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內存封裝市場：按平台、按應用、按最終用戶、按地區 - 規模、份額、展望、機會分析，2023-2030 年
市場調查報告書
商品編碼
1290531

內存封裝市場：按平台、按應用、按最終用戶、按地區 - 規模、份額、展望、機會分析，2023-2030 年

Memory Packaging Market, By Platform (Flip-chip, Lead-frame, Wafer-level Chip-scale Packaging, Through-Silicon Via, Wire-bond), By Application, By End User, and By Geography - Size, Share, Outlook, and Opportunity Analysis, 2023 - 2030
出版日期: | 出版商: Coherent Market Insights | 英文 142 Pages | 商品交期: 2-3個工作天內

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簡介目錄

內存封裝是將小型半導體芯片組裝成更堅固的形狀的過程，以便它們可以輕鬆地集成到計算機系統中。 這可以通過多種方式來完成。 這些封裝具有連接到主板的引腳，為內存模塊和系統提供兩條通信線路。 它提供 168、100 和 184 引腳配置。 也稱為小型 DIMM (SO-DIMM)。 與 DIMM 類似，但具有不同的引腳排列。 這些通常用於筆記本電腦。 常用於中低端筆記本電腦。

市場動態：

隨著業界尋求提高性能和功能，同時縮小占地面積，內存封裝市場正在快速增長。 這種情況發生之際，移動設備和計算領域對存儲芯片的需求正在不斷增加。 全球內存封裝市場預計將繼續快速增長。 這一增長率背後的主要因素是消費電子設備的需求不斷增加，預計未來將繼續增長。

另一方面，與半導體組裝和測試 (OSAT) 外包相關的挑戰預計將阻礙市場增長。

本研究的主要特點

  • 本報告對全球內存封裝市場進行了深入分析，介紹了以 2022 年為基準年的預測期（2023-2030 年）的市場規模和復合年增長率 (CAGR%)。這裡。
  • 它揭示了各個細分市場的潛在收入機會，並概述了該市場有吸引力的投資主張矩陣。
  • 它還提供了有關市場驅動因素、限制因素、機遇、新產品發布或批准、市場趨勢、區域前景以及主要參與者採取的競爭策略的重要見解。
  • 根據以下參數（包括公司亮點、產品組合、主要亮點、財務業績和戰略）介紹全球內存封裝市場的主要參與者。
  • 本次研究涵蓋的主要公司包括天水華天科技有限公司、Hana Micron Inc.、菱森精密工業有限公司、台塑先進科技有限公司 (FATC)、日月光半導體工程有限公司 (ASE Inc.)、Amkor Technology Inc.、江蘇長電科技有限公司、力成科技、金源電子股份有限公司、南茂科技股份有限公司、通富微電子股份有限公司和 Signetics Corporation。
  • 該報告的見解將使營銷人員和企業高管能夠就未來的產品發布、類型升級、市場擴張和營銷策略做出明智的決策。
  • 本報告面向該行業的各個利益相關者，包括投資者、供應商、產品製造商、分銷商、新進入者和財務分析師。
  • 利益相關者可以通過用於分析全球內存封裝市場的各種策略矩陣來促進決策。

內容

第 1 章目的和先決條件

  • 調查目的
  • 先決條件
  • 縮寫

第二章市場展望

  • 報告摘要
    • 市場定義和範圍
  • 執行摘要
  • 連貫的機會地圖 (COM)

第三章市場動態、監管與趨勢分析

  • 市場動態
    • 智能手機需求不斷增長以及技術進步
    • OSATS 行業的變化
    • 包裝技術創新
  • 影響分析
  • 主要亮點
  • 監管場景
  • 產品發布/批准
  • PEST分析
  • 《PORTER》分析
  • 合併/收購場景

第 4 章全球內存封裝市場 - 冠狀病毒 (COVID-19) 大流行的影響

  • COVID-19 流行病學調查
  • 供給側和需求側分析
  • 經濟影響

第 5 章 2017-2030 年全球內存封裝市場（按平台）

  • 倒裝芯片
  • 引線框架
  • 晶圓級芯片級封裝 (WLCSP)
  • 矽通孔 (TSV)
  • 引線鍵合

第 6 章全球存儲器封裝市場（按應用劃分，2017-2030 年）

  • NAND閃存封裝
  • NOR閃存封裝
  • DRAM 封裝
  • 其他用途

第 7 章全球內存封裝市場（按最終用戶劃分，2017-2030 年）

  • IT/電信
  • 消費電子產品
  • 嵌入式系統
  • 汽車
  • 其他最終用戶

第 8 章全球內存封裝市場（按地區），2017-2030

  • 北美
  • 歐洲
  • 亞太地區
  • 拉丁美洲
  • 中東和非洲

第 9 章競爭格局

  • Tianshui Huatian Technology Co Ltd
  • Hana Micron Inc.
  • lingsen precision industries Ltd
  • Formosa Advanced Technologies Co. Ltd（FATC）
  • Advanced Semiconductor Engineering Inc.（ASE Inc.）
  • Amkor Technology Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Powertech Technology
  • King Yuan Electronics Corp. Ltd
  • Others

第10章 

  • 調查手法
  • 出版社
簡介目錄
Product Code: CMI5667

Memory packaging is the process of assembling tiny semiconductor chips into a more durable form so that they can be easily integrated into computer systems. This can be done in a variety of ways. These packages have pins that connect to the motherboard and provide two communications lines for the memory module and the system. They are available in 168, 100, and 184 pin configurations. They are also known as small outline DIMMs (SO-DIMM). These are similar to DIMMs but use different pin settings. These are commonly used in laptop computers. They are often used in low-end and mid-range notebook computers.

Market Dynamics:

The memory packaging market is growing rapidly as the industry seeks to increase its performance and capabilities while shrinking its footprint. This is happening at a time when demand for memory chips in mobile devices and computing is increasing. The global market for memory packaging is expected to continue grow at a rapid pace. These growth rates are primarily driven by increasing demand from consumer electronics, which is expected to continue increasing in the future.

On the other hand, challenges associated with the outsourced semiconductor assembly and test (OSAT) industry is expected to hinder the market growth.

Key features of the study:

  • This report provides in-depth analysis of the global memory packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2023-2030), considering 2022 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
  • It profiles key players in the global memory packaging market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
  • Key companies covered as a part of this study include Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation
  • Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
  • The global memory packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global memory packaging market

Detailed Segmentation:

  • Global Memory Packaging Market, By Platform
    • Flip-chip
    • Lead-frame
    • Wafer-level Chip-scale Packaging (WLCSP)
    • Through-Silicon Via (TSV)
    • Wire-bond
    • Application
    • NAND Flash Packaging
    • NOR Flash Packaging
    • DRAM Packaging
    • Other Applications
  • Global Memory Packaging Market, By End User
    • IT and Telecom
    • Consumer Electronics
    • Embedded Systems
    • Automotive
    • Other End Users
  • Global Memory Packaging Market, By Region
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East & Africa
  • Company Profiles
    • Tianshui Huatian Technology Co Ltd
    • Hana Micron Inc.
    • lingsen precision industries Ltd
    • Formosa Advanced Technologies Co. Ltd (FATC)
    • Advanced Semiconductor Engineering Inc. (ASE Inc.)
    • Amkor Technology Inc.
    • Jiangsu Changjiang Electronics Technology Co. Ltd
    • Powertech Technology
    • King Yuan Electronics Corp. Ltd
    • ChipMOS Technologies Inc.
    • TongFu Microelectronics Co.
    • Signetics Corporation

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snapshot, By Platform
    • Market Snapshot, By Application
    • Market Snapshot, By End User
    • Market Snapshot, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Growing demand for smartphone and advancement in technology
    • Changing landscape of the OSATS sector
    • Innovation in packaging technology
  • Impact Analysis
  • Key Highlights
  • Regulatory Scenario
  • Product launch/Approvals
  • PEST Analysis
  • PORTER's Analysis
  • Merger and Acquisition Scenario

4. Global Memory Packaging Market - Impact of Coronavirus (COVID-19) Pandemic

  • COVID-19 Epidemiology
  • Supply Side and Demand Side Analysis
  • Economic Impact

5. Global Memory Packaging Market , By Platform, 2017-2030, (US$ Bn)

  • Introduction
    • Market Share Analysis, 2023 and 2030 (%)
    • Y-o-Y Growth Analysis, 2017 - 2030
    • Segment Trends
  • Flip-chip
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
  • Lead-frame
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
  • Wafer-level Chip-scale Packaging (WLCSP)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
  • Through-Silicon Via (TSV)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
  • Wire-bond
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)

6. Global Memory Packaging Market , By Application, 2017-2030, (US$ Bn)

  • Introduction
    • Market Share Analysis, 2023 and 2030 (%)
    • Y-o-Y Growth Analysis, 2017 - 2030
    • Segment Trends
  • NAND Flash Packaging
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • NOR Flash Packaging
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • DRAM Packaging
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • Other Applications
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)

7. Global Memory Packaging Market , By End User, 2017-2030, (US$ Bn)

  • Introduction
    • Market Share Analysis, 2023 and 2030 (%)
    • Y-o-Y Growth Analysis, 2017 - 2030
    • Segment Trends
  • IT and Telecom
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • Consumer Electronics
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • Embedded Systems
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • Automotive
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
  • Other End Users
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)

8. Global Memory Packaging Market , By Region, 2017-2030, (US$ Bn)

  • Introduction
    • Market Share Analysis, By Country, 2023 and 2030 (%)
    • Y-o-Y Growth Analysis, For Country 2017 -2030
    • Country Trends
  • North America
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
  • Europe
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
  • Asia Pacific
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
  • Latin America
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
  • Middle East & Africa
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
    • Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)

9. Competitive Landscape

  • Tianshui Huatian Technology Co Ltd
    • Company Highlights
    • Product Portfolio
    • Key Developments
    • Financial Performance
    • Strategies
  • Hana Micron Inc.
  • lingsen precision industries Ltd
  • Formosa Advanced Technologies Co. Ltd (FATC)
  • Advanced Semiconductor Engineering Inc. (ASE Inc.)
  • Amkor Technology Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Powertech Technology
  • King Yuan Electronics Corp. Ltd
  • Others
  • Analyst Views

10. Section

  • Research Methodology
  • About us