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全球先進電子封裝用聚合物材料市場（2026-2036）
市場調查報告書
商品編碼
1863597

全球先進電子封裝用聚合物材料市場（2026-2036）

The Global Market for Polymeric Materials for Advanced Electronic Packaging 2026-2036
出版日期: | 出版商: Future Markets, Inc. | 英文 466 Pages, 118 Tables, 27 Figures | 訂單完成後即時交付

價格

先進電子封裝用聚合物材料市場正在崛起，成為下一代半導體技術的關鍵基礎技術。這一快速成長反映了半導體產業向先進封裝結構發展的根本性轉變，其推動力來自傳統電晶體尺寸縮小的物理限制以及對更高性能、更豐富功能和更高能效的迫切需求。市場成長受到多項變革性半導體發展趨勢的推動，包括高效能運算 (HPC)、生成式人工智慧 (AI)、汽車高階駕駛輔助系統 (ADAS)、5G/6G 通訊、擴增實境/虛擬實境 (AR/VR) 應用以及邊緣人工智慧 (Edge AI) 部署。這些應用需要能夠容納更大晶片尺寸、支援晶片整合、實現不同半導體技術的異質整合並提供卓越散熱管理的封裝解決方案。所有這些要求都對聚合物材料提出了前所未有的要求。

隨著電晶體尺寸縮小接近物理極限，業界已將先進封裝作為提升性能的主要途徑。這種轉變使聚合物材料的功能從簡單的封裝提升到先進的工程材料，這些材料必須同時應對機械應力管理、電訊號完整性、散熱、尺寸穩定性和長期可靠性等挑戰。

市場主要由四類材料組成：介電材料、模塑化合物、底部填充材料和臨時粘合/脫粘 (TBDB) 材料。介電材料，包括聚醯亞胺 (PI)、聚苯並噁唑 (PBO)、苯並環丁烯 (BCB) 和環氧丙烯酸酯複合材料，是重分佈層 (RDL) 結構中的關鍵絕緣層，可實現低電損耗的細間距互連。模塑化合物提供機械保護和熱管理，其中高導熱配方在人工智慧/高效能運算 (AI/HPC) 應用中越來越受到關注。底部填充材料，例如毛細管底部填充 (CUF)、模塑底部填充 (MUF)、非導電薄膜 (NCF) 和非導電膏 (NCP)，可減輕晶片和基板之間的熱機械應力。 TBDB 材料可實現晶圓減薄和背面加工，這對於 3D 整合和矽通孔 (TSV) 的形成至關重要。

儘管行動和消費電子產品目前佔市場佔有率和收入的主導地位，但通訊和基礎設施領域正經歷著最快的成長，這主要得益於支援人工智慧工作負載的超大規模資料中心的建設。在封裝平台中，系統級封裝 (SiP) 仍然是聚合物材料的最大消費領域，而 2.5D/3D 封裝是成長最快的領域，複合年增長率超過 28-35%，這反映了業界對晶片架構和異構整合在先進處理器中的應用。聚合物材料供應鏈高度集中，地理集中度也日益顯著。

該行業面臨重大的技術挑戰，特別是聚合物和矽之間熱膨脹係數 (CTE) 的不匹配，這引發了人們對大型薄封裝翹曲和可靠性的擔憂。由於聚合物在熱循環下的膨脹係數遠高於矽，材料開發商正在尋求針對特定應用的配方，以平衡各種相互衝突的需求：低熱膨脹係數 (CTE)、高導熱係數、低介電常數、優異的粘附性、精細間距圖案化能力以及不含 PFAS 的配方，從而滿足不斷變化的環境法規要求。人工智慧運算需求的不斷增長、對永續材料的監管壓力以及 3D 異質整合的技術複雜性，都將確保聚合物材料在 2036 年及以後仍是半導體創新的關鍵基礎技術。

本報告考察了全球先進電子封裝用聚合物材料市場，並對聚合物材料生態系統進行了詳細分析，包括介電材料、模塑化合物、底部填充材料以及用於實現下一代半導體封裝技術的臨時粘合和解粘 (TBDB) 解決方案。

目錄

第一章：摘要整理

  • 背景與市場概覽
  • 先進包裝市場趨勢
  • 主要市場推動因素
  • 市場預測概要
  • 競爭格局概覽

第二章：先進包裝中的聚合物材料

  • 聚合物材料定義
  • 先進包裝中的聚合物材料類別
  • 聚合物在下一代包裝中的作用
  • 材料科技趨勢概覽
  • 不斷變化的材料需求
  • 先進包裝中軟材料面臨的挑戰

第三章：全球市場預測

  • 全球市場規模與成長預測（2026-2036）
  • 依材料劃分的市佔率包裝
  • 聚合物材料收入與銷售預測
  • 依類別劃分的價格動態
  • 依終端市場劃分的市場預測
  • 依包裝平台劃分的市場預測
  • 2.5D/3D 包裝的成長
  • 區域市場分析
  • 市場趨勢與機遇

第四章：先進包裝聚合物材料供應鏈

  • 先進包裝供應鏈概述
  • 依材料類別劃分的材料供應商概述
  • 供應鏈分析與動態
  • 聚合物材料法規

第五章：直接材料 - 介電材料

  • 介電材料的定義與概述
  • 介電材料在先進包裝的應用
  • 聚合物介電材料市場趨勢
  • 材料細分與沉積工藝
  • 介電材料需求先進封裝
  • 不同材質類型比較
  • 面板級封裝材料趨勢
  • 先進光刻與細間距技術
  • 介電材料供應商（依材料類型劃分）
  • 介電材料技術路線圖
  • 介電材料市場預測（2026-2036）

第六章 直接材料 - 模塑化合物

  • 模塑化合物材料定義及概述
  • 模塑化合物在先進封裝中的應用
  • 環氧模塑化合物 (EMC) 技術
  • 模塑底部填充 (MUF) 和傳統 EMC
  • 材料細分與沉積工藝
  • 先進封裝中模塑化合物的要求
  • 模塑化合物加工挑戰
  • 熱塑性聚合物創新
  • 模塑化合物供應商（依材料類型劃分）
  • 模塑化合物技術路線圖
  • 模塑化合物市場預測（2026-2036）

第七章：直接材料 - 底部填充材料

  • 底部填充材料的定義與概述
  • 底部填充材料在先進封裝的應用
  • 材料分類與加工
  • 先進封裝中的底部填充材料要求
  • 細間距和微凸點應用
  • 混合鍵結的底部填充材料
  • 依材料類型劃分的底部填充材料供應商
  • 底部填充材料技術路線圖
  • 底部填充材料市場預測（2026-2036）

第八章：間接材料 - 暫時鍵結/脫黏

  • TBDB 材料的定義與概述
  • TBDB 在先進封裝中的應用
  • 材料分類與應用形式
  • 脫黏技術與製程流程
  • TBDB 材料需求與技術趨勢
  • 晶圓減薄與超薄晶圓處理
  • 面板級封裝 TBDB 解決方案
  • TBDB 材料供應商（依技術分類）
  • TBDB 材料技術路線圖
  • TBDB 材料市場預測（2026-2036 年）

第九章 新興材料與應用

  • 面板級封裝中的聚合物材料
  • 共封裝光學元件 (CPO) 中的聚合物材料
  • 晶片整合與異構整合用聚合物
  • 先進的熱管理材料
  • 永續生物基聚合物材料
  • 下一代材料創新
  • 基於人工智慧的材料設計與最佳化

第十章：技術挑戰與未來展望

  • 關鍵技術挑戰
  • 材料表徵與標準化
  • 製程整合挑戰
  • 成本與供應鏈考量
  • 環境與法規遵從
  • 未來趨勢與機遇
  • 技術路線圖（2026-2036）

第11章：公司簡介（89家公司簡介）

第12章：附錄1

第13章：參考文獻

The polymeric materials market for advanced electronic packaging has emerged as a critical enabler of next-generation semiconductor technologies. This rapid expansion reflects the semiconductor industry's fundamental shift toward advanced packaging architectures driven by the physical limitations of traditional transistor scaling and the insatiable demand for higher performance, greater functionality, and improved energy efficiency. The market's growth is propelled by several transformative semiconductor megatrends, including high-performance computing (HPC), generative AI, automotive ADAS systems, 5G/6G communications, AR/VR applications, and edge AI deployment. These applications demand packaging solutions that can accommodate larger dies, support chiplet integration, enable heterogeneous integration of diverse semiconductor technologies, and deliver superior thermal management-all requirements that place unprecedented demands on polymeric materials.

As transistor scaling reaches its physical limits, the industry has pivoted to advanced packaging as the primary path for continued performance improvements. This transition has elevated polymeric materials from simple encapsulation functions to sophisticated engineered materials that must simultaneously address mechanical stress management, electrical signal integrity, thermal dissipation, dimensional stability, and long-term reliability challenges.

The market encompasses four primary material categories: dielectric materials, mold compounds, underfills, and temporary bonding/debonding (TBDB) materials. Dielectric materials, including polyimides (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), and epoxy-acrylic composites, serve as critical insulation layers in redistribution layer (RDL) structures, enabling fine-pitch interconnects with low electrical loss. Mold compounds provide mechanical protection and thermal management, with increasing emphasis on high thermal conductivity formulations for AI and HPC applications. Underfill materials-available as capillary underfills (CUF), molded underfills (MUF), non-conductive films (NCF), and non-conductive pastes (NCP)-mitigate thermomechanical stress between chips and substrates. TBDB materials enable wafer thinning and backside processing essential for 3D integration and through-silicon via (TSV) formation.

Mobile and consumer electronics currently dominate market volumes and revenues, but telecom and infrastructure segments are experiencing the fastest growth, driven by hyperscale data center buildouts supporting AI workloads. Among packaging platforms, System-in-Package (SiP) remains the largest consumer of polymeric materials, while 2.5D and 3D packaging represent the fastest-growing segments with CAGRs exceeding 28-35%, reflecting the industry's embrace of chiplet architectures and heterogeneous integration for advanced processors. The polymeric materials supply chain exhibits significant concentration. Geographic concentration is even more pronounced.

The industry faces critical technical challenges, particularly coefficient of thermal expansion (CTE) mismatch between polymers and silicon, which drives warpage and reliability concerns in large, thin packages. Since polymers expand significantly more than silicon under thermal cycling, material developers are pursuing application-specific formulations that balance competing requirements: low CTE, high thermal conductivity, low dielectric constant, superior adhesion, fine-pitch patterning capability, and increasingly, PFAS-free compositions to meet evolving environmental regulations. The convergence of AI-driven computing demands, regulatory pressures for sustainable materials, and the technical complexity of 3D heterogeneous integration positions polymeric materials as indispensable enablers of semiconductor innovation through 2036 and beyond.

"The Global Market for Polymeric Materials for Advanced Electronic Packaging 2026-2036" delivers in-depth analysis of the polymeric materials ecosystem, encompassing dielectric materials, molding compounds, underfill materials, and temporary bonding/debonding (TBDB) solutions that enable next-generation semiconductor packaging technologies.

As Moore's Law approaches physical limitations, the semiconductor industry has pivoted toward advanced packaging architectures including System-in-Package (SiP), Fan-Out Wafer Level Packaging (FOWLP), 2.5D packaging, 3D packaging, and chiplet integration. These sophisticated packaging platforms demand increasingly specialized polymeric materials capable of meeting stringent requirements for thermal management, electrical performance, mechanical reliability, and dimensional stability. This report provides essential intelligence for materials suppliers, packaging manufacturers, semiconductor fabs, OSAT providers, equipment manufacturers, and strategic investors seeking to capitalize on this high-growth market opportunity.

The report delivers comprehensive market forecasts segmented by material category (dielectric, mold compound, underfill, TBDB), packaging platform (SiP, FOWLP, 2.5D, 3D, embedded die), end-market application (mobile & consumer electronics, HPC & AI, automotive & ADAS, telecom & infrastructure, IoT & edge computing, AR/VR), and geographic region spanning the decade from 2026 through 2036. Detailed revenue and volume projections enable stakeholders to identify the fastest-growing market segments, with particular emphasis on the explosive growth anticipated in 2.5D/3D packaging driven by artificial intelligence, high-performance computing, and generative AI applications.

Technology analysis examines the evolution of material chemistries including polyimides (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), epoxy-based systems, and acrylic resin composites, evaluating critical performance parameters such as coefficient of thermal expansion (CTE), dielectric constant (Dk), dissipation factor (Df), glass transition temperature (Tg), thermal conductivity, and moisture absorption. The report explores emerging innovations in panel-level packaging, co-packaged optics (CPO), sustainable bio-based polymers, and AI-driven material design optimization.

Supply chain intelligence reveals the competitive landscape dominated by Japanese suppliers commanding approximately 80% market share, with detailed profiles of over 90 companies including material suppliers, packaging service providers, semiconductor manufacturers, and equipment vendors. Market share analysis identifies the top players across each material category, highlighting strategic positioning, technological capabilities, geographic presence, and competitive advantages. The report examines critical industry trends including PFAS-free material development, carbon emission reduction initiatives, recycled material integration, and regulatory compliance requirements.

Technical challenges and solutions address the industry's most pressing concerns: CTE mismatch and warpage control in large packages, moisture sensitivity and long-term reliability, high-temperature performance for automotive applications, fine-pitch interconnect capability for advanced nodes, process integration complexity, and cost optimization strategies. Technology roadmaps project material evolution through 2036, identifying innovation opportunities and potential disruptive technologies.

Report Contents include:

  • Market Analysis & Forecasts
    • Executive summary with context, market overview, and key drivers (2026-2036)
    • Global market size and growth projections with 13% CAGR analysis
    • Market forecasts by material category: dielectrics, mold compounds, underfills, TBDB materials
    • Market segmentation by end-market: Mobile/Consumer, HPC/AI, Automotive/ADAS, Telecom, IoT, AR/VR
    • Market analysis by packaging platform: SiP, FOWLP, 2.5D, 3D, Embedded Die
    • 2.5D/3D packaging growth trajectory showing 28-35% CAGR
    • Regional market distribution across Asia, Americas, and Europe
    • Price trend analysis and volume forecasts through 2036
  • Material Technology Deep Dives
    • Dielectric materials: PI, PBO, BCB, epoxy-based, acrylic composites with suppliers and specifications
    • Molding compounds: EMC, MUF, liquid molding with thermal conductivity roadmaps
    • Underfill materials: CUF, MUF, NCF, NCP with fine-pitch and hybrid bonding capabilities
    • Temporary bonding/debonding: thermal slide, laser, chemical, mechanical, UV-release technologies
    • Material property comparisons: CTE, Dk, Df, Tg, thermal conductivity, moisture absorption
    • Deposition processes: spin-on, spray coating, lamination, compression molding, transfer molding
    • Advanced lithography capabilities and fine-pitch patterning (sub-2 micrometer resolution)
  • Supply Chain & Competitive Intelligence
    • Polymeric materials ecosystem map with 50+ suppliers by category
    • Top 20 supplier rankings with market share analysis (2024-2036)
    • Geographic concentration analysis
    • Vertical integration analysis and manufacturing capacity assessments
  • Emerging Technologies & Applications
    • Panel-level packaging material requirements and cost benefits (510mm-600mm panels)
    • Co-packaged optics (CPO) with low-loss polymers for optical waveguides
    • Chiplet integration and heterogeneous integration material challenges
    • Advanced thermal management materials for AI/HPC applications
    • Sustainable and bio-based polymeric materials development
    • AI-driven material design and optimization methodologies
    • Next-generation material innovations and technology readiness levels
  • Regulatory & Technical Challenges
    • PFAS-free material requirements and compliance timeline
    • CO2 emission standards and sustainability initiatives
    • Recycled material integration strategies
    • Safety Data Sheet (SDS) compliance requirements
    • CTE mismatch and warpage control solutions for large packages
    • Moisture sensitivity and reliability standards (MSL ratings)
    • High-temperature performance requirements (>260 degree C) for automotive
    • Fine-pitch interconnect technology roadmap (bump pitch evolution)
    • Material characterization and industry standardization initiatives
    • Process integration challenges and cost optimization strategies
  • Company Profiles (91 Companies)
    • Detailed profiles of material suppliers, OSAT providers, semiconductor manufacturers
    • Product portfolios, technological capabilities, and market positioning
    • Geographic presence and manufacturing facilities
    • Strategic initiatives, R&D investments, and recent developments
    • Contact information and corporate structure

This comprehensive report includes detailed profiles of 91 leading companies active in the polymeric materials ecosystem for advanced electronic packaging: 3M, AEMC, AI Technology, Ajinomoto, AMD, Amkor Technology, AOI Electronics, Applied Materials, Asahi Kasei, ASE, Brewer Science, Caplinq, Chang Chun Group, Chang Wah Electromaterials, CXMT, Darbond, Deca Technologies, DELO, Dupont, Empower Materials, Epoxy Technology, Eternal Materials, Everlight Chemical, Fujifilm, GlobalFoundries, HD Microsystems, Henkel, Huahai Chengke, Hysol, IBM, Imec, Innolux, Intel, JCET, JSR, Kayaku Advanced Materials, KCC, Kyocera, MacDermid Alpha, Manz, MASTERBOND, Merck, Micro Materials, Micron, Mingkun Technologies, Minseoa, Mitsubishi Gas Chemical, Mitsui Chemicals, Murata, Nagase ChemteX, Namics and more. These profiles encompass the complete value chain from raw material suppliers and specialty chemical manufacturers to advanced packaging service providers, leading semiconductor fabs, and equipment manufacturers driving innovation in polymeric materials for next-generation electronic packaging applications.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. Context and Market Overview
  • 1.2. Advanced Packaging Market Trends
    • 1.2.1. Chiplet Architecture Adoption
    • 1.2.2. 2.5D and 3D Integration Expansion
    • 1.2.3. High-Bandwidth Memory Proliferation
    • 1.2.4. Panel-Level Packaging Emergence
  • 1.3. Key Market Drivers
    • 1.3.1. Artificial Intelligence and High-Performance Computing
    • 1.3.2. Automotive ADAS and Electrification
    • 1.3.3. 5G/6G Communications Infrastructure
    • 1.3.4. Consumer Electronics Miniaturization
    • 1.3.5. IoT and Edge Computing Expansion
  • 1.4. Market Forecast Summary
  • 1.5. Competitive Landscape Overview

2. POLYMERIC MATERIALS IN ADVANCED PACKAGING

  • 2.1. Definition of Polymeric Materials
  • 2.2. Polymeric Materials Categories in Advanced Packaging
    • 2.2.1. Dielectric Materials
    • 2.2.2. Mold Compounds
    • 2.2.3. Underfill Materials
    • 2.2.4. Temporary Bonding/Debonding Materials
  • 2.3. Role of Polymers in Next-Generation Packaging
    • 2.3.1. Enabling High-Density Interconnects
    • 2.3.2. Managing Thermomechanical Stress
    • 2.3.3. Supporting Thermal Management
    • 2.3.4. Enabling Manufacturing Processes
  • 2.4. Overview of Materials Technology Trends
    • 2.4.1. Low-Loss Dielectrics for High-Frequency Applications
    • 2.4.2. High Thermal Conductivity Mold Compounds
    • 2.4.3. Fine-Pitch Underfill Technology
    • 2.4.4. TBDB for Extreme Wafer Thinning
    • 2.4.5. Computational Materials Design
  • 2.5. Material Requirements Evolution
    • 2.5.1. Application-Specific Requirements
  • 2.6. Challenges of Soft Materials in Advanced Packaging
    • 2.6.1. Coefficient of Thermal Expansion Mismatch
    • 2.6.2. Moisture Sensitivity
    • 2.6.3. Outgassing and Contamination
    • 2.6.4. Thermal Stability Limitations
    • 2.6.5. Computational Approaches to Material Development

3. GLOBAL MARKET FORECAST

  • 3.1. Global Market Size and Growth Projections (2026-2036)
    • 3.1.1. Growth Phase Characteristics
  • 3.2. Market Share by Material and Package Types
    • 3.2.1. Dielectric Materials
    • 3.2.2. Mold Compounds
    • 3.2.3. Underfill Materials
    • 3.2.4. TBDB Materials
  • 3.3. Polymeric Materials Revenue and Volume Forecast
    • 3.3.1. Material Consumption by Package Type
    • 3.3.2. Material Intensity Analysis
    • 3.3.3. Volume Forecast by Material Category
  • 3.4. Price Dynamics by Category
  • 3.5. Market Forecast by End-Market
    • 3.5.1. Mobile & Consumer Electronics
    • 3.5.2. High-Performance Computing (HPC) and AI
    • 3.5.3. Automotive and ADAS
    • 3.5.4. Telecom and Infrastructure
    • 3.5.5. IoT and Edge Computing
    • 3.5.6. AR/VR Applications
  • 3.6. Market Forecast by Packaging Platform
    • 3.6.1. System-in-Package (SiP)
    • 3.6.2. Fan-Out Wafer Level Packaging (FOWLP)
    • 3.6.3. 2.5D Packaging
    • 3.6.4. 3D Packaging and Chiplet Integration
    • 3.6.5. Embedded Die Packaging
  • 3.7. 2.5D/3D Packaging Growth
    • 3.7.1. Growth Trajectory Analysis
    • 3.7.2. Demand Drivers
    • 3.7.3. Technology Roadmap
  • 3.8. Regional Market Analysis
    • 3.8.1. Asia-Pacific
    • 3.8.2. North America
    • 3.8.3. Europe
  • 3.9. Market Trends and Opportunities
    • 3.9.1. Panel-Level Packaging Commercialization
    • 3.9.2. PFAS-Free Material Development
    • 3.9.3. AI-Accelerated Material Discovery
    • 3.9.4. Sustainability and Circular Economy

4. POLYMERIC MATERIALS SUPPLY CHAIN FOR ADVANCED PACKAGING

  • 4.1. Advanced Packaging Supply Chain Overview
    • 4.1.1. Value Chain Structure
    • 4.1.2. Value Distribution
  • 4.2. Overview of Material Suppliers by Material Category
    • 4.2.1. Dielectric Materials Supplier Landscape
    • 4.2.2. Mold Compound Supplier Landscape
    • 4.2.3. Underfill Supplier Landscape
    • 4.2.4. TBDB Supplier Landscape
  • 4.3. Supply Chain Analysis and Dynamics
    • 4.3.1. Concentration Risks
    • 4.3.2. Chinese Supply Development
    • 4.3.3. Vertical Integration Trends
  • 4.4. Regulations for Polymeric Materials
    • 4.4.1. PFAS-Free Requirements
    • 4.4.2. CO2 Emission Standards
    • 4.4.3. Recycled Material Integration
    • 4.4.4. Safety Data Sheet Compliance
    • 4.4.5. AI Implementation in Material Development

5. DIRECT MATERIALS-DIELECTRIC MATERIALS

  • 5.1. Definition and Overview of Dielectric Materials
  • 5.2. Application of Dielectric Materials in Advanced Packaging
    • 5.2.1. Redistribution Layer (RDL) Formation
    • 5.2.2. Interposer Dielectrics
    • 5.2.3. Passivation and Buffer Layers
    • 5.2.4. Panel-Level Packaging Applications
  • 5.3. Polymeric Dielectric Material Market Trends
    • 5.3.1. Low-Loss Material Development
    • 5.3.2. Fine-Pitch Patterning Capability
    • 5.3.3. Thickness Uniformity and Control
  • 5.4. Material Segmentation and Deposition Processes
    • 5.4.1. Polyimides (PI)
      • 5.4.1.1. Chemistry and Structure
      • 5.4.1.2. Property Profile
      • 5.4.1.3. Photosensitive Variants
      • 5.4.1.4. Applications and Suppliers
    • 5.4.2. Polybenzoxazole (PBO)
      • 5.4.2.1. Chemistry and Structure
      • 5.4.2.2. Property Profile
      • 5.4.2.3. Applications and Suppliers
    • 5.4.3. Benzocyclobutene (BCB)
      • 5.4.3.1. Chemistry and Structure
      • 5.4.3.2. Property Profile
      • 5.4.3.3. Applications and Suppliers
    • 5.4.4. Epoxy-Based Dielectrics
      • 5.4.4.1. Chemistry and Structure
      • 5.4.4.2. Property Profile
      • 5.4.4.3. Applications and Suppliers
    • 5.4.5. Acrylic Resin Composites
      • 5.4.5.1. Property Profile
      • 5.4.5.2. Applications
  • 5.5. Dielectric Material Requirements for Advanced Packaging
    • 5.5.1. Electrical Properties (Low Dk, Low Df)
      • 5.5.1.1. Dielectric Constant (Dk)
      • 5.5.1.2. Dissipation Factor (Df)
      • 5.5.1.3. Frequency Stability
    • 5.5.2. Thermal Stability
      • 5.5.2.1. Processing Compatibility
      • 5.5.2.2. Operational Requirements
    • 5.5.3. Mechanical Properties
      • 5.5.3.1. Modulus and Strength
      • 5.5.3.2. Stress and Warpage
    • 5.5.4. CTE Control and Warpage Management
      • 5.5.4.1. CTE Values and Mismatch
      • 5.5.4.2. Warpage Impact
    • 5.5.5. Adhesion and Patternability
  • 5.6. Comparison Between Different Material Types
    • 5.6.1. Electrical Performance Ranking
    • 5.6.2. Processability Ranking
    • 5.6.3. Thermal Stability Ranking
    • 5.6.4. Cost Ranking
  • 5.7. Panel Level Packaging Material Trends
    • 5.7.1. Scale-Related Challenges
    • 5.7.2. Process Adaptation Requirements
    • 5.7.3. Current Development Status
  • 5.8. Advanced Lithography and Fine Pitch Capabilities
    • 5.8.1. Resolution Requirements
    • 5.8.2. Photosensitive Dielectric Optimization
    • 5.8.3. Via Formation Considerations
    • 5.8.4. Equipment Requirements
  • 5.9. Dielectric Material Suppliers by Material Type
    • 5.9.1. Polyimide Supplier Landscape
    • 5.9.2. PBO Supplier Landscape
    • 5.9.3. BCB Supplier Landscape
    • 5.9.4. Epoxy and Composite Dielectric Suppliers
  • 5.10. Technology Roadmap for Dielectric Materials
  • 5.11. Dielectric Material Market Forecast (2026-2036)
    • 5.11.1. Growth Drivers
    • 5.11.2. Segment Dynamics
    • 5.11.3. Price Dynamics

6. DIRECT MATERIALS - MOLDING COMPOUNDS

  • 6.1. Definition and Overview of Mold Compound Materials
  • 6.2. Application of Mold Compounds in Advanced Packaging
    • 6.2.1. Fan-Out Wafer Level Packaging (FOWLP)
    • 6.2.2. System-in-Package (SiP)
    • 6.2.3. 2.5D and 3D Packaging
    • 6.2.4. Compression Molding Dominance
  • 6.3. Epoxy Mold Compound (EMC) Technology
    • 6.3.1. Base Chemistry
    • 6.3.2. Property Profiles
    • 6.3.3. Advanced Formulations
  • 6.4. Molded Underfill (MUF) vs. Traditional EMC
    • 6.4.1. MUF Concept
    • 6.4.2. MUF Material Requirements
    • 6.4.3. Trade-offs
    • 6.4.4. Market Positioning
  • 6.5. Material Segmentation and Deposition Processes
    • 6.5.1. Compression Molding
      • 6.5.1.1. Process Description
      • 6.5.1.2. Advantages
      • 6.5.1.3. Equipment and Process Considerations
    • 6.5.2. Transfer Molding
      • 6.5.2.1. Process Description
      • 6.5.2.2. Applications
      • 6.5.2.3. Limitations
    • 6.5.3. Liquid Molding
      • 6.5.3.1. Process Description
      • 6.5.3.2. Applications
  • 6.6. Mold Compound Requirements for Advanced Packaging
    • 6.6.1. Low Warpage and CTE Control
      • 6.6.1.1. Warpage Mechanisms
      • 6.6.1.2. CTE Control Strategies
      • 6.6.1.3. Warpage Management
    • 6.6.2. High Thermal Conductivity
      • 6.6.2.1. Thermal Requirements by Application
      • 6.6.2.2. Thermally Conductive Filler Options
      • 6.6.2.3. Trade-offs
    • 6.6.3. Low Moisture Absorption
      • 6.6.3.1. Moisture-Related Failures
      • 6.6.3.2. Moisture Absorption Levels
      • 6.6.3.3. Moisture Resistance Strategies
    • 6.6.4. Filler Size and Content Optimization
      • 6.6.4.1. Filler Loading Effects
      • 6.6.4.2. Filler Size Distribution
    • 6.6.5. High Reliability and Mechanical Strength
      • 6.6.5.1. Reliability Requirements
      • 6.6.5.2. Mechanical Property Requirements
  • 6.7. Mold Compound Processing Challenges
    • 6.7.1. Large Package Size Handling
      • 6.7.1.1. Flow Completion
      • 6.7.1.2. Warpage Control
      • 6.7.1.3. Equipment Requirements
    • 6.7.2. Thin Profile Requirements
      • 6.7.2.1. Thin Package Challenges
      • 6.7.2.2. Material Adaptations
    • 6.7.3. High-Temperature Applications
      • 6.7.3.1. Temperature Requirements
      • 6.7.3.2. Material Requirements
      • 6.7.3.3. Available Solutions
  • 6.8. Innovations in Thermoplastic Polymers
    • 6.8.1. Thermoplastic vs. Thermoset
    • 6.8.2. Potential Thermoplastic Advantages
    • 6.8.3. Challenges and Limitations
    • 6.8.4. Current Status
  • 6.9. Mold Compound Suppliers by Material Type
  • 6.10. Technology Roadmap for Mold Compounds
  • 6.11. Mold Compound Market Forecast (2026-2036)
    • 6.11.1. Growth Drivers
    • 6.11.2. Segment Dynamics
    • 6.11.3. Price Dynamics

7. DIRECT MATERIALS - UNDERFILL MATERIALS

  • 7.1. Definition and Overview of Underfill Materials
  • 7.2. Application of Underfill in Advanced Packaging
    • 7.2.1. Flip-Chip on Substrate (FCOS)
    • 7.2.2. Flip-Chip on Interposer
    • 7.2.3. Die-to-Die Stacking
    • 7.2.4. High-Bandwidth Memory (HBM)
    • 7.2.5. Hybrid Bonding Applications
  • 7.3. Material Segmentation and Processing
    • 7.3.1. Capillary Underfill (CUF)
      • 7.3.1.1. Process Description
      • 7.3.1.2. Material Characteristics
      • 7.3.1.3. Advantages and Limitations
    • 7.3.2. Molded Underfill (MUF)
      • 7.3.2.1. Process Integration
      • 7.3.2.2. Material Requirements
      • 7.3.2.3. Pitch Limitations
    • 7.3.3. Non-Conductive Film (NCF)
      • 7.3.3.1. Process Description
      • 7.3.3.2. Material Characteristics
      • 7.3.3.3. Advantages and Limitations
    • 7.3.4. Non-Conductive Paste (NCP)
      • 7.3.4.1. Process Description
      • 7.3.4.2. Material Characteristics
      • 7.3.4.3. Applications
  • 7.4. Underfill Requirements for Advanced Packaging
    • 7.4.1. Flow Characteristics and Void Control
      • 7.4.1.1. Flow Requirements
      • 7.4.1.2. Void Formation Mechanisms
      • 7.4.1.3. Void Mitigation
    • 7.4.2. CTE Matching and Stress Management
      • 7.4.2.1. CTE Values and Mismatch
      • 7.4.2.2. CTE Optimization Strategies
      • 7.4.2.3. Stress Distribution
    • 7.4.3. Fast Cure and High Throughput
      • 7.4.3.1. Cure Time Targets
      • 7.4.3.2. Fast-Cure Chemistry Options
      • 7.4.3.3. Trade-offs
    • 7.4.4. Thermal and Electrical Performance
      • 7.4.4.1. Thermal Conductivity
      • 7.4.4.2. Electrical Properties
    • 7.4.5. Reworkability Considerations
      • 7.4.5.1. Rework Importance
      • 7.4.5.2. Rework Methods
      • 7.4.5.3. Material Reworkability
  • 7.5. Fine Pitch and Micro-Bump Applications
    • 7.5.1. Pitch Trends
    • 7.5.2. Fine-Pitch Challenges
    • 7.5.3. Material Approaches
    • 7.5.4. Process Approaches
  • 7.6. Hybrid Bonding Compatible Underfills
    • 7.6.1. Hybrid Bonding Concept
    • 7.6.2. Implications for Underfill
    • 7.6.3. Remaining Material Requirements
    • 7.6.4. Development Status
  • 7.7. Underfill Suppliers by Material Type
  • 7.8. Technology Roadmap for Underfill Materials
  • 7.9. Underfill Material Market Forecast (2026-2036)
    • 7.9.1. Growth Drivers
    • 7.9.2. Segment Dynamics
    • 7.9.3. Price Dynamics

8. INDIRECT MATERIALS - TEMPORARY BONDING/DEBONDING

  • 8.1. Definition and Overview of TBDB Materials
  • 8.2. Application of TBDB in Advanced Packaging
    • 8.2.1. HBM Memory Stacking
    • 8.2.2. Logic Die Thinning
    • 8.2.3. Interposer Processing
    • 8.2.4. Panel-Level Applications
  • 8.3. Material Segmentation and Application Formats
    • 8.3.1. Adhesive-Based TBDB
      • 8.3.1.1. Chemistry and Structure
      • 8.3.1.2. Property Requirements
      • 8.3.1.3. Debonding Options
    • 8.3.2. Polymer-Based TBDB
      • 8.3.2.1. Release Layer Concepts
      • 8.3.2.2. Multi-Layer Structures
    • 8.3.3. Film-Based TBDB
      • 8.3.3.1. Dry Film Advantages
      • 8.3.3.2. Applications
  • 8.4. Debonding Technologies and Process Flow
    • 8.4.1. Thermal Slide Debonding
    • 8.4.2. Laser Debonding
      • 8.4.2.1. Process Description
      • 8.4.2.2. Release Layer Chemistry
      • 8.4.2.3. Advantages and Limitations
    • 8.4.3. Chemical Debonding
      • 8.4.3.1. Process Description
      • 8.4.3.2. Chemistry Options
    • 8.4.4. Mechanical Debonding
      • 8.4.4.1. Process Description
      • 8.4.4.2. Advantages and Limitations
    • 8.4.5. UV-Release Technology
      • 8.4.5.1. Process Description
      • 8.4.5.2. Chemistry Requirements
  • 8.5. TBDB Material Requirements and Technology Trends
    • 8.5.1. Bond Strength and Thermal Stability
      • 8.5.1.1. Bond Strength Requirements
      • 8.5.1.2. Thermal Stability
      • 8.5.1.3. Trade-offs
    • 8.5.2. Clean Debonding with Minimal Residue
      • 8.5.2.1. Residue Sources
      • 8.5.2.2. Cleanliness Requirements
      • 8.5.2.3. Residue Mitigation
    • 8.5.3. Carrier Wafer Compatibility
      • 8.5.3.1. Carrier Options
      • 8.5.3.2. Compatibility Considerations
    • 8.5.4. Through-Silicon Via (TSV) Processing
      • 8.5.4.1. TSV Process Requirements
  • 8.6. Wafer Thinning and Ultra-Thin Wafer Handling
    • 8.6.1. Thinning Roadmap
    • 8.6.2. Handling Challenges
    • 8.6.3. TBDB Role
  • 8.7. Panel Level Packaging TBDB Solutions
    • 8.7.1. Panel Characteristics
    • 8.7.2. TBDB Challenges for Panels
    • 8.7.3. Development Status
  • 8.8. TBDB Material Suppliers by Technology
  • 8.9. Technology Roadmap for TBDB Materials
  • 8.10. TBDB Material Market Forecast (2026-2036)
    • 8.10.1. Growth Drivers
    • 8.10.2. Technology Mix Evolution
    • 8.10.3. Price Dynamics

9. EMERGING MATERIALS AND APPLICATIONS

  • 9.1. Polymeric Materials in Panel-Level Packaging
    • 9.1.1. Panel Size Scaling Challenges
    • 9.1.2. Material Requirements for Large Panels
      • 9.1.2.1. Dielectric Materials
      • 9.1.2.2. Mold Compounds
      • 9.1.2.3. TBDB for Panels
    • 9.1.3. Cost Benefits and Manufacturing Efficiency
      • 9.1.3.1. Area Efficiency
      • 9.1.3.2. Cost Reduction Potential
  • 9.2. Polymeric Materials in Co-Packaged Optics (CPO)
    • 9.2.1. Optical Material Requirements
      • 9.2.1.1. Optical Transparency
      • 9.2.1.2. Refractive Index Control
    • 9.2.2. Low-Loss Polymers for Waveguides
      • 9.2.2.1. Loss Mechanisms
      • 9.2.2.2. Loss Targets
      • 9.2.2.3. Material Candidates
    • 9.2.3. Integration with Silicon Photonics
      • 9.2.3.1. Process Compatibility
      • 9.2.3.2. Interface Management
  • 9.3. Polymers for Chiplet Integration and Heterogeneous Integration
    • 9.3.1. Chiplet Architecture Implications
    • 9.3.2. Material Requirements
    • 9.3.3. UCIe and Standardization
  • 9.4. Advanced Thermal Management Materials
    • 9.4.1. Thermal Challenges
    • 9.4.2. Material Approaches
    • 9.4.3. Development Status
  • 9.5. Sustainable and Bio-Based Polymeric Materials
  • 9.6. Next-Generation Material Innovations
    • 9.6.1. Self-Healing Polymers
    • 9.6.2. Thermally Conductive Polymer Composites
    • 9.6.3. Recyclable Thermoset Alternatives
  • 9.7. AI-Driven Material Design and Optimization
    • 9.7.1. Current Applications
    • 9.7.2. Demonstrated Benefits
    • 9.7.3. Future Potential

10. TECHNOLOGY CHALLENGES AND FUTURE OUTLOOK

  • 10.1. Key Technical Challenges
    • 10.1.1. CTE Mismatch and Warpage Control
      • 10.1.1.1. Physics of the Challenge
      • 10.1.1.2. Consequences
      • 10.1.1.3. Mitigation Approaches
      • 10.1.1.4. Outlook
    • 10.1.2. Moisture Sensitivity and Reliability
      • 10.1.2.1. Moisture Effects
      • 10.1.2.2. Current Status
      • 10.1.2.3. Development Directions
    • 10.1.3. High-Temperature Performance
      • 10.1.3.1. Temperature Requirements
      • 10.1.3.2. Material Limitations
      • 10.1.3.3. Development Needs
    • 10.1.4. Fine Pitch and High-Density Interconnects
      • 10.1.4.1. Pitch Evolution
      • 10.1.4.2. Material Challenges
      • 10.1.4.3. Hybrid Bonding Transition
  • 10.2. Material Characterization and Standardization
    • 10.2.1. Characterization Challenges
    • 10.2.2. Standardization Initiatives
    • 10.2.3. Gaps and Needs
  • 10.3. Process Integration Challenges
    • 10.3.1. Process Complexity
    • 10.3.2. Process Compatibility Requirements
    • 10.3.3. Co-optimization Challenges
  • 10.4. Cost and Supply Chain Considerations
    • 10.4.1. Cost Pressures
    • 10.4.2. Supply Concentration Risks
    • 10.4.3. Mitigation Strategies
  • 10.5. Environmental and Regulatory Compliance
    • 10.5.1. PFAS Restrictions
    • 10.5.2. Carbon Footprint Requirements
    • 10.5.3. Conflict Minerals and Responsible Sourcing
  • 10.6. Future Trends and Opportunities
    • 10.6.1. AI and HPC Driving Demand
      • 10.6.1.1. Demand Scale
      • 10.6.1.2. Material Opportunities
    • 10.6.2. 5G/6G Communications Impact
      • 10.6.2.1. 5G Deployment
      • 10.6.2.2. 6G Research
    • 10.6.3. Automotive Electronics Growth
      • 10.6.3.1. Content Growth
      • 10.6.3.2. Material Premium
  • 10.7. Technology Roadmap 2026-2036

11. COMPANY PROFILES (89 company profiles)

12. APPENDIX 1

  • 12.1. Report Objectives
  • 12.2. Scope of the Report
  • 12.3. Methodologies and Definitions

13. REFERENCES

List of Tables

  • Table 1. Polymeric materials market for advanced electronic packaging market size to 2036
  • Table 2. Advanced Packaging Market Trends
  • Table 3. Key market dirvers in advanced electronic packaging
  • Table 4. Market Forecast to 2036
  • Table 5. CAGR by Material Category (2024-2036)
  • Table 6. Polymeric Materials Classification by Function
  • Table 7. Key Material Properties Comparison (CTE, Dk, Df, Tg, Thermal Conductivity)
  • Table 8. Polymeric Materials Categories in Advanced Packaging
  • Table 9. Evolution of Material Performance Requirements (2020 vs 2024 vs 2030)
  • Table 10. Material Requirements by Packaging Platform
  • Table 11. Polymeric Materials Requirements in Advanced Packaging
  • Table 12. Global Market Size and Growth Projections (2026-2036)
  • Table 13. Dielectric materials market 2024-2036
  • Table 14. Mold compounds market 2024-2036
  • Table 15. Underfill materials market 2024-2036
  • Table 16. TBDB materials market 2024-2036
  • Table 17. Material Consumption by Package Type
  • Table 18. Volume Forecast by Material Category 2024-2036
  • Table 19. Price Dynamics by Category
  • Table 20. Market forecast by end use market 2024-2036
  • Table 21. 2.5D and 3D packaging polymeric materials market 2024-2036
  • Table 22. Regional Market Analysis
  • Table 23. PFAS Regulations Impact Timeline and Compliance Status
  • Table 24. Dielectric Material Types and Chemical Families
  • Table 25. Polymeric Dielectric Material Market Trends
  • Table 26. Dielectric Material Families - Property Comparison
  • Table 27. Dielectric Constant (Dk) and Dissipation Factor (Df) by Material Type
  • Table 28. Dielectric Material Requirements by Application
  • Table 29. Dielectric Materials Performance Comparison Matrix
  • Table 30. Dielectric Material Selection Guide
  • Table 31. Photosensitive vs. Non-photosensitive Dielectrics Comparison
  • Table 32. Panel-Level Packaging Dielectric Requirements
  • Table 33. Application Requirements by Packaging Type
  • Table 34. Lithography Capability by Material Type
  • Table 35. Lithography Resolution by Application and Material System
  • Table 36. Deposition Methods Comparison (Spin-on, Spray, Lamination)
  • Table 37. Dielectric Material Market Forecast by Type (2024-2036)
  • Table 38. Dielectric Material Market Forecast by Application (2024-2036)
  • Table 39. Price Analysis by Dielectric Type ($/kg)
  • Table 40. Mold Compound Classification (EMC, MUF, Liquid MC)
  • Table 41. Molding Process Comparison (Compression, Transfer, Liquid)
  • Table 42. Warpage Control Strategies and Material Solutions
  • Table 43. EMC vs. MUF Comparison
  • Table 44. Thermal Conductivity Requirements by Package Type
  • Table 45. CTE Values by Mold Compound Type
  • Table 46. Filler Types and Properties (SiO2, Al2O3, AlN, BN)
  • Table 47. Filler Size and Content by Application
  • Table 48. Filler Size Requirements by Application
  • Table 49. Thermoplastic vs. Thermoset Molding Compounds
  • Table 50. Thermoset vs. Thermoplastic Mold Compound Comparison
  • Table 51. Mold Compound Supplier Market Positioning
  • Table 52. Mold Compound Technology Roadmap
  • Table 53. Mold Compound Requirements for HPC/AI Packages
  • Table 54. Mold Compound Market Forecast by Type (2024-2036)
  • Table 55. Mold Compound Market Forecast by Application (2024-2036)
  • Table 56. Price Trends by Mold Compound Type ($/kg)
  • Table 57. Underfill Types Classification and Applications
  • Table 58. CUF vs MUF vs NCF vs NCP Comparison Matrix
  • Table 59. Underfill Application Methods Comparison
  • Table 60. No-Flow Underfill (NFU) Technology Evolution
  • Table 61. Underfill Type Comparison
  • Table 62. CTE Matching Analysis by Package Type
  • Table 63. Cure Time and Temperature Requirements
  • Table 64. Reworkability Comparison
  • Table 65. Fine Pitch Capability by Underfill Type (Minimum Pitch)
  • Table 66. Viscosity and Flow Characteristics by Underfill Type
  • Table 67. Hybrid Bonding Compatible Underfill Materials
  • Table 68. Underfill Supplier Market Positioning
  • Table 69. Underfill Technology Roadmap
  • Table 70. Underfill Market Forecast by Type (2024-2036)
  • Table 71. Underfill Market Forecast by Application (2024-2036)
  • Table 72. Price Analysis by Underfill Type ($/kg or $/unit)
  • Table 73. TBDB Technology Classification
  • Table 74. Debonding Method Comparison (Thermal, Laser, Chemical, Mechanical, UV)
  • Table 75. TBDB Material Format Comparison
  • Table 76. Thermal Budget Comparison by TBDB Technology
  • Table 77. Throughput Comparison by Debonding Technology
  • Table 78. Debonding Method Comparison
  • Table 79. Bond Strength Requirements by Application
  • Table 80. Residue and Contamination Levels Post-Debonding
  • Table 81. Carrier Wafer Compatibility Matrix
  • Table 82. TSV Processing Compatibility
  • Table 83. Wafer Thinning Requirements by Application
  • Table 84. Wafer Thickness Capability (Minimum Thickness Supported)
  • Table 85. Panel Level TBDB Solutions Comparison
  • Table 86. TBDB Suppliers
  • Table 87. TBDB Market Forecast by Technology (2024-2036)
  • Table 88. TBDB Market Forecast by Application (2024-2036)
  • Table 89. Cost per Wafer/Panel Analysis by TBDB Method
  • Table 90. Panel Level Packaging Material Requirements vs. Wafer Level
  • Table 91. Panel Size Roadmap and Material Implications
  • Table 92. Panel Size Roadmap: Physical Dimensions and Area Comparison
  • Table 93. Panel-Level Packaging Timeline and Adoption Roadmap
  • Table 94. Polymeric Material Requirements by Panel Size
  • Table 95. Panel-Level Packaging Material Requirements
  • Table 96. CPO Material Requirements for Optical Applications
  • Table 97. Low-Loss Polymer Properties for Waveguides
  • Table 98.CPO Material Requirements
  • Table 99. Chiplet Integration Material Challenges Map: Overview by Package Zone
  • Table 100. Chiplet Integration Material Challenge Severity Matrix
  • Table 101. Chiplet Integration Material Challenges
  • Table 102. Thermal Interface Materials Comparison
  • Table 103. Bio-based and Sustainable Polymer Alternatives
  • Table 104. Bio-based Polymer Development Timeline: Overview
  • Table 105. Bio-based Material Development by Component Category
  • Table 106. Bio-based Material Development Timeline by Packaging Application
  • Table 107. Key Technical Challenges Summary
  • Table 108. CTE Mismatch by Material-Substrate Combination
  • Table 109. Moisture Sensitivity Levels (MSL) Requirements
  • Table 110. High-Temperature Performance Requirements (>260 degree C)
  • Table 111. Fine Pitch Technology Roadmap (Bump Pitch Evolution)
  • Table 112. Material Characterization Standards Status
  • Table 113. Cost Structure Analysis by Material Type
  • Table 114. Environmental Regulations Impact Assessment
  • Table 115. PFAS Impact by Material Category
  • Table 116. Carbon Footprint Reduction Pathway
  • Table 117. Regulatory Compliance Roadmap by Material Type
  • Table 118. Polymeric Materials Ecosystem for Advanced Packaging - Companies by Category

List of Figures

  • Figure 1. Market Forecast to 2036
  • Figure 2. Polymeric Materials Ecosystem for Advanced Packaging
  • Figure 3. Cross-section of Advanced Package Showing Material Locations
  • Figure 4. Semiconductor Packaging Evolution Timeline
  • Figure 5. Volume Forecast by Material Category 2024-2036
  • Figure 6. 2.5D/3D technology roadmap
  • Figure 7. Schematic stack up of interposer/package substrate
  • Figure 8. Multilayer semi-additive process flow for package substrate fabrication
  • Figure 9. Lithography Resolution Roadmap for Dielectrics
  • Figure 10. Dielectric Material Technology Roadmap
  • Figure 11. Schematic illustrations of bonding and underfilling approaches: (a) bump bonding with capillary underfill, (b) bump bonding with pre-applied unferfill, (c) bump-less direct metal bonding, and (d) bump-less direct metal/dielectric hybrid bonding
  • Figure 12. Microbump process flow
  • Figure 13. Capillary Flow Underfill Process
  • Figure 14. Schematic of TBDB process and laser debonding equipment for advanced packaging. (a) Flow diagram of the temporary bonding and laser debonding process. (b) Schematic diagram of UV laser debonding system for wafer bonding pairs
  • Figure 15. TBDB Technology Roadmap
  • Figure 16. Co-Packaged Optics (CPO) Architecture
  • Figure 17. Schematic illustrations of the polymer waveguide combined with 45 reflectors developed on a silicon substrate as vertical-transition structures is proposed to realize the 1 A 2 vertical splitter. (a) A VCSEL chip assembled at the input port and two MMFs located at two output ports are arranged to demonstrate a two-port optical proximity coupling of the off-chip optical interconnects. (b) The cross- sectional schema of polymer waveguide. (c) The MR 2 inserted into the region III of polymer waveguide to form a vertical-transition structure
  • Figure 18. Emerging Material Technologies Readiness Level
  • Figure 19. Integrated Technology Roadmap 2026-2036