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半導體生產設備

市場調查報告書

商品編碼

1360039

全球積體電路市場 - 2023-2030

Global Integrated Circuits Market - 2023-2030

出版日期: 2023年10月11日 | 出版商:

DataM Intelligence | 英文 201 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

概述：

全球積體電路市場2022年達到4,743億美元，預估至2030年將達1,1035億美元，2023-2030年預測期間複合年成長率為12.6%。

半導體產業不斷開發快速且有效率的積體電路。智慧型手機和其他消費性電子產品的採用一直是市場成長的主要動力。電子製造的全球化擴大了積體電路的應用範圍，使其進入全球市場。

2020年，中國成為全球積體電路領域規模最大、成長最快的市場，市場規模達8,800億元。五年計畫期間，市場成長約20%，達到8,848億元人民幣，是全球擴張速度的4倍。進一步正在進行的研究和開發正在進行中，結果突破推動了市場。

在預測期內，北美約佔全球積體電路市場的1/4，預計呈現健康成長。由於各行業對電子產品的需求不斷增加，需要更先進和專業的積體電路。例如，2023 年 9 月 20 日，美國著名印刷電路板製造商和電子製造服務提供商 Amitron 公司推出了一個新的行業專欄，旨在推廣美國製造技術。

動態：

晶圓廠產能不斷增加，市場需求增加

由於智慧型手機、平板電腦、筆記型電腦、物聯網設備、汽車電子等電子產品的需求不斷增加，因此需要更高的IC產能。先進且專業的 IC 是 5G、人工智慧、機器學習和物聯網等新興技術所必需的，隨著這些技術得到認可，晶圓廠需要開發能夠支援這些應用的 IC。

根據 SemiFab 2023 年 9 月的報告，晶圓廠設備支出達到 995 億美元，創下歷史新高。到 2023 年，預計將年減 15%，至 840 億美元，這一下降歸因於晶片需求疲軟以及消費者和行動裝置庫存增加。 2024 年晶圓廠設備支出的復甦預計將受到多種因素的推動。關鍵因素之一是2023年半導體庫存調整結束。

對超低成本軟性積體電路的需求不斷成長

物聯網的顯著成長得益於新興產業和對低成本 IC 的需求增加，這些 IC 被整合到感測器、穿戴式裝置和智慧型手機等各種設備中。超低成本軟性 IC 在生產方面具有成本優勢，使其成為旨在降低成本的製造業的有吸引力的選擇。

例如，2021年10月18日，軟性電子領域的領導者PragmatIC Semiconductor獲得了8,000萬美元的C輪融資。該投資將用於在英格蘭東北部建立第二座 FlexLogIC 工廠，以滿足萬物互聯 (IoE) 對超低成本軟性整合電路 (FlexIC) 不斷成長的需求，這一舉措旨在加強英國的地位作為下一代半導體的領先設計者和製造商。

公司間的合作推動市場發展

全球政府、研究機構和半導體企業之間的合作鼓勵創新並加速新技術的發展。標準對於半導體業務至關重要，因為它們確保相容性和互通性。這些標準的創建和採用需要協作。為了為最終用戶提供全面的解決方案，半導體公司經常與軟體開發商、設備製造商和其他生態系統合作夥伴合作。

例如，2023 年 9 月 19 日，本田馬達宣布與台積電達成策略合作協議。此次合作旨在提升本田在電動車市場的地位並推進汽車半導體技術。本田將與頂級半導體代工廠台積電密切合作，打造專為電動車製造的專用晶片。該交易涉及製造積體電路。

設備的兼容性和過熱情況

IC 的物理尺寸有限，隨著電子設備變得更小、更緊湊，單晶片上可以整合的組件數量受到限制。 IC 在運作時會產生熱量，高功率 IC 可能需要額外的冷卻機制。功耗過高會限制攜帶式設備的電池壽命。 IC 可以包含數十億個電晶體，單一晶片的設計和製造複雜程度有實際限制。極其複雜的 IC 生產起來可能很困難且昂貴。

設計和製造 IC 的過程需要對製造設施和設備進行大量投資，而這種成本可能會成為小型公司和新創公司的進入障礙。隨著 IC 變得越來越強大，管理散熱成為一項挑戰。過熱會導致性能下降和使用壽命縮短。數位 IC 擅長處理和儲存二進位資料，但在類比訊號處理方面有其限制。音訊和射頻 (RF) 電路等應用通常需要專用類比 IC。

The semiconductor industry constantly develops fast and efficient integrated circuits. The adoption of smartphones and other consumer electronics items has been a major driver for the growth of the market. Globalization of electronics manufacturing has expanded the reach of integrated circuits and makes them accessible in the market worldwide.

In 2020, China became world's largest and fastest growing market in the field of integrated circuit sector and has net worth of Yuan 880 billion. During its five year plan the market grows about 20% and reached up to Yuan 884.8 billion that is 4 times higher than global expansion rate. Further ongoing research and development is going and results breakouts which drives the market.

During the forecast period, with around 1/4th of the global integrated circuits market, North America is expected to show a healthy growth. More advanced and specialized integrated circuits are required due to the increasing demand for electronics from various industries. For instance, on 20 September 2023, Amitron Corporation, a prominent U.S. based manufacturer of printed circuit boards and provider of electronic manufacturing services, introduced a new industry column aimed at promoting American manufacturing technology.

Dynamics:

Rising Fab Capacities Increases the Market Demand

Higher IC production capacities are required because there is increasing demand for electronic products, including smartphones, tablets, laptops, IoT devices, automotive electronics and more. Advanced and specialized ICs are necessary for emerging technologies like 5G, AI, machine learning and the Internet of Things and there is a demand for fabs to develop ICs that can support these applications as these technologies gain acknowledgment.

According to the report by SemiFab in September 2023, fab equipment spending reached a record high of US$ 99.5 billion. in 2023, there is an expected decline of 15% year-over-year (YoY) to US$ 84 billion and this decline is attributed to softening chip demand and an elevated inventory of consumer and mobile devices. The recovery in fab equipment spending in 2024 is expected to be driven by several factors. One of the key factors is the end of the semiconductor inventory correction in 2023.

Growing Demand for Ultra-Low-Cost Flexible Integrated Circuits

The internet of Things witnessed significant growth is the rising industries and increased demand for low-cost ICs and which is integrated into various devices like sensors, wearable devices and smartphones. Ultra-low-cost flexible ICs leads to offer cost advantages which in terms for production for making them an attractive choice for manufacturing which aims to reduce expenses.

For instance, on 18 October 2021, PragmatIC Semiconductor, a leader in flexible electronics, has secured US$ 80 million in Series C funding. The investment will be used to establish a second FlexLogIC fab in the North East of England to meet the rising demand for ultra-low-cost flexible integrated circuits (FlexICs) for the Internet of Everything (IoE) and this initiative aims to strengthen UK's position as a leading designer and manufacturer of next-generation semiconductor.

Collaboration between Companies Boosts the Market

Collaboration between global governments, research institutions and semiconductor businesses encourage innovation and hastens the development of new technologies. Standards are essential to the semiconductor business because they ensure compatibility and interoperability. The creation and adoption of these standards requires collaboration. To provide comprehensive solutions for end users, semiconductor companies frequently work with software developers, device manufacturers and other ecosystem partners.

For instance, on 19 September 2023, Honda Motor Co. announced a strategic collaboration deal with Taiwan Semiconductor Manufacturing Co. The collaboration aims to boost Honda's position in the market for EVs and advance automotive semiconductor technologies. Honda will collaborate closely with TSMC, a top semiconductor foundry, to create specialized chips made just for EVs. The deal is for manufacturing the integrated circuits.

Compatibility and Overheating of the Device

ICs have a finite physical size and as electronic devices become smaller and more compact, there are constraints on how many components can be integrated onto a single chip. ICs generate heat when in operation and high-power ICs may require additional cooling mechanisms. Excessive power consumption can limit battery life in portable devices. ICs can contain billions of transistors, there is a practical limit to how complex an individual chip can be designed and manufactured. Extremely complex ICs may be difficult and expensive to produce.

The process of designing and manufacturing ICs requires significant investment in fabrication facilities and equipment and this cost can be a barrier to entry for smaller companies and startups. As ICs become more powerful, managing heat dissipation becomes a challenge. Overheating can lead to reduced performance and decreased lifespan. Digital ICs excel at processing and storing binary data, they have limitations in analog signal processing. Specialized analog ICs are often required for applications like audio and radio frequency (RF) circuits.

Segment Analysis:

The global integrated circuits market is segmented based on type, product, application, end-user and region.

Adoption of Digital IC Increases the Growth of the Market

During the forecast period 2023-2030, digital ICs are estimated to account for about 1/3rd of the global integrated circuits market. Digital ICs are integral to emerging technologies such as quantum computing, edge computing and neuromorphic computing and these technologies open new avenues for digital IC innovation and growth. Collaborating with partners in different regions or industries can help digital IC manufacturers expand their market reach. Joint ventures or partnerships can open doors to new customer segments and applications.

More compact, energy-efficient and potent digital ICs may now be produced because of continuous advances in semiconductor manufacturing methods, including lower nodes. For instance, in December 2021, Taiwan Semiconductor Manufacturing Company declared a collaboration with Sony in December 2021, with the two companies investing US$ 7 billion to develop a chip manufacturing facility in Japan. The advancements will raise Digital IC production and market growth.

Geographical Penetration:

Rising Consumption of Semiconductors in Asia-Pacific

Asia-Pacific is the fastest as well as dominant region in the global integrated circuits market covering more than 1/3rd of the market. Due to the ongoing movement of diversified electronic equipment to China, the consumption of semiconductor parts in China, South Korea and Japan is fast expanding in comparison to other nations.

Furthermore, the largest sector of China's Integrated Circuits industry, IC design, has evolved from a focus on low-margin consumer applications to include advanced communication and computing semiconductors across growth markets such as automotive, the Internet of Things (IoT), crypto mining and artificial intelligence (AI).

For example, in August 2021, SiEn (Qingdao) Integrated Circuits Co, a foundry, began production of 8-inch silicon wafers and tested a new 12-inch production line in Qingdao. Furthermore, Semiconductor Manufacturing International Corp (SMIC) announced a US$ 8.87 billion investment in the construction of a chip manufacturing plant in Shanghai in September 2021. The company's strategy has been centered on integrated circuit foundry and technology services at process nodes of 28 nanometers and above.

Competitive Landscape

The major global players in the market include: Samsung, Intel Corporation, Qualcomm Technologies, Inc., Texas Instruments, SK Hynix, NVIDIA, Avago Technologies, Micron Technology, Inc., AMI Semiconductor and Toshiba Electronic Devices & Storage Corporation.

COVID-19 Impact Analysis

The IC industry which heavily relies on global supply chains for raw materials, equipment and manufacturing. Many IC manufacturers faced challenges in sourcing materials and components, causing delays in chip manufacturing. To curb the spread of the virus, many semiconductor manufacturing facilities had to shut down or operate at reduced capacity.

The pandemic also led to increased demand for certain types of ICs. With the shift to remote work and online activities, there was a surge in demand for laptops, tablets and other devices, driving the need for ICs used in these products. As there was a decrease in demand for ICs used in industries hit hardest by the pandemic, such as automotive. As car manufacturing slowed down, the demand for automotive ICs decreased.

The pandemic disrupted the workforce, leading to labor shortages in some semiconductor manufacturing plants and this further impacted production capacity. The pandemic accelerated the digital transformation in various industries, including healthcare, e-commerce and remote work and this led to increased demand for ICs used in data centers, networking equipment and telemedicine devices.

AI Impact

AI algorithms, particularly machine learning and neural networks, are being used to optimize the design of ICs. AI can explore a vast design space to find configurations that meet specific performance and power requirements. Electronic Design Automation (EDA) tools are incorporating AI to enhance their capabilities. AI-driven EDA tools can automate many aspects of the design process, speeding up chip development.

AI is helping design ICs that are more power-efficient and this is critical for mobile devices and IoT applications where battery life is a concern. AI is used for fault detection and quality control during IC manufacturing. It can identify defects in chips more accurately and quickly than manual inspection. AI-driven testing methods can quickly validate IC designs, ensuring that they meet specifications and are free from defects.

For instance, on 21 September 2023, Intel's Innovation 2023 focused on accelerating the convergence of AI and security. Intel adapts to use AI to enhance security in various fields. Massive volumes of data may be analyzed in real-time by AI algorithms, making it possible to more quickly identify and address security issues. Intel also plans to develop specific integrated circuits which will lead to a reduction of millions of software.

Russia- Ukraine War Impact

Ukraine is home to several semiconductor and electronic component manufacturers. The war could disrupt the supply of critical components and materials needed for IC production and this includes items like rare earth minerals, which are essential for manufacturing semiconductors. The conflict may force semiconductor manufacturing plants in Ukraine to suspend operations or operate at reduced capacity due to safety concerns and infrastructure damage, this can disrupt the global supply chain.

Disruptions in the supply chain which leads to shortages of ICs and related electronic components and this can affect various industries, including consumer electronics, automotive and telecommunications, which rely heavily on ICs. Shortages and supply chain disruptions often lead to price volatility. Prices of certain ICs may increase due to high demand and limited supply affecting production costs for various products.

By Type

Digital IC
Analog IC
Mixed-Signal IC

By Product

General-Purpose IC
Application-Specific IC

By Application

Standard Computers
Cell Phones
Tablets
Set Top Box
Gaming Consoles

By End-User

Consumer Electronics
Automotive
IT & Telecommunications
Manufacturing and Automation
Others

By Region

North America
- U.S.
- Canada
- Mexico

Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe

South America
- Brazil
- Argentina
- Rest of South America

Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific

Middle East and Africa

Key Developments

In August 2023, Analog Devices completed its acquisition of Maxim Integrated Products, Inc and this acquisition strengthened ADI's position as a high-performance analog semiconductor company, with pro forma trailing twelve-month revenue of over US$ 9 billion, leading margins and significant free cash flow.
In March 2022, Micross Components, Inc. announced an exclusive partnership with Apogee Semiconductor, a leader in Radiation-Hardened-by-Design semiconductors, using the patented TalRad (Transistor-Adjusted-Layout for Radiation) process. In this partnership, Micross becomes the global supplier of die and packaged devices utilizing Apogee Semiconductor technology.
In March 2022, Toshiba expanded its lineup of stepping motor driver ICs with the release of the "TB67S549FTG," a small-package stepping motor driver IC with built-in constant-current control that doesn't require external circuit components and this driver is suitable for industrial equipment such as office automation and financial equipment and helps save space on circuit boards.

Why Purchase the Report?

To visualize the global integrated circuits market segmentation based on type, product, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of integrated circuits market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global integrated circuits market report would provide approximately 69 tables, 70 figures and 201 pages.

Target Audience 2023

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1. Methodology and Scope

1.1. Research Methodology
1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

3.1. Snippet by Type
3.2. Snippet by Product
3.3. Snippet by Application
3.4. Snippet by End-User
3.5. Snippet by Region

4. Dynamics

4.1. Impacting Factors
- 4.1.1. Drivers
  - 4.1.1.1. Rising Fab Capacities Increases the Market Demand
  - 4.1.1.2. Growing Demand for Ultra-Low-Cost Flexible Integrated Circuits
  - 4.1.1.3. Collaboration between Companies Boosts the Market
- 4.1.2. Restraints
  - 4.1.2.1. Compatibility and Overheating of the Device
- 4.1.3. Impact Analysis

5. Industry Analysis

5.1. Porter's Five Force Analysis
5.2. Supply Chain Analysis
5.3. Pricing Analysis
5.4. Regulatory Analysis
5.5. Russia-Ukraine War Impact Analysis
5.6. DMI Opinion

6. COVID-19 Analysis

6.1. Analysis of COVID-19
- 6.1.1. Scenario Before COVID
- 6.1.2. Scenario During COVID
- 6.1.3. Scenario Post COVID
6.2. Pricing Dynamics Amid COVID-19
6.3. Demand-Supply Spectrum
6.4. Government Initiatives Related to the Market During Pandemic
6.5. Manufacturers Strategic Initiatives
6.6. Conclusion

7. By Type

7.1. Introduction
- 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 7.1.2. Market Attractiveness Index, By Type
7.2. Digital IC*
- 7.2.1. Introduction
- 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. Analog IC
7.4. Mixed-Signal IC

8. By Product

8.1. Introduction
- 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 8.1.2. Market Attractiveness Index, By Product
8.2. General-Purpose IC*
- 8.2.1. Introduction
- 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Application-Specific IC

9. By Application

9.1. Introduction
- 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 9.1.2. Market Attractiveness Index, By Application
9.2. Standard Computers*
- 9.2.1. Introduction
- 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Cell Phones
9.4. Tablets
9.5. Set Top Box
9.6. Gaming Consoles

10. By End-User

10.1. Introduction
- 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.1.2. Market Attractiveness Index, By End-User
10.2. Consumer Electronics*
- 10.2.1. Introduction
- 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3. Automotive
10.4. IT & Telecommunications
10.5. Manufacturing and Automation
10.6. Others

11. By Region

11.1. Introduction
- 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 11.1.2. Market Attractiveness Index, By Region
11.2. North America
- 11.2.1. Introduction
- 11.2.2. Key Region-Specific Dynamics
- 11.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.7.1. U.S.
  - 11.2.7.2. Canada
  - 11.2.7.3. Mexico
  - 11.2.7.4. Europe
- 11.2.8. Introduction
- 11.2.9. Key Region-Specific Dynamics
- 11.2.10. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.2.11. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.2.12. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.2.13. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.14. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.14.1. Germany
  - 11.2.14.2. UK
  - 11.2.14.3. France
  - 11.2.14.4. Italy
  - 11.2.14.5. Russia
  - 11.2.14.6. Rest of Europe
11.3. South America
- 11.3.1. Introduction
- 11.3.2. Key Region-Specific Dynamics
- 11.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.3.7.1. Brazil
  - 11.3.7.2. Argentina
  - 11.3.7.3. Rest of South America
11.4. Asia-Pacific
- 11.4.1. Introduction
- 11.4.2. Key Region-Specific Dynamics
- 11.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.4.7.1. China
  - 11.4.7.2. India
  - 11.4.7.3. Japan
  - 11.4.7.4. Australia
  - 11.4.7.5. Rest of Asia-Pacific
11.5. Middle East and Africa
- 11.5.1. Introduction
- 11.5.2. Key Region-Specific Dynamics
- 11.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12. Competitive Landscape

12.1. Competitive Scenario
12.2. Market Positioning/Share Analysis
12.3. Mergers and Acquisitions Analysis

13. Company Profiles

13.1. Samsung*
- 13.1.1. Company Overview
- 13.1.2. Product Portfolio and Description
- 13.1.3. Financial Overview
- 13.1.4. Key Developments
13.2. Intel Corporation
13.3. Qualcomm Technologies, Inc.
13.4. Texas Instruments
13.5. SK Hynix
13.6. NVIDIA
13.7. Avago Technologies
13.8. Micron Technology, Inc.
13.9. AMI Semiconductor
13.10. Toshiba Electronic Devices & Storage Corporation

LIST NOT EXHAUSTIVE