全球MicroLED顯示器市場：COG、COB和MIP

Global MicroLED Display Market Report: COG, COB & MIP

出版日期: 2025年09月26日 | 出版商:

Futuresource Consulting Ltd. | 英文 108 Pages | 商品交期: 請詢問到貨日

價格

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簡介目錄

真正的MicroLED技術，即在TFT背板上大規模印刷小於100微米的晶片，是一項顛覆性技術，代表著策略轉型。未來十年，商用顯示器和消費電視市場規模預計將累計達634億美元。

自Futuresource上次發布報告以來，受多種因素驅動，市場預測成長了27%。光是過去兩年，技術和製造能力就取得了顯著進步，生態系賦能者數量翻了一番，生態系集群數量更是增加了兩倍。

本報告概述了真正的MicroLED技術的持續影響，預測到2026年，市場複合年增長率將達到101%。報告也探討了這一成長的時間表以及相關的市場格局。

市場趨勢

真正的MicroLED，廣義定義為在TFT背板上大規模印刷的小於100微米的晶片，是一項顛覆性技術，標誌著一個重要的戰略轉折點。

未來五年，由於卓越的視覺性能和更低的總體擁有成本（TCO），DVLED行業預計將經歷從封裝式（SMD、IMD、MiP）顯示器到非封裝式（CoB、COG）顯示器的重大技術轉變。到2029年，非封裝式顯示器將在像素間距小於1.6毫米的市場佔據主導地位，而封裝式顯示器將在像素間距大於1.7毫米的市場繼續佔據主導地位。

CoG顯示器正吸引著大型、實力雄厚的LCD面板製造商的濃厚興趣，他們願意利用自身的製造專長和現有晶圓廠，並大力投資研發，專注於玻璃背板技術。迄今為止，試播製作非常有限，但隨著專業視聽（Pro AV）的日益普及，預計未來幾年試播製作將迅速增加。

報告方法和範圍
摘要整理
技術趨勢
SMD/IMD、MiniLED 和 MicroLED 的發展趨勢
顯示技術對比
專業視聽領域的共存
製造工藝
製造業概述
元件
質量傳輸
模組化
系統設計
MicroLED 障礙概述
挑戰：技術
晶片組
單片 MicroLED 與量子點組合
背板、驅動 IC
製造/生態系統挑戰
半導體
質量傳輸
生態系叢集更新
市場影響
市場概覽
價值鏈參與者的角色
差異化機會：專業視聽產品
差異化機會：消費性電子產品

簡介目錄

True MicroLED, now broadly defined as smaller than 100-micron chiplets mass transferred onto a TFT backplane, is a disruptive technology driving a major strategic inflection point. It is forecasted to reach a cumulative $63.4bn (USD) market opportunity for commercial displays and consumer televisions over the next decade.

Since Futuresource's last report, the market outlook has increased by 27% due to a mix of factors. In the last two years alone, technology and manufacturing capabilities have advanced significantly, alongside the doubling of identified ecosystem enablers and the tripling of definable ecosystem clusters.

The updated report outlines the continued impact of True MicroLED, and provides a market forecast of 101% CAGR through 2026. The report explores the timeline of this growth and the accompanying marketplace conditions.

Market Trends:

True MicroLED, now broadly defined as smaller than 100-micron chiplets mass transferred onto a TFT backplane, is a disruptive technology driving a major strategic inflection point.

Over the next five years, a significant technology transition will occur shifting the DVLED industry to unpackaged variants (CoB and COG) from packaged alternatives (SMD, IMD and MiP) due to superior visual per visual performance and lower Total Cost of Ownership (TCO). By 2029, unpackaged variants will be predominant at pixel pitches 1.6mm and below while packaged versions will remain dominate at 1.7mm and above.

CoG is garnering significant interest from large and powerful LCD panel manufacturers who are motivated to leverage their manufacturing expertise and existing fabs with significant investment in R&D to focus on a glass backplane, which has great potential to drive manufacturing costs down to spur widespread adoption. To date, pilot production is very limited but expected to ramp over the next few years, driven by Pro AV adoption.

Areas Explored:

Market sizing and market forecasting
Pro AV tiled video walls and All-In-One (AIO) as well as Consumer Electronics (CE) television markets and applications
While MicroLED technology will likely apply to monitors, laptops, tablets, smartphones, watches, embedded displays, automotive, augmented reality (AR), virtual reality (VR) among other markets and applications, these technologies are outside of the scope of this analysis.

Did you know?

Futuresource has been regularly tracking, researching and consulting on the LED market since 2013, as part of its professional display technology portfolio.

Any enterprise operating within the LED display market and adjacent industries will benefit from this report, particularly: