelfuse
  • 10.5 Microchip Technology
  • 10.6 Mitsubishi Electric
  • 10.7 ON Semiconductor
  • 10.8 Powerex
  • 10.9 Renesas Electronics
  • 10.10 ROHM Semiconductor
  • 10.11 Sanken Electric
  • 10.12 Semikron
  • 10.13 STMicroelectronics
  • 10.14 Texas Instruments
  • 10.15 Toshiba
  • 10.16 Vishay Intertechnology
  • 10.17 Wolfspeed