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市場調查報告書
商品編碼
1639241

剛性-軟性 PCB 市場機會、成長動力、產業趨勢分析與 2024 - 2032 年預測

Rigid-Flex PCB Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032
出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球剛性-軟性PCB 市場將於2023 年達到221 億美元，預計2024 年至2032 年複合年成長率為10.9%。 這種成長是由高密度電路解決方案的日益採用所推動的，特別是在物網路、穿戴式裝置、以及醫療科技不斷進步。隨著工業電子產品的擴展，對剛柔結合 PCB 的需求不斷成長，特別是在工廠和建築自動化等領域，這些 PCB 在提高系統性能和減少空間需求方面發揮著至關重要的作用。

剛撓結合板是工業自動化系統不可或缺的一部分，用於機器人、控制單元和人機介面 (HMI) 等應用。它們的靈活性、緊湊設計和耐用性使它們成為這些複雜系統的理想選擇，可以在狹小空間內進行高效佈線，同時確保連續使用下的可靠運作。同樣，在管理照明、HVAC 和安全的建築自動化系統中，剛柔結合 PCB 允許高密度元件安裝，從而促進更智慧、更有效率的系統的開發。

然而，市場面臨挑戰，包括與剛柔結合 PCB 相關的高製造複雜性和成本。生產過程涉及幾個複雜的步驟，包括黏合軟性層和剛性層、創建多層結構以及確保精確對齊以避免缺陷。這些增加的複雜性導致更高的生產成本，因為製造商需要使用專門的材料、先進的設備和更長的加工時間來確保電路板符合所需的性能標準。

市場範圍
開始年份 2023年
預測年份 2024-2032
起始值 221億美元
預測值 556 億美元
複合年成長率 10.9%

市場按產品類型細分，多層軟性 PCB 佔據最大佔有率。由於汽車、航太和消費電子等產業對緊湊、高密度解決方案的需求不斷成長，預計到 2023 年，該細分市場將達到 74 億美元。多層軟性 PCB 因其增強的靈活性和耐用性而受到特別重視，使其成為需要小型化和複雜電路設計的應用的理想選擇。

剛撓結合板市場也按最終用途產業進行細分，包括航太和國防、汽車、消費性電子、工業、IT 和電信、醫療保健等。其中，受智慧型手機、穿戴式裝置和智慧家居產品等設備小型化和先進技術需求不斷成長的推動，消費性電子產業佔據最大的市場佔有率。由於需要能夠支援高性能、空間受限的設計的緊湊、可靠且耐用的組件，推動了消費性電子產品中剛柔結合 PCB 的採用。

2023年美國剛撓性PCB航太為77.86%。物聯網的擴展以及對更小、更有效率設備的需求不斷增加，顯著增加了對高效能、緊湊型剛撓結合板的需求。特別是，汽車行業，包括電動車 (EV) 領域，由於其耐用性和節省空間的優勢，擴大採用剛柔結合 PCB。

目錄

第 1 章：方法與範圍

第 2 章：執行摘要

第 3 章：產業洞察

  • 產業生態系統分析
    • 影響價值鏈的因素
    • 利潤率分析
    • 干擾
    • 未來展望
    • 製造商
    • 經銷商
  • 供應商格局
  • 利潤率分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
  • 成長動力
      • 車輛中電子系統的整合度不斷提高
      • 5G網路和物聯網設備快速擴展
      • 工業自動化需求激增
      • 電子產品小型化趨勢日益明顯
      • 在資料中心和高效能運算中的使用不斷成長
  • 產業陷阱與挑戰
      • 製造複雜度高、成本高
      • 與設計和可靠性相關的挑戰
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章：競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章：市場估計與預測：依產品類型，2021-2032

  • 主要趨勢
  • 單面軟性
  • 雙面軟性
  • 多層軟性
  • 多層線路板
  • 快點剛撓結合板

第 6 章：市場估計與預測：依層數，2021-2032

  • 主要趨勢
  • 單層
  • 雙層
  • 多層

第 7 章：市場估計與預測：依彈性類型，2021-2032 年

  • 主要趨勢
  • 靜態彎曲
  • 動態彎曲

第 8 章：市場估計與預測：按材料分類，2021-2032 年

  • 主要趨勢
  • FR4
  • 聚醯亞胺
  • 羅傑斯
  • 其他

第 9 章：市場估計與預測：依最終用途產業 2021-2032 年

  • 主要趨勢
  • 航太和國防
  • 汽車
  • 消費性電子產品
  • 工業的
  • 資訊科技和電信
  • 衛生保健
  • 其他（例如能源、交通）

第 10 章：市場估計與預測：按地區分類，2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國

第 11 章：公司簡介

  • Zhen Ding Technology Holding Limited
  • Nippon Mektron, Ltd.
  • Sumitomo Electric Industries, Ltd.
  • Unimicron Technology Corporation
  • Interflex Co., Ltd.
  • Young Poong Electronics Co., Ltd.
  • TTM Technologies, Inc.
  • Multek (a Flex Company)
  • Shengyi Technology Co., Ltd.
  • AT&S Austria Technologie & Systemtechnik AG
  • Meiko Electronics Co., Ltd.
  • Kinwong Electronic Co., Ltd.
  • Sierra Circuits, Inc.
  • Eltek Ltd.
  • Jabil Circuit, Inc.
  • Samsung Electro-Mechanics
  • Wurth Elektronik GmbH & Co. KG
  • Shenzhen Kinwong Electronic Co., Ltd.
  • Flex PCB (Printed Circuits LLC)
簡介目錄
Product Code: 12297

The Global Rigid-Flex PCB Market reached USD 22.1 billion in 2023 and is projected to grow at 10.9% CAGR from 2024 to 2032. This growth is driven by the increasing adoption of high-density circuit solutions, particularly as industries like IoT, wearables, and medical technology continue to advance. The demand for rigid-flex PCBs is rising as industrial electronics expand, especially in sectors like factory and building automation, where these PCBs play a crucial role in improving system performance and reducing space requirements.

Rigid-flex PCBs are integral to industrial automation systems, where they are used in applications such as robotics, control units, and human-machine interfaces (HMIs). Their flexibility, compact design, and durability make them ideal for these complex systems, allowing for efficient wiring in tight spaces while ensuring reliable operation under continuous use. Similarly, in building automation systems that manage lighting, HVAC, and security, rigid-flex PCBs allow high-density component mounting, facilitating the development of smarter, more efficient systems.

However, the market faces challenges, including the high manufacturing complexity and cost associated with rigid-flex PCBs. The production process involves several intricate steps, including bonding flexible and rigid layers, creating multi-layered structures, and ensuring precise alignment to avoid defects. These added complexities result in higher production costs, as manufacturers need to use specialized materials, advanced equipment, and longer processing times to ensure the boards meet the required performance standards.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$22.1 Billion
Forecast Value$55.6 Billion
CAGR10.9%

The market is segmented by product type, with multi-layer flex PCBs holding the largest share. This segment is expected to reach USD 7.4 billion by 2023, driven by the growing need for compact, high-density solutions across industries such as automotive, aerospace, and consumer electronics. Multi-layer flex PCBs are particularly valued for their enhanced flexibility and durability, making them ideal for applications that require miniaturization and complex circuit designs.

The rigid-flex PCB market is also segmented by end-use industries, including aerospace and defense, automotive, consumer electronics, industrial, IT and telecommunications, healthcare, and others. Among these, the consumer electronics sector holds the largest market share, driven by increasing demand for miniaturization and advanced technology in devices like smartphones, wearables, and smart home products. The adoption of rigid-flex PCBs in consumer electronics is fueled by the need for compact, reliable, and durable components capable of supporting high-performance, space-constrained designs.

U.S. rigid-flex PCB market generated 77.86% share in 2023. The growth of the U.S. rigid-flex PCB industry is fueled by the rising demand in sectors such as advanced consumer electronics, automotive electronics, and aerospace. The expansion of the IoT and the increasing need for smaller, more efficient devices have significantly boosted the demand for high-performance, compact rigid-flex PCBs. In particular, the automotive industry, including the electric vehicle (EV) segment, is increasingly adopting rigid-flex PCBs due to their durability and space-saving advantages.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
  • 3.7 Growth drivers
      • 3.7.1.1 Rising integration of electronic systems in vehicles
      • 3.7.1.2 Rapid expansion of 5G networks and IoT devices
      • 3.7.1.3 Surging demand in industrial automation
      • 3.7.1.4 Increasing trend of miniaturization in electronics
      • 3.7.1.5 Growing use in data centers and high-performance computing
  • 3.8 Industry pitfalls & challenges
      • 3.8.1.1 High manufacturing complexity and cost
      • 3.8.1.2 Challenges associated with design and reliability
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Product Type, 2021-2032 (USD Billion & Units)

  • 5.1 Key trends
  • 5.2 Single-sided flex
  • 5.3 Double-sided flex
  • 5.4 Multi-layer flex
  • 5.5 Multilayer PCB
  • 5.6 Quick turn rigid flex PCB

Chapter 6 Market Estimates & Forecast, By Layer Count, 2021-2032 (USD Billion & Units)

  • 6.1 Key trends
  • 6.2 Single layer
  • 6.3 Double layer
  • 6.4 Multi-Layer

Chapter 7 Market Estimates & Forecast, By Flexibility Type, 2021-2032 (USD Billion & Units)

  • 7.1 Key trends
  • 7.2 Static flex
  • 7.3 Dynamic flex

Chapter 8 Market Estimates & Forecast, By Materials, 2021-2032 (USD Billion & Units)

  • 8.1 Key trends
  • 8.2 FR4
  • 8.3 Kapton
  • 8.4 Rogers
  • 8.5 Others

Chapter 9 Market Estimates & Forecast, By End Use Industry 2021-2032 (USD Billion & Units)

  • 9.1 Key trends
  • 9.2 Aerospace and defense
  • 9.3 Automotive
  • 9.4 Consumer electronics
  • 9.5 Industrial
  • 9.6 IT and telecommunications
  • 9.7 Healthcare
  • 9.8 Others (e.g., Energy, Transportation)

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion & Units)

  • 10.1 Key trends
  • 10.2 North America
    • 10.2.1 U.S.
    • 10.2.2 Canada
  • 10.3 Europe
    • 10.3.1 UK
    • 10.3.2 Germany
    • 10.3.3 France
    • 10.3.4 Italy
    • 10.3.5 Spain
    • 10.3.6 Russia
  • 10.4 Asia Pacific
    • 10.4.1 China
    • 10.4.2 India
    • 10.4.3 Japan
    • 10.4.4 South Korea
    • 10.4.5 Australia
  • 10.5 Latin America
    • 10.5.1 Brazil
    • 10.5.2 Mexico
  • 10.6 MEA
    • 10.6.1 South Africa
    • 10.6.2 Saudi Arabia
    • 10.6.3 UAE

Chapter 11 Company Profiles

  • 11.1 Zhen Ding Technology Holding Limited
  • 11.2 Nippon Mektron, Ltd.
  • 11.3 Sumitomo Electric Industries, Ltd.
  • 11.4 Unimicron Technology Corporation
  • 11.5 Interflex Co., Ltd.
  • 11.6 Young Poong Electronics Co., Ltd.
  • 11.7 TTM Technologies, Inc.
  • 11.8 Multek (a Flex Company)
  • 11.9 Shengyi Technology Co., Ltd.
  • 11.10 AT&S Austria Technologie & Systemtechnik AG
  • 11.11 Meiko Electronics Co., Ltd.
  • 11.12 Kinwong Electronic Co., Ltd.
  • 11.13 Sierra Circuits, Inc.
  • 11.14 Eltek Ltd.
  • 11.15 Jabil Circuit, Inc.
  • 11.16 Samsung Electro-Mechanics
  • 11.17 Wurth Elektronik GmbH & Co. KG
  • 11.18 Shenzhen Kinwong Electronic Co., Ltd.
  • 11.19 Flex PCB (Printed Circuits LLC)