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1805851

電塗裝銅薄膜的全球市場-產業分析，規模，佔有率，成長，趨勢，預測(2025年～2032年):各厚度，各用途，各地區，各企業

Electrodeposited Copper Foils Market - Global Electrodeposited Copper Foils Industry Analysis, Size, Share, Growth, Trends, and Forecast 2025-2032 - (By Thickness, By Application, By Geographic Coverage and By Company)
出版日期: | 出版商: Fairfield Market Research | 英文 188 Pages | 商品交期: 2-5個工作天內

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簡介目錄

全球電解銅薄膜市場預計將持續擴張，主要受兩大關鍵產業——鋰離子電池 (LiB) 和印刷電路板 (PCB)——的強勁需求驅動。根據最新的市場預測，該行業規模預計將在 2025 年達到 136 億美元，並在 2025 年至 2032 年期間以 9.3% 的強勁複合年增長率增長，最終在 2032 年達到 253 億美元。汽車電氣化的日益普及、再生能源發電系統的快速普及以及下一代電子產品的進步，正在加速這個競爭激烈的產業發展。

市場洞察

電解銅薄膜在各種應用中，在提供導電性、穩定性和結構完整性方面發揮關鍵作用。在印刷電路板 (PCB) 中，它為高性能電子設備提供必要的導電層；在鋰離子電池中，它充當集電器，確保安全性和能源效率。

市場需求受兩股平行力量的影響：小型電子設備對超薄箔（＜=12 微米）的需求快速成長，以及高能量密度電池組對厚箔的需求不斷增加。這兩大需求為製造商創造了機會，使其能夠在維持穩定品質標準的同時實現產品線多元化。此外，全球供應鏈重組和回收利用措施的增加預計將在預測期內影響原物料供應和價格趨勢。

主要的促進因素

1. 電動車加速發展

全球向電動車的轉變正在顯著改變電解銅薄膜市場。中國、美國和歐洲的電動車銷量正在激增，電池製造商正在大力投資新的超級工廠。每個鋰離子電池都需要大量的銅薄膜作為集流體，這使得該行業成為主要的需求來源。

2. 對先進電子產品的需求不斷成長

消費性電子、通訊和運算設備持續朝著更有效率和小型化的方向發展。 5G、物聯網連接和人工智慧設備的推出，推動了對更高效能PCB的需求。電解銅薄膜提供了支援這些應用所需的精度和一致性。

3. 製造創新

電解技術的進步使得能夠大量生產厚度均勻、表面處理更完善、導電性更強的箔片。箔片柔韌性的創新也支持了柔性PCB的發展，而柔性PCB在汽車電子、穿戴式裝置和醫療保健設備中正變得越來越重要。

機會

電解銅薄膜市場的成長軌跡為多個產業領域提供了機會。能夠生產用於下一代電子產品的超薄箔片和用於長循環電動汽車電池的厚箔片的製造商，預計將抓住新的收入來源。

此外，再生能源儲能系統，尤其是太陽能和風能發電設備，正在成為銅薄膜的新興應用領域。預計在可預見的未來，銅薄膜製造商、電池供應商和電子公司之間的策略合作夥伴關係將會擴大。此外，以永續發展為重點的舉措，例如閉環銅回收，為環保成長和成本優化鋪平了道路。

區域分析

  • 得益於中國、韓國和日本等主要電動車電池製造商的存在，以及強大的PCB製造基礎設施，亞太地區仍然是無可爭議的領先者。政府對電動車普及和再生能源的激勵措施正在推動市場進一步擴張。
  • 北美正在崛起成為一個高成長地區，這得益於美國和加拿大的超級工廠項目、強勁的電動車普及率以及先進的電子技術研究。有利於再生能源應用的政策也為該地區提供了額外的動力。
  • 由於注重永續發展的法規以及對電動車生產和清潔能源儲存的大規模投資，歐洲已成為關鍵市場。歐盟致力於減少二氧化碳排放，這與電池和電子產品對銅薄膜的需求密切相關。
  • 拉丁美洲和中東/非洲仍處於起步階段，但不斷增加對工業電子的投資，加上再生能源項目，可能會帶來穩定的長期商業機會。

主要參與者

競爭格局取決於技術領先地位、產品品質和策略​​合作夥伴關係。主要參與者正在擴大其全球業務並投資研發，以滿足不斷變化的應用需求。以下列出了主要參與者。

  • Doosan Corporation Electro
  • Furukawa Electric Co., Ltd.
  • Fukuda Metal Foil & Powder Co., Ltd.
  • Circuit Foil
  • Chang Chun Group
  • LS Mtron Ltd.
  • Mitsui Mining & Smelting Co., Ltd.
  • JX Nippon Mining & Metals Corporation
  • ILJIN Materials Co., Ltd.
  • Targray Technology International, Inc.
  • Nippon Denkai, Ltd.
  • All Foils, Inc.
  • Oak-Mitsui Technologies LLC
  • Rogers Corporation

各市場區隔

各厚度

  • 12微米以下
  • 13～20微米
  • 21～35微米
  • 36～70微米
  • 超過105微米

各用途

  • 印刷電路板(PCB)
  • 鋰離子電池(LiBs)
  • 其他

各地區

  • 北美
  • 歐洲
  • 亞太地區
  • 南美
  • 中東·非洲

目錄

第1章 摘要整理

  • 全球電塗裝銅薄膜市場概述
  • 未來的預測
  • 主要的市場趨勢
  • 各地區概述(各金額，2025年)
  • 分析師的推薦事項

第2章 市場概要

  • 市場定義和市場區隔
  • 市場動態
    • 促進因素
    • 阻礙因素
    • 市場機會
  • 價值鏈分析
  • COVID-19影響分析
  • 波特的五力分析
  • 俄羅斯·烏克蘭糾紛的影響
  • 大環境分析
  • 法規分析
  • 價格趨勢分析
    • 目前價格與未來的預測，2024～2032年
    • 價格影響要素

第3章 全球電塗裝銅薄膜市場預測，2019年～2032年

  • 全球電塗裝銅薄膜市場預測，各厚度，金額(10億美元)，2019年～2032年
    • ＜＝12????????
    • 13～20微米
    • 21～35微米
    • 36～70微米
    • >105微米
  • 全球電塗裝銅薄膜市場預測，各用途，金額(10億美元)，2019年～2032年
    • 印刷電路板(PCB)
    • 鋰離子電池(LiB)
    • 其他
  • 全球電塗裝銅薄膜市場預測，各地區，金額(10億美元)，2019年～2032年
    • 北美
    • 歐洲
    • 亞太地區
    • 南美
    • 中東·非洲

第4章 北美的電塗裝銅薄膜市場預測，2019年～2032年

第5章 歐洲的電塗裝銅薄膜市場預測，2019年～2032年

第6章 亞太地區的電塗裝銅薄膜市場預測，2019年～2032年

第7章 南美的電塗裝銅薄膜市場預測，2019年～2032年

第8章 中東·bi非洲的電塗裝銅薄膜市場預測，2019年～2032年

第9章 競爭情形

  • 企業對市場區隔熱圖
  • 企業市場佔有率分析，2024年
  • 競爭儀表板
  • 企業簡介
    • Doosan Corporation Electro
    • Furukawa Electric Co., Ltd.
    • Fukuda Metal Foil & Powder Co., Ltd.
    • Circuit Foil
    • Chang Chun Group
    • LS Mtron Ltd.
    • Mitsui Mining & Smelting Co., Ltd.
    • JX Nippon Mining & Metals Corporation
    • ILJIN Materials Co., Ltd.
    • Targray Technology International, Inc.

第10章 附錄

簡介目錄

The global electrodeposited copper foils market is positioned for sustained expansion, underpinned by strong demand from two critical industries-lithium-ion batteries (LiBs) and printed circuit boards (PCBs). As per the latest market projections, the industry is expected to reach a value of US$ 13.6 billion in 2025 and register a robust CAGR of 9.3% during 2025-2032, ultimately attaining a market size of US$ 25.3 billion by 2032. Growing electrification of vehicles, rapid penetration of renewable energy storage systems, and advancements in next-generation electronics are accelerating the momentum of this highly competitive industry.

Market Insights

Electrodeposited copper foils play a vital role in enabling conductivity, stability, and structural integrity in a wide range of applications. In PCBs, they provide the conductive layer necessary for high-performance electronic devices, while in lithium-ion batteries, they serve as current collectors, ensuring safety and energy efficiency.

Market demand is being shaped by two parallel forces: the surging requirement for ultra-thin foils (<=12 µm) for compact electronics and the rising volume of thicker foils required for high-energy-density battery packs. This dual demand is creating opportunities for manufacturers to diversify product lines while maintaining consistent quality standards. Moreover, global supply chain realignments and increasing recycling initiatives are expected to influence raw material availability and pricing trends over the forecast period.

Key Drivers

1. Electric Vehicle Acceleration

The worldwide shift toward electric mobility is a game-changer for the electrodeposited copper foils market. With EV sales surging across China, the U.S., and Europe, battery makers are investing heavily in new gigafactories. Each lithium-ion battery requires significant volumes of copper foils as current collectors, making the sector a leading demand generator.

2. Rising Need for Advanced Electronics

Consumer electronics, telecommunications, and computing devices continue to evolve toward higher efficiency and miniaturization. The rollout of 5G, IoT connectivity, and AI-driven devices is driving demand for PCBs with greater performance capabilities. Electrodeposited copper foils provide the precision and consistency required to support these applications.

3. Manufacturing Innovations

Progress in electrodeposition technology is enabling mass production of foils with uniform thickness, improved surface treatment, and enhanced conductivity. Innovations in foil flexibility also support the development of flexible PCBs, which are increasingly important in automotive electronics, wearables, and healthcare devices.

Business Opportunities

The growth trajectory of the electrodeposited copper foils market offers opportunities across several verticals. Producers with the ability to manufacture ultra-thin foils for next-generation electronics and high-thickness foils for long-cycle EV batteries are well positioned to capture emerging value pools.

Furthermore, renewable energy storage systems-particularly in solar and wind installations-represent a rising application area for copper foils. Strategic partnerships between copper foil manufacturers, battery suppliers, and electronics firms are expected to expand over the forecast horizon. Additionally, sustainability-driven initiatives, including closed-loop recycling of copper, open pathways for eco-friendly growth and cost optimization.

Regional Analysis

  • Asia Pacific remains the undisputed leader, anchored by the presence of leading EV battery producers in China, South Korea, and Japan, coupled with extensive PCB manufacturing infrastructure. Government incentives for EV adoption and renewable energy are propelling further market expansion.
  • North America is emerging as a high-growth region, supported by gigafactory projects in the U.S. and Canada, strong EV adoption, and advanced electronics research. Favorable policies for renewable energy deployment are adding further traction.
  • Europe is positioned as a key market due to its regulatory emphasis on sustainability and large-scale investments in EV production and clean energy storage. The EU's focus on reducing carbon emissions aligns closely with copper foil demand in batteries and electronics.
  • Latin America and the Middle East & Africa are still nascent markets, but rising investments in industrial electronics, coupled with renewable power projects, indicate steady long-term opportunities.

Key Players

The competitive scenario is shaped by technological leadership, product quality, and strategic collaborations. Leading companies are expanding their global footprint and investing in R&D to meet evolving application needs. Major players include:

  • Doosan Corporation Electro
  • Furukawa Electric Co., Ltd.
  • Fukuda Metal Foil & Powder Co., Ltd.
  • Circuit Foil
  • Chang Chun Group
  • LS Mtron Ltd.
  • Mitsui Mining & Smelting Co., Ltd.
  • JX Nippon Mining & Metals Corporation
  • ILJIN Materials Co., Ltd.
  • Targray Technology International, Inc.
  • Nippon Denkai, Ltd.
  • All Foils, Inc.
  • Oak-Mitsui Technologies LLC
  • Rogers Corporation

Segmentation

By Thickness

  • <=12 µm
  • 13-20 µm
  • 21-35 µm
  • 36-70 µm
  • 105 µm

By Application

  • Printed Circuit Boards (PCBs)
  • Lithium-ion Batteries (LiBs)
  • Miscellaneous

By Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East & Africa

Table of Contents

1. Executive Summary

  • 1.1. Global Electrodeposited Copper Foils Market Snapshot
  • 1.2. Future Projections
  • 1.3. Key Market Trends
  • 1.4. Regional Snapshot, by Value, 2025
  • 1.5. Analyst Recommendations

2. Market Overview

  • 2.1. Market Definitions and Segmentations
  • 2.2. Market Dynamics
    • 2.2.1. Drivers
    • 2.2.2. Restraints
    • 2.2.3. Market Opportunities
  • 2.3. Value Chain Analysis
  • 2.4. COVID-19 Impact Analysis
  • 2.5. Porter's Fiver Forces Analysis
  • 2.6. Impact of Russia-Ukraine Conflict
  • 2.7. PESTLE Analysis
  • 2.8. Regulatory Analysis
  • 2.9. Price Trend Analysis
    • 2.9.1. Current Prices and Future Projections, 2024-2032
    • 2.9.2. Price Impact Factors

3. Global Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 3.1. Global Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 3.1.1. <=12 µm
    • 3.1.2. 13-20 µm
    • 3.1.3. 21-35 µm
    • 3.1.4. 36-70 µm
    • 3.1.5. >105 µm
  • 3.2. Global Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 3.2.1. Printed Circuit Boards (PCBs)
    • 3.2.2. Lithium-ion Batteries (LiBs)
    • 3.2.3. Misc.
  • 3.3. Global Electrodeposited Copper Foils Market Outlook, by Region, Value (US$ Bn), 2019-2032
    • 3.3.1. North America
    • 3.3.2. Europe
    • 3.3.3. Asia Pacific
    • 3.3.4. Latin America
    • 3.3.5. Middle East & Africa

4. North America Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 4.1. North America Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 4.1.1. <=12 µm
    • 4.1.2. 13-20 µm
    • 4.1.3. 21-35 µm
    • 4.1.4. 36-70 µm
    • 4.1.5. >105 µm
  • 4.2. North America Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 4.2.1. Printed Circuit Boards (PCBs)
    • 4.2.2. Lithium-ion Batteries (LiBs)
    • 4.2.3. Misc.
  • 4.3. North America Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 4.3.1. U.S. Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 4.3.2. U.S. Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 4.3.3. Canada Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 4.3.4. Canada Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 4.4. BPS Analysis/Market Attractiveness Analysis

5. Europe Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 5.1. Europe Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 5.1.1. <=12 µm
    • 5.1.2. 13-20 µm
    • 5.1.3. 21-35 µm
    • 5.1.4. 36-70 µm
    • 5.1.5. >105 µm
  • 5.2. Europe Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 5.2.1. Printed Circuit Boards (PCBs)
    • 5.2.2. Lithium-ion Batteries (LiBs)
    • 5.2.3. Misc.
  • 5.3. Europe Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 5.3.1. Germany Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.2. Germany Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.3. Italy Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.4. Italy Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.5. France Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.6. France Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.7. U.K. Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.8. U.K. Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.9. Spain Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.10. Spain Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.11. Russia Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.12. Russia Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 5.3.13. Rest of Europe Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 5.3.14. Rest of Europe Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 5.4. BPS Analysis/Market Attractiveness Analysis

6. Asia Pacific Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 6.1. Asia Pacific Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 6.1.1. <=12 µm
    • 6.1.2. 13-20 µm
    • 6.1.3. 21-35 µm
    • 6.1.4. 36-70 µm
    • 6.1.5. >105 µm
  • 6.2. Asia Pacific Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 6.2.1. Printed Circuit Boards (PCBs)
    • 6.2.2. Lithium-ion Batteries (LiBs)
    • 6.2.3. Misc.
  • 6.3. Asia Pacific Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 6.3.1. China Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.2. China Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.3. Japan Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.4. Japan Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.5. South Korea Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.6. South Korea Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.7. India Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.8. India Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.9. Southeast Asia Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.10. Southeast Asia Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 6.3.11. Rest of SAO Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 6.3.12. Rest of SAO Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 6.4. BPS Analysis/Market Attractiveness Analysis

7. Latin America Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 7.1. Latin America Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 7.1.1. <=12 µm
    • 7.1.2. 13-20 µm
    • 7.1.3. 21-35 µm
    • 7.1.4. 36-70 µm
    • 7.1.5. >105 µm
  • 7.2. Latin America Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 7.2.1. Printed Circuit Boards (PCBs)
    • 7.2.2. Lithium-ion Batteries (LiBs)
    • 7.2.3. Misc.
  • 7.3. Latin America Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 7.3.1. Brazil Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.2. Brazil Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 7.3.3. Mexico Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.4. Mexico Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 7.3.5. Argentina Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.6. Argentina Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 7.3.7. Rest of LATAM Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 7.3.8. Rest of LATAM Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 7.4. BPS Analysis/Market Attractiveness Analysis

8. Middle East & Africa Electrodeposited Copper Foils Market Outlook, 2019-2032

  • 8.1. Middle East & Africa Electrodeposited Copper Foils Market Outlook, by Thickness, Value (US$ Bn), 2019-2032
    • 8.1.1. <=12 µm
    • 8.1.2. 13-20 µm
    • 8.1.3. 21-35 µm
    • 8.1.4. 36-70 µm
    • 8.1.5. >105 µm
  • 8.2. Middle East & Africa Electrodeposited Copper Foils Market Outlook, by Application, Value (US$ Bn), 2019-2032
    • 8.2.1. Printed Circuit Boards (PCBs)
    • 8.2.2. Lithium-ion Batteries (LiBs)
    • 8.2.3. Misc.
  • 8.3. Middle East & Africa Electrodeposited Copper Foils Market Outlook, by Country, Value (US$ Bn), 2019-2032
    • 8.3.1. GCC Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.2. GCC Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.3. South Africa Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.4. South Africa Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.5. Egypt Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.6. Egypt Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.7. Nigeria Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.8. Nigeria Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
    • 8.3.9. Rest of Middle East Electrodeposited Copper Foils Market Outlook, by Thickness, 2019-2032
    • 8.3.10. Rest of Middle East Electrodeposited Copper Foils Market Outlook, by Application, 2019-2032
  • 8.4. BPS Analysis/Market Attractiveness Analysis

9. Competitive Landscape

  • 9.1. Company Vs Segment Heatmap
  • 9.2. Company Market Share Analysis, 2024
  • 9.3. Competitive Dashboard
  • 9.4. Company Profiles
    • 9.4.1. Doosan Corporation Electro
      • 9.4.1.1. Company Overview
      • 9.4.1.2. Product Portfolio
      • 9.4.1.3. Financial Overview
      • 9.4.1.4. Business Strategies and Developments
    • 9.4.2. Furukawa Electric Co., Ltd.
      • 9.4.2.1. Company Overview
      • 9.4.2.2. Product Portfolio
      • 9.4.2.3. Financial Overview
      • 9.4.2.4. Business Strategies and Developments
    • 9.4.3. Fukuda Metal Foil & Powder Co., Ltd.
      • 9.4.3.1. Company Overview
      • 9.4.3.2. Product Portfolio
      • 9.4.3.3. Financial Overview
      • 9.4.3.4. Business Strategies and Developments
    • 9.4.4. Circuit Foil
      • 9.4.4.1. Company Overview
      • 9.4.4.2. Product Portfolio
      • 9.4.4.3. Financial Overview
      • 9.4.4.4. Business Strategies and Developments
    • 9.4.5. Chang Chun Group
      • 9.4.5.1. Company Overview
      • 9.4.5.2. Product Portfolio
      • 9.4.5.3. Financial Overview
      • 9.4.5.4. Business Strategies and Developments
    • 9.4.6. LS Mtron Ltd.
      • 9.4.6.1. Company Overview
      • 9.4.6.2. Product Portfolio
      • 9.4.6.3. Financial Overview
      • 9.4.6.4. Business Strategies and Developments
    • 9.4.7. Mitsui Mining & Smelting Co., Ltd.
      • 9.4.7.1. Company Overview
      • 9.4.7.2. Product Portfolio
      • 9.4.7.3. Financial Overview
      • 9.4.7.4. Business Strategies and Developments
    • 9.4.8. JX Nippon Mining & Metals Corporation
      • 9.4.8.1. Company Overview
      • 9.4.8.2. Product Portfolio
      • 9.4.8.3. Financial Overview
      • 9.4.8.4. Business Strategies and Developments
    • 9.4.9. ILJIN Materials Co., Ltd.
      • 9.4.9.1. Company Overview
      • 9.4.9.2. Product Portfolio
      • 9.4.9.3. Financial Overview
      • 9.4.9.4. Business Strategies and Developments
    • 9.4.10. Targray Technology International, Inc.
      • 9.4.10.1. Company Overview
      • 9.4.10.2. Product Portfolio
      • 9.4.10.3. Financial Overview
      • 9.4.10.4. Business Strategies and Developments

10. Appendix

  • 10.1. Research Methodology
  • 10.2. Report Assumptions
  • 10.3. Acronyms and Abbreviations