查看購物車
  • Simplified Chinese
  • English
封面
市場調查報告書
商品編碼
1721628

下一代非揮發性記憶體市場機會、成長動力、產業趨勢分析及 2025 - 2034 年預測

Next Generation Non Volatile Memory Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034
出版日期: | 出版商: Global Market Insights Inc. | 英文 190 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2024 年全球新一代非揮發性記憶體市場價值為 82 億美元，預計到 2034 年將以 14.4% 的複合年成長率成長，達到 311 億美元。這一成長主要得益於對高效能、低功耗記憶體技術日益成長的需求，這些技術可以支援人工智慧和機器學習中的新興應用。隨著人工智慧工作負載變得越來越複雜，傳統的記憶體架構無法滿足延遲和功率效率要求。相比之下，MRAM 和 ReRAM 等先進的記憶體解決方案可提供更快的資料存取速度並降低能耗，滿足現代運算需求。各行各業都在加速採用這些技術，尋求在資料密集型環境中實現最佳化的效能和低功耗功能。

下一代非揮發性記憶體市場 - IMG1

隨著邊緣運算和物聯網 (IoT) 的廣泛應用，對嵌入式 NVM 的需求正在呈現顯著成長動能。這些記憶體解決方案提供低延遲和能源效率，這在遠端、電力受限的環境中至關重要。從智慧型穿戴裝置到工業物聯網應用，對即時、本地化資料處理的追求正在提高對能夠在各種用例中可靠運行的嵌入式記憶體的需求。不斷發展的 5G 基礎設施和 AI 與互聯生態系統的整合進一步推動了對能夠在不同工作負載下持續運行的記憶體解決方案的需求。隨著智慧家庭、自動化系統和醫療保健監控工具的發展，它們越來越依賴支援長運行生命週期的安全、高耐用性的記憶體技術。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 82億美元
預測值 311億美元
複合年成長率 14.4%

根據產品類型，市場分為 MRAM、ReRAM、PCM、FeRAM/F-RAM 等。其中，MRAM在2024年的估值為38億美元，其提供接近DRAM的速度和高耐用性，非常適合頻繁讀寫的功能，尤其是在高效能運算應用中。同時，ReRAM 和 FeRAM 也因其可擴展性和快速切換能力而受到青睞，滿足了消費和工業應用的需求。

根據晶圓尺寸，市場包括 200 毫米和 300 毫米類別。光是 200 毫米晶圓市場在 2024 年的價值就達到 35 億美元。這些晶圓對於在成本效率是首要考慮因素的應用中製造嵌入式 NVM 仍然非常重要，尤其是在汽車和工業領域。儘管晶圓技術不斷進步，200 毫米晶圓廠仍能提供性能和價格之間的平衡組合。

按產業垂直分析，下一代 NVM 市場分為 BFSI、IT 和雲端運算、汽車、航太和國防、醫療保健和醫療設備、消費品等。光是 IT 和雲端運算領域在 2024 年就達到了 30 億美元。基於 MRAM 和 ReRAM 的持久記憶體解決方案的部署日益增多，以提高伺服器速度並減少資料密集型工作負載的處理延遲。

從地區來看，美國將佔據全球主導地位，預計到 2034 年其市場規模將達到 80 億美元。

非揮發性記憶體（NVM）市場競爭激烈，三星、美光、英特爾、GlobalFoundries 和 SK HYNIX 等頂級公司佔據了 62.3% 的佔有率。這些領導者正在加大 MRAM、ReRAM 和 FeRAM 技術的研發力度，為人工智慧、汽車和資料中心應用提供高速、低功耗的解決方案。三星與汽車製造商的合作等策略合作夥伴關係正在加強市場地位。永續性也是一個主要關注點，該公司正在開發超低功耗 NVM 以符合全球碳目標。製造商正在為物聯網、邊緣和神經形態處理和自動駕駛汽車等高階運算應用提供客製化的、整合人工智慧的記憶體解決方案。

目錄

第1章：方法論與範圍

第2章：執行摘要

第3章：行業洞察

  • 產業生態系統分析
  • 產業衝擊力
    • 成長動力
      • 不斷成長的人工智慧 (AI) 和機器學習 (ML) 應用
      • 崛起的汽車產業
      • 物聯網 (IoT) 設備和邊緣運算的成長
      • 資料中心和雲端運算的激增
    • 產業陷阱與挑戰
      • 製造和研發成本高
      • 與現有系統的複雜整合
  • 成長潛力分析
  • 監管格局
  • 技術格局
  • 未來市場趨勢
  • 差距分析
  • 波特的分析
  • PESTEL分析

第4章：競爭格局

  • 介紹
  • 公司市佔率分析
  • 主要市場參與者的競爭分析
  • 競爭定位矩陣
  • 策略儀表板

第5章：市場估計與預測：依產品類型，2021 - 2034 年

  • 主要趨勢
  • MRAM
  • 電阻式隨機存取記憶體
  • 脈衝編碼調變
  • 鐵RAM/F-RAM
  • 其他

第6章：市場預估與預測：依晶圓尺寸，2021 - 2034

  • 主要趨勢
  • 200毫米
  • 300毫米

第7章：市場估計與預測：按產業垂直，2021 - 2034 年

  • 主要趨勢
  • 金融服務業
  • IT與雲端運算
  • 汽車
  • 航太與國防
  • 醫療保健和醫療器械
  • 消費品
  • 其他

第8章：市場估計與預測：按地區，2021 - 2034 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 西班牙
    • 義大利
    • 荷蘭
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中東和非洲
    • 沙烏地阿拉伯
    • 南非
    • 阿拉伯聯合大公國

第9章：公司簡介

  • SAMSUNG
  • Micron Technology, Inc.
  • Intel Corporation
  • Everspin Technologies Inc.
  • GlobalFoundries
  • CrossBar, Inc.
  • Weebit
  • FUJITSU
  • STMicroelectronics
  • Renesas Electronics Corporation
  • Panasonic Holdings Corporation
  • Infineon Technologies AG
  • Avalanche Technology
  • SK HYNIX INC.
簡介目錄
Product Code: 9734

The Global Next Generation Non Volatile Memory Market was valued at USD 8.2 billion in 2024 and is estimated to grow at a CAGR of 14.4% to reach USD 31.1 billion by 2034. This growth is largely driven by the increasing demand for high-performance, low-power memory technologies that can support emerging applications in AI and machine learning. As AI workloads become more sophisticated, traditional memory architectures fail to meet latency and power efficiency requirements. In contrast, advanced memory solutions like MRAM and ReRAM offer faster data access and reduced energy consumption, aligning with modern computing demands. The adoption of these technologies is accelerating across industries looking for optimized performance and low-power capabilities in data-intensive environments.

Next Generation Non Volatile Memory Market - IMG1

With the expanding use of edge computing and the Internet of Things (IoT), the need for embedded NVM is witnessing significant momentum. These memory solutions offer low latency and energy efficiency, which are essential in remote, power-constrained environments. From smart wearables to industrial IoT applications, the push for real-time, localized data processing is raising the demand for embedded memory that can function reliably in diverse use cases. The growing 5G infrastructure and integration of AI into connected ecosystems are further fueling the need for memory solutions that can perform consistently under varying workloads. As smart homes, automation systems, and healthcare monitoring tools evolve, they increasingly rely on secure, high-endurance memory technologies that support long operational lifecycles.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$8.2 Billion
Forecast Value$31.1 Billion
CAGR14.4%

The market based on product type is segmented into MRAM, ReRAM, PCM, FeRAM/F-RAM, and others. Among these, MRAM held a valuation of USD 3.8 billion in 2024. Its ability to deliver near-DRAM speed and high durability makes it ideal for frequent read/write functions, especially in high-performance computing applications. Meanwhile, ReRAM and FeRAM are also gaining traction due to their scalability and fast switching capabilities, meeting requirements across both consumer and industrial applications.

Based on wafer size, the market includes 200 mm and 300 mm categories. The 200 mm wafer segment alone was valued at USD 3.5 billion in 2024. These wafers remain highly relevant for manufacturing embedded NVMs in applications where cost efficiency is a top priority, especially in the automotive and industrial sectors. Despite advances in wafer technology, 200 mm fabs continue to offer a balanced combination of performance and affordability.

When analyzed by industry vertical, the next-generation NVM market is categorized into BFSI, IT and cloud computing, automotive, aerospace and defense, healthcare and medical devices, consumer goods, and others. The IT and cloud computing segment alone accounted for USD 3 billion in 2024. Persistent memory solutions based on MRAM and ReRAM are increasingly deployed to improve server speed and reduce processing latency in data-intensive workloads.

Regionally, the United States is set to dominate the global landscape, with the country's market projected to hit USD 8 billion by 2034.

The non-volatile memory (NVM) market is fiercely competitive, with top players like SAMSUNG, Micron, Intel, GlobalFoundries, and SK HYNIX commanding 62.3% of the share. These leaders are ramping up R&D in MRAM, ReRAM, and FeRAM technologies to deliver high-speed, low-power solutions for AI, automotive, and data center applications. Strategic partnerships, such as Samsung's collaborations with automakers, are strengthening market presence. Sustainability is also a major focus, with firms developing ultra-low-power NVMs to align with global carbon goals. Manufacturers are offering customized, AI-integrated memory solutions for IoT, edge, and advanced computing applications like neuromorphic processing and autonomous vehicles.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definitions
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Base estimates and calculations
    • 1.3.1 Base year calculation
    • 1.3.2 Key trends for market estimation
  • 1.4 Forecast model
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
    • 1.5.2 Data mining sources

Chapter 2 Executive Summary

  • 2.1 Industry 3600 synopsis

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Growing artificial intelligence (AI) and machine learning (ML) applications
      • 3.2.1.2 Rising automotive industry
      • 3.2.1.3 Growth in Internet of Things (IoT) devices and edge computing
      • 3.2.1.4 Proliferation of data centers and cloud computing
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High manufacturing and R&D costs
      • 3.2.2.2 Complex integration with existing systems
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
  • 3.5 Technology landscape
  • 3.6 Future market trends
  • 3.7 Gap analysis
  • 3.8 Porter’s analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategy dashboard

Chapter 5 Market Estimates & Forecast, By Product Type, 2021 - 2034 (USD Million & Million Units)

  • 5.1 Key trends
  • 5.2 MRAM
  • 5.3 ReRAM
  • 5.4 PCM
  • 5.5 FeRAM/F-RAM
  • 5.6 Others

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021 - 2034 (USD Million & Million Units)

  • 6.1 Key trends
  • 6.2 200 mm
  • 6.3 300 mm

Chapter 7 Market Estimates & Forecast, By Industry Vertical, 2021 - 2034 (USD Million & Million Units)

  • 7.1 Key trends
  • 7.2 BFSI
  • 7.3 IT & cloud computing
  • 7.4 Automotive
  • 7.5 Aerospace & defense
  • 7.6 Healthcare & medical devices
  • 7.7 Consumer goods
  • 7.8 Others

Chapter 8 Market Estimates and Forecast, By Region, 2021 - 2034 (USD Million & Million Units)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 France
    • 8.3.4 Spain
    • 8.3.5 Italy
    • 8.3.6 Netherlands
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 Australia
    • 8.4.5 South Korea
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
    • 8.5.3 Argentina
  • 8.6 Middle East and Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 South Africa
    • 8.6.3 UAE

Chapter 9 Company Profiles

  • 9.1 SAMSUNG
  • 9.2 Micron Technology, Inc.
  • 9.3 Intel Corporation
  • 9.4 Everspin Technologies Inc.
  • 9.5 GlobalFoundries
  • 9.6 CrossBar, Inc.
  • 9.7 Weebit
  • 9.8 FUJITSU
  • 9.9 STMicroelectronics
  • 9.10 Renesas Electronics Corporation
  • 9.11 Panasonic Holdings Corporation
  • 9.12 Infineon Technologies AG
  • 9.13 Avalanche Technology
  • 9.14 SK HYNIX INC.