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半導體生產設備

市場調查報告書

商品編碼

1360042

全球微積體電路市場 - 2023-2030

Global Micro Integrated Circuits Market - 2023-2030

出版日期: 2023年10月11日 | 出版商:

DataM Intelligence | 英文 203 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

概述：

全球微積體電路市場2022年達到789億美元，預計2030年將達到876億美元，2023-2030年預測期間年複合成長率為6.5%。

微型 IC 設計得更小、更緊湊，同時整合了日益複雜的功能。隨著技術的發展，製造商將更多的電晶體和組件整合到單一晶片上，從而提高了電子設備的性能。智慧型手機、平板電腦、穿戴式科技和智慧家電等消費性電子產品的普及推動了對微型 IC 的需求。

例如，2023 年8 月7 日，位於阿爾伯克基的桑迪亞國家實驗室開發了一種新型矽整合微型雷射器，在各個領域提供了有前景的應用，並且當該微型雷射器與其他微型光學元件結合使用時，使其成為一種新型的矽整合微型雷射。對於自動駕駛汽車、資料中心、生化感測器和國防技術都很有價值。

預計到2022年，北美將佔據全球約1/4的市場。領先的半導體企業和學術機構都在北美。 IC 設計、製造技術和材料的不斷改進推動了更多專利和有效微型 IC 的創造。智慧型手機、平板電腦、遊戲機和智慧家居設備等消費性電子產品的需求量大。所有這些產品都必須具有微型 IC，它們的不斷發展會刺激成長。

動態：

5G 網路需求不斷成長

微型 IC 的特點是尺寸小、設計緊湊。由於 5G 基礎設施需要由小型基地台和天線組成的密集網路，因此包括 IC 在內的組件的小型化對於適應這些緊湊的安裝至關重要。 5G 網路需要更高的電源效率，以確保小型基地台和設備能夠有效運作。微型 IC 旨在最大限度地降低功耗並維持高效能應用。

例如，2023 年 2 月 23 日，AMD 將策略重點放在 5G 技術和電信領域投資，旨在擴大其在資料中心和網路市場的影響力。該公司認知到這些領域對高效能運算和連接的需求不斷成長。隨著 5G 網路的不斷發展，通訊服務供應商正在尋求對其平台進行現代化改造，並利用 5G 服務帶來的機會。

不斷增加的協作和夥伴關係增加了需求

合作通常涉及結合專業知識和資源來開發尖端的微型 IC。合作夥伴關係可以獲得互補的技術和知識，促進創新。協作努力可以分擔開發成本，減輕各個公司的財務負擔，從而鼓勵更廣泛的微型積體電路研究和開發。合作夥伴關係可以幫助公司進入新市場或擴大在現有市場的影響力。進入合作夥伴的分銷管道和客戶群可以加速市場滲透。

例如，2023 年 6 月 24 日，印美科技合作涵蓋微晶片、太空和人工智慧等各個關鍵領域。這種夥伴關係的重要性顯而易見，因為它在聯合聲明中佔據優先地位，強調其重要性高於國防、太空、地緣政治、貿易和經濟等其他方面。為了發展晶片設計和製造能力，莫迪總理簽署了半導體供應鏈合作備忘錄。

技術進步

隨著技術的發展，製造更小、更緊湊的積體電路變得更加容易，從而能夠創造出更強大、更節能的小工具。更高處理能力的 IC 是透過微架構和製造技術的改進來生產的，這對於人工智慧、資料分析和複雜計算等應用至關重要。隨著 IC 變得更加節能，行動裝置電池的使用壽命更長，各種應用所需的電量也更少。

例如，2023 年 6 月 24 日，美光科技宣布其目標是在印度古吉拉特邦建造一個新的組裝和測試設施中心。因為該中心旨在滿足國內和國際市場的需求。美光還計劃擴大其全球製造部門，為全球的基礎客戶提供服務，這項策略將滿足整個市場的記憶體儲存需求。

過熱和管道攻擊阻礙了市場的成長

雖然小型化是一個優勢，但它也帶來了挑戰。隨著 IC 變得越來越小且更容易出現製造錯誤，緊湊區域中產生的熱量可能越來越難以消散。為了有效散發高性能 IC 產生的熱量並防止過熱，經常需要散熱器和風扇等額外部件。先進 IC 的製造過程非常複雜且昂貴，涉及眾多錯綜複雜的步驟，這種複雜性可能會導致生產延遲和成本增加。

IC 可能容易受到難以偵測和緩解的硬體級攻擊，包括旁道攻擊和硬體木馬。積體電路的製造涉及危險化學品和材料的使用，導致環境問題。自然災害或地緣政治問題等全球事件可能會擾亂積體電路的供應鏈，導致短缺和價格上漲。

Micro ICs are designed to be smaller and more compact while integrating increasingly complex functionality. As developments in technology manufacturers incorporate more transistors and components onto a single chip which leads to improved performance of electronic devices. The need for micro ICs is driven by the rise in popularity of consumer electronics including smartphones, tablets, wearable technology and smart appliances.

For instance, on 7 August 2023, Sandia National Laboratories, based in Albuquerque, developed a novel silicon-integrated micro-laser that offers promising applications in various fields and this micro-laser when combined with other micro-scale optical devices, which makes it valuable for self-driving cars, data centers, biochemical sensors and defense technologies.

North America is expected to hold about 1/4th of the global market in 2022. Leading semiconductor businesses and academic institutions are all discovered in North America. The creation of more patent and effective micro ICs is driven by ongoing improvements in IC design, fabrication techniques and materials. Consumer electronics, such as smartphones, tablets, gaming consoles and smart home devices are in high demand. All of these products must have micro ICs and their ongoing evolution stimulates growth.

Dynamics:

Rising Demand for 5G Networks

Micro ICs are characterized by their small size and compact design. As 5G infrastructure requires a dense network of small cells and antennas, the miniaturization of components including ICs, is essential to fit within these compact installations. 5G networks demand higher power efficiency to ensure that small cells and devices can operate effectively. Micro ICs are designed to minimize power consumption and for maintaining high-performance applications.

For instance, on 23 February 2023, AMD's strategic focus on 5G technology and investments in the telecommunications sector are aimed at expanding its presence in the data center and networking markets. The company recognizes the increasing demand for high-performance computing and connectivity in these sectors. As 5G networks continue to evolve, communication service providers are seeking to modernize their platforms and leverage the opportunities presented by 5G services.

Rising Collaboration and Partnerships Increase Demand

Collaborations often involve combining expertise and resources to develop cutting-edge micro ICs. Partnerships allow access to complementary technologies and knowledge, fostering innovation Collaborative efforts enable the sharing of development costs, reducing the financial burden on individual companies and this encourages more extensive research and development in micro ICs. Partnerships can help companies enter new markets or expand their presence in existing ones. Access to a partner's distribution channels and customer base can accelerate market penetration.

For instance, on 24 June 2023, India-US tech partnership encompasses various crucial areas such as micro-chips, space and AI. The significance of this partnership is evident as it takes precedence in the joint statement, highlighting its importance above other aspects like defense, space, geopolitics, trade and the economy. For the development in the design of chips and fabrication capabilities Prime Minister Narender Modi signed MoU for the supply chain of the semiconductors.

Advancement in Technology

As there is development in technology, it becomes easier to make smaller and compact integrated circuits, which enables the creation of more potent, energy-saving gadgets. Higher processing power ICs are produced via improvements in microarchitecture and manufacturing techniques, which is essential for applications like artificial intelligence, data analytics and sophisticated computations. As ICs become more energy-efficient, mobile device batteries last longer and varied applications need less power.

For instance, on 24 June 2023, Micron Technology announced its objectives to construct a new assembly and test facility center in Gujarat, India. As this center aims to handle both domestic and international market demands. Micron also aims to expand its global manufacturing units to serve there base customers worldwide and this strategy leads to meet with memory storage across the market.

Overheating and Channel Attacks Hinder the Growth of the Market

While miniaturization is an advantage, it also poses challenges. The heat generated in a compact area may be increasingly difficult to dissipate as ICs get smaller and more prone to manufacturing errors. In order to effectively disperse the heat that high-performance ICs produce and prevent overheating extra parts like heat sinks and fans are frequently needed. The manufacturing process for advanced ICs is highly complex and expensive involving numerous intricate steps and this complexity can result in production delays and increased costs.

ICs may be susceptible to difficult-to-detect and-mitigate hardware-level attacks including side-channel attacks and hardware Trojans. The manufacturing of ICs involves the use of hazardous chemicals and materials, contributing to environmental concerns. Global events, such as natural disasters or geopolitical issues, can disrupt the supply chain for ICs, leading to shortages and increased prices.

Segment Analysis:

The global micro integrated circuits market is segmented based on type, application, end-user and region.

Growing Innovative Solutions in Analog Integrated Circuits

In 2022, analog ICs are expected to be the dominant segment in the global market covering around 1/3rd of the market. The ongoing trend of miniaturization enables the development of smaller, more power-efficient and higher-performance analog ICs and this appeals to various industries where space constraints are a concern. The proliferation of smartphones, wearable devices, IoT gadgets and other portable electronics drives the demand for analog.

For instance, on 7 June 2023, X-FAB Silicon Foundries SE, a leading analog/mixed-signal and MEMS foundry group, announced ambitious revenue and margin targets to achieve by 2026. By setting the objective of generating US$ 1.5 billion in sales by 2026, X-FAB demonstrates both its ambitious growth aspirations and dedication to growing its market share.

For different usage of microintegrated circuit, which include automotive, industrial, consumer electronics, medical devices and more, X-FAB specializes in producing silicon wafers. The company is known for its high-quality standards and innovative solutions in analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems.

Geographical Penetration:

Development in the Semiconductor Industries in Asia-Pacific

In 2022, Asia-Pacific is expected to be the dominant region in the global micro integrated circuits market covering more than 1/3rd of the market. Asia-Pacific countires, i.e., China, South Korea, Japan and Taiwan, have made the way in technological developments in the semiconductor industry, including the creation of advanced micro ICs for use various industries. The demand for micro ICs utilized in the fabrication of these gadgets has increased as a result of these countries having significant consumer electronics manufacturing hubs.

According to latest official data by ETV Bharat in 2023, there is increment in import of semiconductor in recent years. The value of the nation's imports of monolithic integrated circuits or microchips climbed from INR 37,354 crore in FY 2020-21 to more than 60,000 crore the next year and more than 82,000 crore in FY 2022-23. At the same time micro-chips rise from INR 14,484 to INR 31,000 crores.

Competitive Landscape

The major global players in the market include: Samsung, Qualcomm Technologies, Intel Corporation, Texas Instruments, Toshiba, NVIDIA Corporation, SK Hynix, Micron Technology, Fujitsu and Avago Technologies.

COVID-19 Impact Analysis:

The pandemic disrupted global supply chains, causing shortages of critical components and materials needed for IC manufacturing and this led to delays in production and increased costs. Many semiconductor manufacturing facilities temporarily shut down or reduced production capacity to comply with lockdowns and social distancing measures, this affected the supply of ICs, especially in industries with high demand, such as consumer electronics and healthcare.

The pandemic drove increased demand for certain ICs. For example, the shift to remote work and online activities led to higher demand for laptops, tablets and networking equipment, which rely on microchips. The pandemic disrupted the workforce in semiconductor manufacturing. Some employees fell ill, while others faced restrictions on travel and work and this impacted the ability to maintain and operate manufacturing facilities.

Research and development activities related to new microchip technologies and processes were delayed due to the pandemic. Collaborative research and innovation efforts also faced challenges. The pandemic accelerated the adoption of remote work and collaboration tools within the semiconductor industry. Engineers and designers needed to collaborate virtually on IC design, which presented both challenges and opportunities.

AI Impact

AI algorithms assist in the design and optimization of ICs and also, they can analyze vast datasets and simulations to identify the most efficient circuit layouts, helping engineers create ICs that are smaller, faster and more power-efficient. AI-driven design tools can automate the process of creating IC layouts and these tools can generate and evaluate thousands of design options in a fraction of the time it would take a human designer, leading to faster development cycles.

AI can enhance the testing and quality control of ICs. Machine learning algorithms can identify defects in manufactured ICs by analyzing patterns in test data, improving yield rates and reducing waste. AI-powered predictive maintenance can be used to monitor the health of semiconductor manufacturing equipment. By analyzing sensor data, AI can predict when equipment is likely to fail, reducing downtime and improving production efficiency.

Russia- Ukraine War Impact

Ukraine is hub for manufacture of several semiconductors and suppliers of electronic components. The war and its associated disruptions, including transportation and logistics challenges, can lead to disruptions in the semiconductor supply chain. The conflict between Russia and Ukraine has led to increased geopolitical tensions may result in shortages of critical components and materials needed for IC manufacturing.

Any disruptions in the supply chain can affect the global pricing and availability of ICs. If certain manufacturers or suppliers in the region are unable to operate or export their products, it may lead to price fluctuations and limited availability of specific ICs. Given the geopolitical uncertainties in the region, semiconductor companies may consider diversifying their manufacturing locations to reduce risk and this could lead to a shift in production away from Ukraine and Russia to other countries, potentially impacting the local economies.

By Type

Analog IC
Digital IC
Mixed Single IC

By Application

Cloud Computing
Enterprise
Edge Computing
Others

By End-User

Data Centers
Consumers Electronics
IT
Others

By Region

North America
- U.S.
- Canada
- Mexico

Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe

South America
- Brazil
- Argentina
- Rest of South America

Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific

Middle East and Africa

Key Developments

In September 2023, Rebellions Inc., a South Korean artificial intelligence chip design startup, partnered with IBM to collaborate on generative AI technology development. As part of this partnership, Rebellions will conduct testing of its AI chip, ATOM, using IBM's systems at its data center in Albany, New York, to verify the chip's quality and performance at the server level.
In August 2022, Toshiba Electronic Devices & Storage Corporation introduced a new stepping motor driver IC, the "TB67S549FTG," designed for industrial equipment such as office automation and financial equipment. The IC is compact and features built-in constant-current control without the need for external components, helping save space on circuit boards.
In March 2023, Power Integrations, a Silicon Valley-based supplier of high-performance electronic components for high-voltage power-conversion systems, unveiled a new 900-volt gallium-nitride (GaN) extension to its InnoSwitch3™ family of flyback switcher ICs and these ICs, incorporating PowiGaN technology, provide up to 100 watts with over 93 percent efficiency, eliminating the need for heat sinks and simplifying designs for space-constrained applications.

Why Purchase the Report?

To visualize the global micro integrated circuits market segmentation based on type, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of micro integrated circuits market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global micro integrated circuits market report would provide approximately 61 tables, 59 figures and 203 pages.

Target Audience 2023

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1. Methodology and Scope

1.1. Research Methodology
1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

3.1. Snippet by Type
3.2. Snippet by Application
3.3. Snippet by End-User
3.4. Snippet by Region

4. Dynamics

4.1. Impacting Factors
- 4.1.1. Drivers
  - 4.1.1.1. Rising Demand for 5G Networks
  - 4.1.1.2. Rising Collaboration and Partnerships Increase Demand
  - 4.1.1.3. Advancement in Technology
- 4.1.2. Restraints
  - 4.1.2.1. Overheating and Channel Attacks Hinder the Growth of the Market
- 4.1.3. Impact Analysis

5. Industry Analysis

5.1. Porter's Five Force Analysis
5.2. Supply Chain Analysis
5.3. Pricing Analysis
5.4. Regulatory Analysis
5.5. Russia-Ukraine War Impact Analysis
5.6. DMI Opinion

6. COVID-19 Analysis

6.1. Analysis of COVID-19
- 6.1.1. Scenario Before COVID
- 6.1.2. Scenario During COVID
- 6.1.3. Scenario Post COVID
6.2. Pricing Dynamics Amid COVID-19
6.3. Demand-Supply Spectrum
6.4. Government Initiatives Related to the Market During Pandemic
6.5. Manufacturers Strategic Initiatives
6.6. Conclusion

7. By Type

7.1. Introduction
- 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 7.1.2. Market Attractiveness Index, By Type
7.2. Analog IC*
- 7.2.1. Introduction
- 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. Digital IC
7.4. Mixed Single IC

8. By Application

8.1. Introduction
- 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 8.1.2. Market Attractiveness Index, By Application
8.2. Cloud Computing*
- 8.2.1. Introduction
- 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Enterprise
8.4. Edge Computing
8.5. Others

9. By End-User

9.1. Introduction
- 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 9.1.2. Market Attractiveness Index, By End-User
9.2. Data Centers*
- 9.2.1. Introduction
- 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Consumers Electronics
9.4. IT
9.5. Others

10. By Region

10.1. Introduction
- 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2. Market Attractiveness Index, By Region
10.2. North America
- 10.2.1. Introduction
- 10.2.2. Key Region-Specific Dynamics
- 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1. U.S.
  - 10.2.6.2. Canada
  - 10.2.6.3. Mexico
10.3. Europe
- 10.3.1. Introduction
- 10.3.2. Key Region-Specific Dynamics
- 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1. Germany
  - 10.3.6.2. UK
  - 10.3.6.3. France
  - 10.3.6.4. Italy
  - 10.3.6.5. Russia
  - 10.3.6.6. Rest of Europe
10.4. South America
- 10.4.1. Introduction
- 10.4.2. Key Region-Specific Dynamics
- 10.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1. Brazil
  - 10.4.6.2. Argentina
  - 10.4.6.3. Rest of South America
10.5. Asia-Pacific
- 10.5.1. Introduction
- 10.5.2. Key Region-Specific Dynamics
- 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1. China
  - 10.5.6.2. India
  - 10.5.6.3. Japan
  - 10.5.6.4. Australia
  - 10.5.6.5. Rest of Asia-Pacific
10.6. Middle East and Africa
- 10.6.1. Introduction
- 10.6.2. Key Region-Specific Dynamics
- 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11. Competitive Landscape

11.1. Competitive Scenario
11.2. Market Positioning/Share Analysis
11.3. Mergers and Acquisitions Analysis

12. Company Profiles

12.1. Samsung*
- 12.1.1. Company Overview
- 12.1.2. Product Portfolio and Description
- 12.1.3. Financial Overview
- 12.1.4. Key Developments
12.2. Qualcomm Technologies
12.3. Intel Corporation
12.4. Texas Instruments
12.5. Toshiba
12.6. NVIDIA Corporation
12.7. SK Hynix
12.8. Micron Technology
12.9. Fujitsu
12.10. Avago Technologies

LIST NOT EXHAUSTIVE