市場調查報告書
商品編碼
1131999
焊錫材料全球市場規模調查,按產品類型(焊錫絲、焊膏、焊條、助焊劑)、按工藝(絲網印刷、機器人、激光、波峰/回流焊)、區域預測 2022-2028Global Solder Materials Market Size study, By Product Type (Solder Wire, Solder Paste, Solder Bar, Solder Flux), By Process (Screen-printing, Robotic, Laser, Wave/Reflow), and Regional Forecasts 2022-2028 |
焊料是通常用於將金屬工件連接在一起的易熔金屬合金。
該工藝中使用的金屬填料的熔點低於其他相鄰金屬。汽車行業使用量增加、電子行業需求增長以及無鉛焊料研發投資增加等因素正在推動全球市場需求。例如,根據 Statista 的數據,2017 年汽車行業的價值估計約為 5.315 萬億美元,預計到 2030 年該行業將逐漸增長至 8.931 萬億美元。因此,汽車行業的增長刺激了對焊錫材料的需求,這將有利於在不久的將來全球市場的增長。然而,無鉛焊料的高成本以及與焊接相關的若干健康風險正在阻礙 2022-2028 年預測期內的市場增長。此外,在預測期內,基於納米粒子的焊料材料的興起和半導體行業焊料材料的日益普及預計將成為市場需求的催化劑。
考慮進行全球焊接材料市場研究的主要地區包括亞太地區、北美、歐洲、拉丁美洲和世界其他地區。由於先進半導體設備產量的增加和翻新行業的增長,北美是全球市場份額的主要地區。另一方面,預計亞太地區將在 2022-2028 年的預測期內表現出最高的複合年增長率。電子設備需求激增和政府加大經濟發展力度等因素將為亞太地區焊料市場提供良好的增長前景。
本報告中包括的主要市場進入者是:
本研究的目的是確定近年來各個細分市場和國家的市場規模,並預測未來八年的價值。本報告旨在捕捉所研究的每個地區和國家的行業的定性和定量方面。此外,它還提供了有關關鍵方面的詳細信息,例如定義市場未來增長的驅動因素和挑戰。此外,報告還應詳細分析主要參與者的競爭格局和產品供應,以及微觀市場中可供利益相關者投資的機會。市場的詳細細分和子細分如下所述。
按產品類型。
焊錫絲
錫膏
焊錫條
助焊劑
按流程
絲網印刷
機器人
激光
波/回流
按地區
北美
美國
加拿大
歐洲
英國
德國
法國
西班牙
意大利
歐洲其他地區
亞太地區
中國
印度
日本
澳大利亞
韓國
其他亞太地區
拉丁美洲
巴西
墨西哥
世界其他地區
此外,本研究考慮的年份是:
實際年份 - 2018 年、2019 年、2020 年
2021 年基準年
預測期 - 2022-2028
本報告的目標受眾是全球焊接材料市場
主要諮詢公司和顧問
大公司、中型公司、中小企業
風險投資
增值經銷商 (VAR)
第三方知識提供者
投資銀行家
投資者
Global Solder Materials Market is valued at approximately USD XX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2028. Solder is a fusible metal alloy that is generally used to form a bond between metal workpieces. The filler metal used during the process consists of a lower melting point compared to the other adjoining metal. Factors such as the rising usage in the automotive industry, growing demand from the electronics industry, coupled with the increasing R&D investments for lead-free solder materials are propelling the market demand across the globe. For instance, according to Statista, in 2017, the automotive industry was estimated to be worth around USD 5,315 billion, and the industry progressively grows and is anticipated to reach USD 8,931 billion by the year 2030. Consequentially, the growth of the automotive industry is stimulating the demand for Solder Materials, which, in turn, excels the global market growth in the near future. However, the high cost of lead-free solder and several health risks associated with soldering impede the growth of the market over the forecast period of 2022-2028. Also, the rising emergence of nanoparticle-based solder materials and the growing adoption of solder materials from the semiconductor industry are anticipated to act as catalyzing factors for the market demand during the forecast period.
The key regions considered for the global Solder Materials Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. North America is the leading region across the world in terms of market share owing to the increasing production of advanced semiconductor devices and growth of the refurbishing industry. Whereas, Asia-Pacific is anticipated to exhibit the highest CAGR over the forecast period 2022-2028. Factors such as the surging demand for electronic devices, as well as rising government initiatives toward economic development, would create lucrative growth prospects for the Solder Materials Market across the Asia-Pacific region.
Major market players included in this report are:
Element Solutions, Inc.
Lucas Milhaupt Inc.
Henkel AG & Co. KGaA
Senju Metal Industries Co. Ltd.
Koki Company Limited
Indium Corporation
The Dow Chemical Company (DowDuPont)
Tamura Corporation
Stannol GmbH & Co. KG
Nihon Genma
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Product Type:
Solder Wire
Solder Paste
Solder Bar
Solder Flux
By Process:
Screen-printing
Robotic
Laser
Wave/Reflow
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year - 2018, 2019, 2020
Base year - 2021
Forecast period - 2022 to 2028
Target Audience of the Global Solder Materials Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors
List of figures