全球專用整合電路 (ASIC) 市場 - 2023-2030 年
市場調查報告書
商品編碼
1316220

全球專用整合電路 (ASIC) 市場 - 2023-2030 年

Global Application-Specific Integrated Circuit (ASIC) Market - 2023-2030

出版日期: | 出版商: DataM Intelligence | 英文 205 Pages | 商品交期: 約2個工作天內

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簡介目錄

市場概述

2022 年,全球專用整合電路(ASIC) 市場規模達到157 億美元,預計到2030 年將達到345 億美元,2023-2030 年的年複合成長率為8.3%。製造商的大規模生產能力對特定應用整合電路行業的發展至關重要。儘管具有潛在用途,但由於最終用戶部門繼續尋求大批量生產,因此成本仍然是小型企業發展的重要障礙。市場參與者正通過縮短產品開發週期來應對這種發展,以減少特殊性。

亞太地區成長顯著,人氣旺盛,2022 年將佔全球專用整合電路(ASIC)市場的1/3 以上。汽車行業的發展促進了對整合電路的需求,鼓勵整合電路製造商擴大生產設施。例如,2022 年8 月,模擬整合電路代工廠GTA Semiconductor 開始在上海自由貿易試驗區臨港特區進行產能擴張項目。

市場動態

5G 普及率不斷提高

5G 技術的日益普及推動了對支持5G 技術的智慧手機的需求,並為全球專用整合電路市場的成長提供了支持。 5G 支持的高速數據通訊有望促進工業自動化以及人工智慧、物聯網等新技術的採用。隨著越來越多的電子設備被用於構建此類基礎設施,對模擬電路的需求可能會上升。

中國也是最大的消費電子產品生產國和使用國之一。據中國海關統計,2021 年中國出口額約為3.36 兆美元,比上年成長30%。由於消費電子和其他電氣產品在出口額中佔很大比重,預計全球ASIC 市場將呈現持續成長態勢。

通訊設備需求不斷成長

通訊設備需求的成長推動了專用整合電路(ASIC)市場的擴大。近年來,智慧手機和智慧家居小工具的快速成長推動了印度和韓國對整合電路的需求。第五代(5G)無線技術在數位設備上的快速應用,也是互聯設備和智慧產品需求成長的重要組成部分,從而推動了對專用整合電路(ASIC)需求的成長。

根據韓國資訊社會發展研究院(KISDI)的數據,韓國智慧手機的擁有率從2020 年的91.2% 和2019 年的89.6% 大幅增至2021 年的92.7%。該地區智慧手機採用率的上升可能會增加市場對特定應用整合電路的需求。

生產週期長,復用性有限

專用整合電路的開發通常包括設計、驗證、製造和測試等多個步驟,因此開發週期較長。與FPGA 或通用整合電路等其他半導體裝置相比,將ASIC 推向市場所需的時間往往更長。公司對市場需求或技術改進做出快速反應的能力可能會因開發週期的延長而受到影響,從而降低其競爭力。

專用整合電路往往是為專門用途而開發的,可能不容易在不同產品或行業中重複使用。與通用整合電路不同,專用整合電路是為一種特定功能而設計的,因此很難將其轉用於多種用途。對於需要為不同產品或變體生產許多ASIC 的組織來說,缺乏可重複使用性可能會限製成本節約和設計效率。

COVID-19 影響分析

COVID-19 大流行對整合電路行業造成了嚴重影響,導致供應鏈中斷和全球生產停頓。然而,在疫情期間,醫療保健、遠程就業和線上通訊等幾個行業的需求卻不斷增加。醫療設備、電信基礎設施、資料中心和其他關鍵技術中使用的專用整合電路變得越來越重要。因此,這些領域對專用整合電路製造的需求增加,以滿足日益成長的需求,而其他行業的需求則有所下降。

大流行病加速了各種企業的數位化轉型。隨著組織和個人對數位服務和技術的依賴程度越來越高,為先進計算、人工智慧(AI)和其他開發中應用提供動力的ASIC 需求也隨之成長。這種需求模式的轉變可能會改變ASIC 製造商的戰略重點和產品開發路線圖。

俄羅斯-烏克蘭戰爭的影響

俄烏衝突加劇了地緣政治緊張局勢,可能對ASIC 行業產生間接影響。各國政府可能會因此實施貿易限制、制裁或進出口法律。這些措施有可能擾亂包括專用整合電路在內的商品和技術的流通,並給全球市場帶來不確定性。

烏克蘭的半導體級氖氣產量佔全球總量的90%。氖氣被製造商用於輔助製造記憶體晶片和邏輯整合電路所需的光刻和晶片蝕刻活動。由於戰爭,烏克蘭的兩家天然氣生產供應商Ingas 和Cryoin 已經暫停了在馬里烏波爾和莫斯科的業務。

此外,烏克蘭還是鈀和六氟丁二烯(C4F6)等半導體生產材料的重要供應國。此外,在入侵烏克蘭之前,俄羅斯是鎳、鈀、鉑和鋁等生產礦物的主要供應國。

目 錄

第1 章:研究方法與範圍

  • 研究方法
  • 報告的研究目標和範圍

第2章:定義和概述

第3 章:執行摘要

  • 按類型分類
  • 按應用分類
  • 按最終用戶分類
  • 按地區分類

第四章:動態

  • 影響因素
    • 促進因素
      • 5G 普及率不斷提高
      • 通訊設備需求成長
    • 限制因素
      • 生產週期長,可重複使用性有限
    • 機會
    • 影響分析

第5 章:行業分析

  • 波特五力分析法
  • 供應鏈分析
  • 定價分析
  • 監管分析

第6 章:COVID-19 分析

  • COVID-19 分析
    • COVID 之前的情況
    • COVID 期間的情景
    • COVID 後的情景
  • COVID-19 期間的定價動態
  • 供需關係
  • 大流行期間與市場相關的政府計劃
  • 製造商的戰略計劃
  • 結論

第7 章:按類型分類

  • 全客製化ASIC
  • 半客製化ASIC
  • 可編程ASIC

第8 章:按應用分類

  • 無線通訊
  • 推理應用
  • 加速和存儲
  • 過程和品質控制
  • 安全與監控
  • 其他

第9 章:按最終用戶分類

  • 資訊技術和電信
  • 汽車
  • 工業
  • 消費電子
  • 其他

第10 章:按地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 俄羅斯
    • 歐洲其他地區
  • 南美洲
    • 巴西
    • 阿根廷
    • 南美洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳大利亞
    • 亞太其他地區
  • 中東和非洲

第11 章:競爭格局

  • 競爭格局
  • 市場定位/佔有率分析
  • 合併與收購分析

第十二章:公司簡介

  • Seiko Epson Corporation
    • 公司概況
    • 產品組合和說明
    • 財務概況
    • 近期發展
  • Honeywell International Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Marvell
  • Maxim Integrated
  • Omnivision
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • STMicroelectronics

第13 章:附錄

  • 關於我們和最終用戶
簡介目錄
Product Code: ICT6526

Market Overview

Global Application-Specific Integrated Circuit (ASIC) Market reached US$ 15.7 billion in 2022 and is expected to reach US$ 34.5 billion by 2030, growing with a CAGR of 8.3% during the forecast period 2023-2030. Manufacturers' mass-production capabilities are critical to the development of the application-specific integrated circuit the sector. Despite its potential uses, costs continue to be an important barrier to small-business growth, since end-user sectors continue to seek high-volume manufacturing. Market participants are reacting to such developments by shortening product development cycles for reduced specialties.

Asia-Pacific has had significant growth and popularity, accounting for more than 1/3rd of the global application-specific integrated circuit (ASIC) market in 2022. The growth of the automotive industry contributes to the need for integrated circuits, encouraging IC manufacturers to expand their production facilities. For example, in August 2022, analogue IC foundry GTA Semiconductor began its capacity expansion project in the Shanghai Pilot Free Trade Zone's Lingang Special Area.

Market Dynamics

Increasing 5G Penetration

The increasing adoption of 5G technology is driving demand for 5G-enabled smartphones and supporting the growth of the global application-specific integrated circuit market. High-speed data communication enabled by 5G is expected to promote industrial automation and the adoption of new technologies such as AI, IoT and so on. As more electronic devices are used to construct such infrastructure, demand for analogue circuits is likely to rise.

China is also one of the largest producers and users of consumer electronics. According to China Customs, the country exported around US$ 3.36 trillion in 2021, representing a 30% increase in export value over the previous year. Since consumer electronics and other electrical products account for a significant portion of export value, the global ASIC market is anticipated to show sustained growth.

Rising Demand for Communication Devices

The increased need for communication devices is driving the expansion of the application-specific integrated circuit (ASIC) market. The rapid growth of smartphones and smart home gadgets in recent years has boosted demand for integrated circuits in India and South Korea. The rapid adoption of fifth-generation (5G) wireless technology for digital devices is also an essential component in the increasing demand for linked devices and smart products, driving up the demand for ASICs.

According to the Korea Information Society Development Institute (KISDI), smartphone ownership in South Korea grew dramatically to 92.7% in 2021 from 91.2% in 2020 and 89.6% in 2019. Such a rise in smartphone adoption in the region is likely to increase the demand for application-specific ICs in the market.

Long Production Cycle and Limited Reusability

ASIC development often consists of numerous steps, including design, verification, fabrication and testing, resulting in lengthy development cycles. When compared to other semiconductor devices, such as FPGAs or general-purpose ICs, the time required to bring an ASIC to market tends to be higher. Companies' capacity to respond rapidly to market needs or technical improvements may be hampered by the increased development period, reducing their competitiveness.

ASICs tend to be developed for specialised purposes and may not be easily repurposed across products or industries. ASICs, unlike general-purpose ICs are designed for one particular function, making it difficult to repurpose them for multiple purposes. For organisations that need to produce many ASICs for different products or variations, this lack of reusability might limit cost savings and design efficiencies.

COVID-19 Impact Analysis

The COVID-19 pandemic had a severe impact on the integrated circuits industry, causing supply chain disruptions and a global manufacturing halt. However, several industries, such as healthcare, remote employment and online communication, saw increasing demand during the epidemic. ASICs utilised in medical equipment, telecommunication infrastructure, data centres and other key technologies have become increasingly important. As a result, there was a greater need for ASIC manufacture in these areas to match the increasing demand, while demand in other industries fell.

The pandemic accelerated digital transformation in a variety of businesses. As organisations and individuals became more reliant on digital services and technology, the need for ASICs to power advanced computing, artificial intelligence (AI) and other developing applications grew. This shift in demand patterns may have changed ASIC makers' strategic focus and product development roadmaps.

Russia- Ukraine War Impact

The Russian-Ukrainian conflict has heightened geopolitical tensions, which may have an indirect influence on the ASIC sector. Various governments may implement trade restrictions, sanctions or export/import laws as a result. Such measures have the potential to disrupt the flow of commodities and technologies, including ASICs, as well as cause uncertainty in the worldwide market.

Ukraine is responsible for 90% of the world's semiconductor-grade neon gas production. Neon is used by manufacturers to aid in the lithography and chip etching activities required to build memory chips and logic ICs. Because of the war, Ingas and Cryoin, two Ukrainian producing gas suppliers, have suspended operations in Mariupol and Moscow.

Furthermore, Ukraine is a significant supplier of semiconductor production materials such as palladium and hexafluorobutadiene (C4F6). Furthermore, prior to its invasion of Ukraine, Russia was a major supplier of production minerals such as nickel, palladium, platinum and aluminium.

Segment Analysis

The global application-specific integrated circuit (ASIC) market is segmented based on type, application, end-user and region.

Next-Generation Phones drives Consumer Electronis Growth

The consumer electronics is expected to grow with the highest CAGR in the global application-specific integrated circuit market during the forecast period 2023-2030. Users may develop next-generation smartphone designs using analogue integrated circuits and reference designs. Customers will benefit from industry power management and battery management technologies, as well as new smart amp technology that provides optimal sound quality, analogue and embedded goods.

For example, Motorola announced a collaboration with Guru Wireless in May 2021 to deliver remote wireless charging technology for smartphones, reducing the need for users to utilise cable chargers and charging pads. Furthermore, the wrist Smartphone is projected to gain popularity because users will no longer need to utilise another linked device such as a smartwatch to conduct various functions such as quick class and navigation, among others.

Geographical Analysis

Growing Demand for Smart Devices in Asia-Pacific

With growing digitalization and a surge in demand for smart devices, Asia-Pacific is expected to have the highest rate of growth in the application-specific integrated circuit (ASIC) market during the forecast period. The presence of many high-performance smart TV vendors in the region, such as Samsung Electronics and Sony Corporation, has accelerated their adoption. The companies are introducing new smart TVs in Asia-Pacific in response to increased demand in the region.

For example, in August 2021, Huawei released its largest smart TV in China. The 98-inch LCD Ultra HD 4K (3840 x 2160 pixels) display has a refresh rate of 120Hz, AiMaxCinema compatibility and a DCI-P3 colour gamut. It supports DTS and Dolby dual decoding in terms of audio. The developments offer opportunities for the growth of the global application-specific integrated circuit market.

Competitive Landscape

The major global players include: Seiko Epson Corporation, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Marvell, Maxim Integrated, Omnivision, Qualcomm Technologies, Inc., Renesas Electronics Corporation and STMicroelectronics.

Why Purchase the Report?

  • To visualize the global application-specific integrated circuit (ASIC) market segmentation based on type, application, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of application-specific integrated circuit (ASIC) market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as Excel consisting of key products of all the major players.

The global application-specific integrated circuit (ASIC) market report would provide approximately 61 tables, 62 figures and 205 Pages.

Target Audience 2023

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Application
  • 3.3. Snippet by End-User
  • 3.4. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Increasing 5G Penetration
      • 4.1.1.2. Rising Demand for Communication Devices
    • 4.1.2. Restraints
      • 4.1.2.1. Long Production Cycle and Limited Reusability
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Full-Custom ASIC*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Semi-Custom ASIC
  • 7.4. Programmable ASIC

8. By Application

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2. Market Attractiveness Index, By Application
  • 8.2. Wireless Communication*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Inferencing Application
  • 8.4. Acceleration and Storage
  • 8.5. Process and Quality Control
  • 8.6. Security and Surveillance
  • 8.7. Others

9. By End-User

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 9.1.2. Market Attractiveness Index, By End-User
  • 9.2. IT and Telecommunication*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Automotive
  • 9.4. Industrial
  • 9.5. Consumer Electronics
  • 9.6. Others

10. By Region

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2. Market Attractiveness Index, By Region
  • 10.2. North America
    • 10.2.1. Introduction
    • 10.2.2. Key Region-Specific Dynamics
    • 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.6.1. U.S.
      • 10.2.6.2. Canada
      • 10.2.6.3. Mexico
  • 10.3. Europe
    • 10.3.1. Introduction
    • 10.3.2. Key Region-Specific Dynamics
    • 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.6.1. Germany
      • 10.3.6.2. UK
      • 10.3.6.3. France
      • 10.3.6.4. Italy
      • 10.3.6.5. Russia
      • 10.3.6.6. Rest of Europe
  • 10.4. South America
    • 10.4.1. Introduction
    • 10.4.2. Key Region-Specific Dynamics
    • 10.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.6.1. Brazil
      • 10.4.6.2. Argentina
      • 10.4.6.3. Rest of South America
  • 10.5. Asia-Pacific
    • 10.5.1. Introduction
    • 10.5.2. Key Region-Specific Dynamics
    • 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.6.1. China
      • 10.5.6.2. India
      • 10.5.6.3. Japan
      • 10.5.6.4. Australia
      • 10.5.6.5. Rest of Asia-Pacific
  • 10.6. Middle East and Africa
    • 10.6.1. Introduction
    • 10.6.2. Key Region-Specific Dynamics
    • 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11. Competitive Landscape

  • 11.1. Competitive Scenario
  • 11.2. Market Positioning/Share Analysis
  • 11.3. Mergers and Acquisitions Analysis

12. Company Profiles

  • 12.1. Seiko Epson Corporation*
    • 12.1.1. Company Overview
    • 12.1.2. Product Portfolio and Description
    • 12.1.3. Financial Overview
    • 12.1.4. Recent Developments
  • 12.2. Honeywell International Inc.
  • 12.3. Infineon Technologies AG
  • 12.4. Intel Corporation
  • 12.5. Marvell
  • 12.6. Maxim Integrated
  • 12.7. Omnivision
  • 12.8. Qualcomm Technologies, Inc.
  • 12.9. Renesas Electronics Corporation
  • 12.10. STMicroelectronics

LIST NOT EXHAUSTIVE

13. Appendix

  • 13.1. About Us and End-User
  • 13.2. Contact Us