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市場調查報告書
商品編碼
1890581

全球晶圓切割液市場規模研究與預測，依產品類型（水溶性和水不溶性）、應用（半導體、太陽能晶圓、其他）及區域預測（2025-2035年）

Global Wafer Cutting Fluids Market Size Study & Forecast, by Product Type (Water-Soluble and Water-Insoluble) and Application (Semiconductor, Solar Wafer, Others) and Regional Forecasts 2025-2035
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 285 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年全球晶圓切割液市場規模約為18.7602億美元，預計在2025年至2035年的預測期內將以4.87%的複合年成長率成長。晶圓切割液通常經過特殊設計，旨在減少摩擦、控制熱量並確保超潔淨的切割效果，已成為半導體和光伏製造生產線中不可或缺的組成部分。這些切割液旨在保持高壓切割條件下的穩定性，防止微裂紋的產生，並提高用於以極高精度切割矽錠的線鋸的效率。隨著全球對微晶片、太陽能組件和電子元件的需求加速成長，製造商越來越依賴先進的切割液來實現更嚴格的製程公差和更高的良率。同時，太陽能晶圓生產技術的進步，包括更薄的晶圓設計和更高產能的生產線，進一步刺激了對能夠最佳化性能和永續性的切割液的需求。

消費性電子、汽車電子、電信和工業自動化等領域半導體裝置需求的激增，進一步推高了對高品質晶圓切割解決方案的需求。這些切割液能夠直接實現晶圓表面的平滑處理、減少切縫損耗並延長設備壽命，使其成為大批量生產設施中不可或缺的工具。同樣，隨著各國大力推廣再生能源並擴大光電發電規模，太陽能晶圓的生產也持續成長。這種轉變反過來又加劇了對能夠適應不斷變化的晶圓尺寸和快速發展的切割技術的專用切割液的需求。然而，原料價格波動和嚴格的環境合規要求等因素限制市場的發展，迫使製造商不斷改進配方，以符合永續發展標準。

目錄

第1章：全球晶圓切割液市場報告範圍與方法

  • 研究目標
  • 研究方法
    • 預測模型
    • 案頭研究
    • 自上而下和自下而上的方法
  • 研究屬性
  • 研究範圍
    • 市場定義
    • 市場區隔
  • 研究假設
    • 包容與排斥
    • 限制
    • 納入研究的年份

第2章：執行概要

  • CEO/CXO 的立場
  • 戰略洞察
  • ESG分析
  • 主要發現

第3章：全球晶圓切割液市場促進因素分析

  • 影響全球晶圓切割液市場的市場力量（2024-2035）
  • 促進要素
    • 太陽能晶片生產技術進步
    • 包括更薄的晶圓設計和更高產能的生產線
  • 約束
    • 原物料價格波動
  • 機會
    • 開發專用切削液

第4章：全球晶圓切割液產業分析

  • 波特五力模型
    • 買方的議價能力
    • 供應商的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭關係
  • 波特五力預測模型（2024-2035）
  • PESTEL 分析
    • 政治的
    • 經濟
    • 社會的
    • 科技
    • 環境的
    • 合法的
  • 最佳投資機會
  • 2025 年最佳勝利策略
  • 市佔率分析（2024-2025）
  • 2025年全球定價分析與趨勢
  • 分析師建議及結論

第5章：全球晶圓切割液市場規模及預測：依產品類型分類（2025-2035年）

  • 市場概覽
  • 全球晶圓切割液市場表現－潛力分析（2025 年）
  • 水溶性
  • 不溶於水

第6章：全球晶圓切割液市場規模及預測：依應用領域分類（2025-2035年）

  • 市場概覽
  • 全球晶圓切割液市場表現－潛力分析（2025 年）
  • 半導體
  • 太陽能晶片
  • 其他

第7章：全球晶圓切割液市場規模及預測：按地區分類（2025-2035年）

  • 成長區域市場概覽
  • 領先國家和新興國家
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 西班牙
    • 義大利
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 亞太其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • 中東和非洲
    • 阿拉伯聯合大公國
    • 沙烏地阿拉伯（KSA）
    • 南非

第8章：競爭情報

  • 頂級市場策略
  • Dow Chemical Company
    • 公司概況
    • 主要高階主管
    • 公司概況
    • 財務績效（視數據可用性而定）
    • 產品/服務端口
    • 最新進展
    • 市場策略
    • SWOT分析
  • BASF SE
  • ExxonMobil Chemical
  • TotalEnergies SE
  • Daikin Industries
  • Evonik Industries AG
  • Shell Plc
  • Fuchs Petrolub SE
  • Idemitsu Kosan Co., Ltd.
  • Sinopec Corporation
  • Lubrizol Corporation
  • Huntsman International LLC
  • Wacker Chemie AG
  • Sumitomo Chemical Co., Ltd.
  • Kao Corporation
簡介目錄

The Global Wafer Cutting Fluids Market is valued at approximately USD 1876.02 million in 2024 and is projected to expand at a CAGR of 4.87% throughout the forecast period of 2025-2035. Wafer cutting fluids-often engineered to reduce friction, manage heat, and ensure ultra-clean slicing-have become vital across semiconductor and photovoltaic fabrication lines. These fluids are designed to maintain stability under high-pressure slicing conditions, prevent microcracks, and enhance the efficiency of wire saws used to cut silicon ingots with immaculate precision. As global demand for microchips, solar modules, and electronic components accelerates, manufacturers increasingly rely on advanced cutting fluids to achieve tighter process tolerances and higher yields. Simultaneously, technological advancements in solar wafer production, including thinner wafer designs and higher throughput lines, are further stimulating the need for cutting fluids that can optimize both performance and sustainability.

The surging consumption of semiconductor devices across consumer electronics, automotive electronics, telecommunications, and industrial automation has reinforced demand for high-quality wafer slicing solutions. These fluids contribute directly to smooth wafer surfaces, reduced kerf loss, and extended equipment life-making them indispensable in high-volume fabrication facilities. Similarly, solar wafer production continues to expand as nations push for renewable energy adoption and scale up photovoltaic installations. This shift has, in turn, amplified the need for specialized cutting fluids that can support evolving wafer sizes and rapidly advancing cutting technologies. However, the market faces constraints stemming from fluctuating raw material prices and strict environmental compliance requirements, which compel manufacturers to constantly refine formulations to align with sustainability benchmarks.

The detailed segments and sub-segments included in the report are:

By Product Type:

  • Water-Soluble
  • Water-Insoluble

By Application:

  • Semiconductor
  • Solar Wafer
  • Others

By Region:

North America

  • U.S.
  • Canada

Europe

  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE

Asia Pacific

  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC

Latin America

  • Brazil
  • Mexico

Middle East & Africa

  • UAE
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Water-soluble wafer cutting fluids are projected to dominate the market during the forecast period, largely due to their superior cooling performance, easier waste management, and compatibility with the latest semiconductor wafer slicing techniques. Their ability to disperse heat efficiently and reduce debris build-up has made them the preferred choice in advanced chip fabrication plants. Meanwhile, the semiconductor application segment continues to lead the overall market, holding the largest revenue share owing to the exponential rise in chip production fueled by AI, 5G, IoT, and electric vehicle technologies. Solar wafer applications, however, are poised to become the fastest-growing segment as renewable energy projects surge globally, driving demand for high-precision slicing fluids that can support next-generation photovoltaic manufacturing.

Regional analysis highlights Asia Pacific as the dominant force in the global wafer cutting fluids market. Countries such as China, South Korea, Japan, and Taiwan house some of the world's most advanced semiconductor clusters and mega-scale photovoltaic production lines, making the region a hub for high-performance cutting fluid consumption. North America, driven by strategic semiconductor reshoring initiatives, strong R&D capabilities, and growing solar energy deployment, continues to hold a significant market share. Europe also remains a key participant, supported by its strong automotive electronics industry, rising photovoltaic adoption, and steady investment in semiconductor innovation.

Major market players included in this report are:

  • Dow Chemical Company
  • BASF SE
  • ExxonMobil Chemical
  • TotalEnergies SE
  • Daikin Industries
  • Evonik Industries AG
  • Shell Plc
  • Fuchs Petrolub SE
  • Idemitsu Kosan Co., Ltd.
  • Sinopec Corporation
  • Lubrizol Corporation
  • Huntsman International LLC
  • Wacker Chemie AG
  • Sumitomo Chemical Co., Ltd.
  • Kao Corporation

Global Wafer Cutting Fluids Market Report Scope:

  • Historical Data - 2023, 2024
  • Base Year for Estimation - 2024
  • Forecast period - 2025-2035
  • Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth Factors, and Trends
  • Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa
  • Customization Scope - Free report customization (equivalent to up to 8 analysts' working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments and countries in recent years and to forecast the values for the upcoming years. The report incorporates both qualitative and quantitative dimensions of the industry within the countries covered. It also provides detailed insights into crucial factors such as market drivers, restraints, and challenges shaping future growth trajectories. Moreover, it highlights potential opportunities in micro-markets where stakeholders can strategically invest, along with a comprehensive analysis of the competitive ecosystem and product offerings of leading companies. The detailed segments and sub-segments of the market are explained above.

Key Takeaways:

  • Market estimates & forecast for 10 years from 2025 to 2035.
  • Annualized revenues and regional-level analysis for each market segment.
  • Detailed analysis of the geographical landscape with country-level insights.
  • Competitive landscape with information on major players in the market.
  • Evaluation of key business strategies and recommendations for future market approaches.
  • Assessment of the competitive structure of the market.
  • Demand-side and supply-side analysis of the market.

Table of Contents

Chapter 1. Global Wafer Cutting Fluids Market Report Scope & Methodology

  • 1.1. Research Objective
  • 1.2. Research Methodology
    • 1.2.1. Forecast Model
    • 1.2.2. Desk Research
    • 1.2.3. Top Down and Bottom-Up Approach
  • 1.3. Research Attributes
  • 1.4. Scope of the Study
    • 1.4.1. Market Definition
    • 1.4.2. Market Segmentation
  • 1.5. Research Assumption
    • 1.5.1. Inclusion & Exclusion
    • 1.5.2. Limitations
    • 1.5.3. Years Considered for the Study

Chapter 2. Executive Summary

  • 2.1. CEO/CXO Standpoint
  • 2.2. Strategic Insights
  • 2.3. ESG Analysis
  • 2.4. key Findings

Chapter 3. Global Wafer Cutting Fluids Market Forces Analysis

  • 3.1. Market Forces Shaping The Global Wafer Cutting Fluids Market (2024-2035)
  • 3.2. Drivers
    • 3.2.1. technological advancements in solar wafer production
    • 3.2.2. including thinner wafer designs and higher throughput lines
  • 3.3. Restraints
    • 3.3.1. fluctuating raw material prices
  • 3.4. Opportunities
    • 3.4.1. Growing specialized cutting fluids

Chapter 4. Global Wafer Cutting Fluids Industry Analysis

  • 4.1. Porter's 5 Forces Model
    • 4.1.1. Bargaining Power of Buyer
    • 4.1.2. Bargaining Power of Supplier
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. Porter's 5 Force Forecast Model (2024-2035)
  • 4.3. PESTEL Analysis
    • 4.3.1. Political
    • 4.3.2. Economical
    • 4.3.3. Social
    • 4.3.4. Technological
    • 4.3.5. Environmental
    • 4.3.6. Legal
  • 4.4. Top Investment Opportunities
  • 4.5. Top Winning Strategies (2025)
  • 4.6. Market Share Analysis (2024-2025)
  • 4.7. Global Pricing Analysis And Trends 2025
  • 4.8. Analyst Recommendation & Conclusion

Chapter 5. Global Wafer Cutting Fluids Market Size & Forecasts by Product Product Type 2025-2035

  • 5.1. Market Overview
  • 5.2. Global Wafer Cutting Fluids Market Performance - Potential Analysis (2025)
  • 5.3. Water-Soluble
    • 5.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 5.3.2. Market size analysis, by region, 2025-2035
  • 5.4. Water-Insoluble
    • 5.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 5.4.2. Market size analysis, by region, 2025-2035

Chapter 6. Global Wafer Cutting Fluids Market Size & Forecasts by Application 2025-2035

  • 6.1. Market Overview
  • 6.2. Global Wafer Cutting Fluids Market Performance - Potential Analysis (2025)
  • 6.3. Semiconductor
    • 6.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 6.3.2. Market size analysis, by region, 2025-2035
  • 6.4. Solar Wafer
    • 6.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 6.4.2. Market size analysis, by region, 2025-2035
  • 6.5. Others
    • 6.5.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
    • 6.5.2. Market size analysis, by region, 2025-2035

Chapter 7. Global Wafer Cutting Fluids Market Size & Forecasts by Region 2025-2035

  • 7.1. Growth Wafer Cutting Fluids Market, Regional Market Snapshot
  • 7.2. Top Leading & Emerging Countries
  • 7.3. North America Wafer Cutting Fluids Market
    • 7.3.1. U.S. Wafer Cutting Fluids Market
      • 7.3.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.3.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.3.2. Canada Wafer Cutting Fluids Market
      • 7.3.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.3.2.2. Application breakdown size & forecasts, 2025-2035
  • 7.4. Europe Wafer Cutting Fluids Market
    • 7.4.1. UK Wafer Cutting Fluids Market
      • 7.4.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.2. Germany Wafer Cutting Fluids Market
      • 7.4.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.2.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.3. France Wafer Cutting Fluids Market
      • 7.4.3.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.3.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.4. Spain Wafer Cutting Fluids Market
      • 7.4.4.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.4.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.5. Italy Wafer Cutting Fluids Market
      • 7.4.5.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.5.2. Application breakdown size & forecasts, 2025-2035
    • 7.4.6. Rest of Europe Wafer Cutting Fluids Market
      • 7.4.6.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.4.6.2. Application breakdown size & forecasts, 2025-2035
  • 7.5. Asia Pacific Wafer Cutting Fluids Market
    • 7.5.1. China Wafer Cutting Fluids Market
      • 7.5.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.2. India Wafer Cutting Fluids Market
      • 7.5.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.2.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.3. Japan Wafer Cutting Fluids Market
      • 7.5.3.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.3.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.4. Australia Wafer Cutting Fluids Market
      • 7.5.4.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.4.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.5. South Korea Wafer Cutting Fluids Market
      • 7.5.5.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.5.2. Application breakdown size & forecasts, 2025-2035
    • 7.5.6. Rest of APAC Wafer Cutting Fluids Market
      • 7.5.6.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.5.6.2. Application breakdown size & forecasts, 2025-2035
  • 7.6. Latin America Wafer Cutting Fluids Market
    • 7.6.1. Brazil Wafer Cutting Fluids Market
      • 7.6.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.6.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.6.2. Mexico Wafer Cutting Fluids Market
      • 7.6.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.6.2.2. Application breakdown size & forecasts, 2025-2035
  • 7.7. Middle East and Africa Wafer Cutting Fluids Market
    • 7.7.1. UAE Wafer Cutting Fluids Market
      • 7.7.1.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.7.1.2. Application breakdown size & forecasts, 2025-2035
    • 7.7.2. Saudi Arabia (KSA) Wafer Cutting Fluids Market
      • 7.7.2.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.7.2.2. Application breakdown size & forecasts, 2025-2035
    • 7.7.3. South Africa Wafer Cutting Fluids Market
      • 7.7.3.1. Product Type breakdown size & forecasts, 2025-2035
      • 7.7.3.2. Application breakdown size & forecasts, 2025-2035

Chapter 8. Competitive Intelligence

  • 8.1. Top Market Strategies
  • 8.2. Dow Chemical Company
    • 8.2.1. Company Overview
    • 8.2.2. Key Executives
    • 8.2.3. Company Snapshot
    • 8.2.4. Financial Performance (Subject to Data Availability)
    • 8.2.5. Product/Services Port
    • 8.2.6. Recent Development
    • 8.2.7. Market Strategies
    • 8.2.8. SWOT Analysis
  • 8.3. BASF SE
  • 8.4. ExxonMobil Chemical
  • 8.5. TotalEnergies SE
  • 8.6. Daikin Industries
  • 8.7. Evonik Industries AG
  • 8.8. Shell Plc
  • 8.9. Fuchs Petrolub SE
  • 8.10. Idemitsu Kosan Co., Ltd.
  • 8.11. Sinopec Corporation
  • 8.12. Lubrizol Corporation
  • 8.13. Huntsman International LLC
  • 8.14. Wacker Chemie AG
  • 8.15. Sumitomo Chemical Co., Ltd.
  • 8.16. Kao Corporation