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2073393

蜂巢式物聯網和低功耗廣域網路晶片組和模組市場（第十版）

The Cellular IoT and LPWA Chipset and Module Market - 10th Edition
出版日期: | 出版商: Berg Insight | 英文 150 Pages | 商品交期: 最快1-2個工作天內

價格

目前，全球對物聯網廣域網路技術的需求正處於成長階段。根據Berg Insight預測，蜂巢和非3GPP低功耗廣域網路（LPWA）物聯網模組的年出貨量預計將從2025年的9.09億個成長到2030年的13.2億個，複合年成長率（CAGR）為7.7%。這份獨特的150頁報告和資料庫涵蓋了30多種設備類型、10種技術和6個區域市場的蜂巢式物聯網晶片組和模組的出貨量，提供了所有行業市場的最新趨勢。

報告要點：

  • 主要物聯網廣域網路生態系進行360度全方位概述。
  • 2018 年至 2030 年按地區、產業、設備類型和技術分類的蜂巢式物聯網晶片組和模組資料。
  • 蜂巢式物聯網晶片組和模組供應商的市場佔有率
  • 技術和標準比較
  • 領先的物聯網晶片組和模組供應商最新簡介
  • 5G 技術（包括 5G eMBB、5G RedCap 和 5G eRedCap）以及 LPWA 技術（包括 NB-IoT、LTE-M、LoRa 和 Sigfox）的部署趨勢。
  • 2030 年前蜂窩和非 3GPP LPWA 物聯網設備市場預測

目錄

圖表一覽

執行摘要

第1章：物聯網廣域網

  • 哪些類型的設備將連接到廣域網路？
    • 公用事業計量表
    • 車
    • 大樓
    • 資產追蹤和供應鏈可視性
    • 打造更智慧、更安全城市的契機
    • 物聯網與人工智慧的融合
  • 有哪些技術方案可供選擇？
    • 網路部署模型
    • 授權頻段和非授權頻段
    • 蜂窩技術和低功耗廣域網路技術的成本比較
  • 主要的技術生態係有哪些？
  • 技術特點
    • 3GPP 第 13 版 (2016) - LTE-M 和 NB-IoT 的引入
    • 3GPP 第 14 版 (2017) - 物聯網功能增強和 C-V2X
    • 3GPP 第 15 版 (2019) - 5G 規範的第一階段
    • 3GPP Release 16 (2020) - URLLC 和 5G NR C-V2X
    • 3GPP 第 17 版 (2022) - RedCap 與 NTN Communications
    • 3GPP Release 18 (2024) - 首個 5G-Advanced 規格和 eRedCap。
    • 3GPP 第 19 版（2025 年）—環境聯網作為一種新型低功耗蜂巢式物聯網
  • 網路覆蓋範圍
    • 2G/3G行動網路
    • 4G LTE行動網路
    • 4G/5G行動物聯網網路（LTE-M和NB-IoT）
    • 5G行動網路
  • 半導體供應商
    • Altair Semiconductor
    • ASR Microelectronics
    • Eigencomm
    • HiSilicon
    • MediaTek
    • MLINK
    • Qualcomm
    • Samsung Electronics
    • Sequans Communications
    • UNISOC
    • Xinyi Information Technology
    • 其他半導體供應商
  • 模組供應商
    • Cavli Wireless
    • China Mobile IoT
    • Eagle Wireless
    • Fibocom
    • Kontron
    • Lierda
    • MeiG Smart Technology
    • Murata
    • Neoway
    • Nordic Semiconductor
    • Quectel
    • Rolling Wireless
    • Semtech
    • Sunsea AIoT (SIMCom & Longsung)
    • Telit Cinterion
    • Trasna
    • ZxInfoTek
    • 其他蜂巢式物聯網模組供應商

第3章：LoRa 和 LoRaWAN 生態系統

  • 技術特點
  • 網路覆蓋範圍
    • 歐洲
    • 亞太地區
    • 美洲
    • 中東和非洲
  • 半導體和模組供應商
    • Semtech
    • 其他半導體供應商
    • LoRa模組供應商

第4章：Sigfox 生態系統

  • 技術特點
  • 網路覆蓋範圍
    • 歐洲
    • 美洲
    • 亞太地區
    • 中東和非洲
    • UnaBiz與LoRaWAN生態系合作
    • Sigfox 的主要應用場景
  • 半導體和模組供應商
    • 半導體供應商
    • Sigfox 模組供應商

第5章：低功耗物聯網連結生態系的興起

  • IEEE 802.15.4
    • 基於 802.15.4 的連接堆疊
    • 網路覆蓋範圍
  • Wirepas Mesh
  • DECT-2020 NR（NR+）
  • 米奧蒂
  • 晶片組和模組供應商

第6章 市場預測與趨勢

  • 市場概況
  • 蜂巢式物聯網設備市場
    • 蜂巢式物聯網晶片組市場佔有率
    • 蜂巢式物聯網模組的市場佔有率
    • 汽車蜂巢式物聯網晶片組的市場佔有率
    • NAD模組市場佔有率
  • 蜂巢式物聯網技術的現狀
  • 蜂巢式物聯網區域市場趨勢
    • 歐洲
    • 北美洲
    • 拉丁美洲
    • 中國
    • 亞太其他地區
    • 中東和非洲
  • LoRa設備市場
  • Sigfox 設備市場
  • 低功耗物聯網連接技術的興起

縮寫和簡稱列表

Global demand for IoT wide area networking technology is in a growth phase. Berg Insight forecasts that annual shipments of cellular and non-3GPP LPWA IoT modules will grow at a compound annual growth rate (CAGR) of 7.7 percent from 909 million units in 2025 to 1.32 billion units in 2030. Get up to date with the latest trends from all vertical markets with this unique 150-page report and database covering cellular IoT chipset and module shipments across 30+ device types, 10 technologies and 6 regional markets.

Highlights from the report:

  • 360-degree overview of the main IoT wide area networking ecosystems.
  • Cellular IoT chipset and module data by region, vertical, device type and technology from 2018–2030.
  • Market shares for cellular IoT chipset and module vendors.
  • Comparison of technologies and standards.
  • Updated profiles of the main suppliers of IoT chipsets and modules.
  • Adoption trends for 5G technologies including 5G eMBB, 5G RedCap and 5G eRedCap, as well as LPWA technologies including NB-IoT, LTE-M, LoRa and Sigfox.
  • Cellular and non-3GPP LPWA IoT device market forecasts until 2030.

Table of Contents

List of Figures

Executive Summary

1 Wide Area Networks for the Internet of Things

  • 1.1 Which things will be connected to wide area networks?
    • 1.1.1 Utility meters
    • 1.1.2 Motor vehicles
    • 1.1.3 Buildings
    • 1.1.4 Asset tracking and supply chain visibility
    • 1.1.5 The opportunity to create smarter and safer cities
    • 1.1.6 The convergence of IoT and AI
  • 1.2 What are the technology options?
    • 1.2.1 Network deployment models
    • 1.2.2 Licensed and unlicensed frequency bands
    • 1.2.3 Cost comparison for cellular and LPWA technologies
  • 1.3 Which are the leading technology ecosystems?
  • 2.1 Technology characteristics
    • 2.1.1 3GPP Release 13 (2016) – Introducing LTE-M and NB-IoT
    • 2.1.2 3GPP Release 14 (2017) – IoT enhancements and C-V2X
    • 2.1.3 3GPP Release 15 (2019) – The first phase of 5G specifications
    • 2.1.4 3GPP Release 16 (2020) – URLLC and 5G NR C-V2X
    • 2.1.5 3GPP Release 17 (2022) – RedCap and NTN communications
    • 2.1.6 3GPP Release 18 (2024) – The first 5G-Advanced specifications and eRedCap .
    • 2.1.7 3GPP Release 19 (2025) – Ambient IoT as a new low-power cellular IoT class
  • 2.2 Network footprint
    • 2.2.1 2G/3G mobile networks
    • 2.2.2 4G LTE mobile networks
    • 2.2.3 4G/5G mobile IoT networks (LTE-M and NB-IoT)
    • 2.2.4 5G mobile networks
  • 2.3 Semiconductor vendors
    • 2.3.1 Altair Semiconductor
    • 2.3.2 ASR Microelectronics
    • 2.3.3 Eigencomm
    • 2.3.4 HiSilicon
    • 2.3.5 MediaTek
    • 2.3.6 MLINK
    • 2.3.7 Qualcomm
    • 2.3.8 Samsung Electronics
    • 2.3.9 Sequans Communications
    • 2.3.10 UNISOC
    • 2.3.11 Xinyi Information Technology
    • 2.3.12 Other semiconductor vendors
  • 2.4 Module vendors
    • 2.4.1 Cavli Wireless
    • 2.4.2 China Mobile IoT
    • 2.4.3 Eagle Wireless
    • 2.4.4 Fibocom
    • 2.4.5 Kontron
    • 2.4.6 Lierda
    • 2.4.7 MeiG Smart Technology
    • 2.4.8 Murata
    • 2.4.9 Neoway
    • 2.4.10 Nordic Semiconductor
    • 2.4.11 Quectel
    • 2.4.12 Rolling Wireless
    • 2.4.13 Semtech
    • 2.4.14 Sunsea AIoT (SIMCom & Longsung)
    • 2.4.15 Telit Cinterion
    • 2.4.16 Trasna
    • 2.4.17 ZxInfoTek
    • 2.4.18 Other cellular IoT module vendors

3 LoRa and LoRaWAN Ecosystem

  • 3.1 Technology characteristics
  • 3.2 Network footprint
    • 3.2.1 Europe
    • 3.2.2 Asia-Pacific
    • 3.2.3 The Americas
    • 3.2.4 Middle East & Africa
  • 3.3 Semiconductor and module vendors
    • 3.3.1 Semtech
    • 3.3.2 Other semiconductor vendors
    • 3.3.3 LoRa module vendors

4 Sigfox Ecosystem

  • 4.1 Technology characteristics
  • 4.2 Network footprint
    • 4.2.1 Europe
    • 4.2.2 The Americas
    • 4.2.3 Asia-Pacific
    • 4.2.4 Middle East & Africa
    • 4.2.5 UnaBiz partners with the LoRaWAN ecosystem
    • 4.2.6 Examples of major Sigfox use cases
  • 4.3 Semiconductor and module vendors
    • 4.3.1 Semiconductor vendors
    • 4.3.2 Sigfox module vendors

5 Emerging Low-Power IoT Connectivity Ecosystems

  • 5.1 IEEE 802.15.4
    • 5.1.1 Connectivity stacks based on 802.15.4
    • 5.1.2 Network footprint
  • 5.2 Wirepas Mesh
  • 5.3 DECT-2020 NR (NR+)
  • 5.4 Mioty
  • 5.5 Chipset and module vendors

6 Market Forecasts and Trends

  • 6.1 Market summary
  • 6.2 The cellular IoT device market
    • 6.2.1 The cellular IoT chipset market shares
    • 6.2.2 Cellular IoT module market shares
    • 6.2.3 Automotive cellular IoT chipset market shares
    • 6.2.4 NAD module market shares
  • 6.3 The cellular IoT technology landscape
  • 6.4 Cellular IoT regional market trends
    • 6.4.1 Europe
    • 6.4.2 North America
    • 6.4.3 Latin America
    • 6.4.4 China
    • 6.4.5 Rest of Asia-Pacific
    • 6.4.6 Middle East & Africa
  • 6.5 The LoRa device market
  • 6.6 The Sigfox device market
  • 6.7 Emerging low-power IoT connectivity technologies

List of Acronyms and Abbreviations

List of Figures

  • Figure 1.1: Top wide area IoT target segments (2025)
  • Figure 1.2: Building stock by category (EU27+3/US 2025)
  • Figure 1.3: Unlicensed frequency bands for wireless IoT applications
  • Figure 1.4: Cost comparison for wireless modules (2026)
  • Figure 2.1: Comparison of LTE Cat-1, LTE Cat-1 bis, LTE-M and NB-IoT specifications
  • Figure 2.2: Comparison of RedCap and eRedCap specifications
  • Figure 2.3: Technology positioning of RedCap in relation to eMBB, URLLC and mMTC
  • Figure 2.4: IoT solution design options
  • Figure 2.5: Cost comparison between module and chip-down designs
  • Figure 2.6: Routes to market for cellular IoT chipsets
  • Figure 2.7: Business activities of key cellular chipset providers (Q2-2026)
  • Figure 2.8: ASR Microelectronics’ cellular IoT chipsets (Q2-2026)
  • Figure 2.9: Eigencomm revenues by product/service (2022–2024)
  • Figure 2.10: Eigencomm’s cellular IoT chipsets (Q2-2026)
  • Figure 2.11: MediaTek’s cellular IoT chipsets (Q2-2026)
  • Figure 2.12: MLINK’s IoT chipsets (Q2-2026)
  • Figure 2.13: Qualcomm’s IoT modem chipsets (Q2-2026)
  • Figure 2.14: QCT revenues by segment (2023–2025)
  • Figure 2.15: Samsung’s automotive chip solutions
  • Figure 2.16: Sequans’ product and licence revenues (2022–2025)
  • Figure 2.17: UNISOC’s cellular IoT chipsets (Q2-2026)
  • Figure 2.18: Xinyi’s cellular IoT chipsets (Q2-2026)
  • Figure 2.19: Business activities of other cellular chipset providers (Q2-2026)
  • Figure 2.20: Fibocom’s embedded wireless IoT modules (Q2-2026)
  • Figure 2.21: Fibocom’s AI-powered robot solution
  • Figure 2.22: MeiG’s embedded cellular IoT modules (Q2-2026)
  • Figure 2.23: Neoway’s revenue by segment (2023–2025)
  • Figure 2.24: Neoway’s embedded cellular IoT modules (Q2-2026)
  • Figure 2.25: Nordic Semiconductor’s revenues by segment (2021–2025)
  • Figure 2.26: Feature comparison of the nRF91 and nRF93 modules
  • Figure 2.27: Quectel’s cellular IoT module series (Q2-2026)
  • Figure 2.28: Semtech’s embedded cellular module series (Q2-2026)
  • Figure 2.29: Semtech’s embedded cellular modules (Q2-2026)
  • Figure 2.30: Sunsea AIoT’s revenue by segment (2022–2025)
  • Figure 2.31: Embedded cellular IoT modules from SIMCom and Longsung (Q2-2026)
  • Figure 2.32: Overview of the SIMCom AI stack
  • Figure 2.33: Telit Cinterion’s embedded cellular IoT modules (Q2-2026)
  • Figure 2.34: Trasna’s embedded cellular IoT modules (Q2-2026)
  • Figure 2.35: ZxInfoTek’s LTE Cat-1 bis modules (Q2-2026)
  • Figure 3.1: LoRaWAN network architecture
  • Figure 3.2: Public LoRaWAN network operators in Europe (Q2-2026)
  • Figure 3.3: Public LoRaWAN network operators in Asia-Pacific (Q2-2026)
  • Figure 3.4: Public LoRaWAN network operators in the Americas (Q2-2026)
  • Figure 3.5: Amazon Sidewalk network coverage (Q2-2026)
  • Figure 3.6: Public LoRaWAN network operators in Middle East & Africa (Q2-2026)
  • Figure 3.7: Semtech’s LoRa business KPIs (FY-2023–FY-2026)
  • Figure 3.8: LoRa module vendors (Q2-2026)
  • Figure 4.1: Sigfox network architecture
  • Figure 4.2: Sigfox network partners in Europe (Q1-2026)
  • Figure 4.3: Sigfox networks in the Americas (Q1-2026)
  • Figure 4.4: Sigfox networks in Asia-Pacific and MEA (Q1-2026)
  • Figure 4.5: List of Sigfox module vendors by supported regions (Q1-2026)
  • Figure 5.1: Major 802.15.4 networking platforms for smart metering (Q4-2025)
  • Figure 5.2: Technology positioning for NR+ in relation to eMBB, URLLC and mMTC
  • Figure 5.3: The Mioty telegram splitting technology
  • Figure 5.4: Members of the Mioty Alliance (Q2-2026)
  • Figure 6.1: Cellular/non-3GPP LPWA IoT device shipments by region (World 2024–2030)
  • Figure 6.2: Cellular/non-3GPP LPWA IoT device shipments by technology (World 2025)
  • Figure 6.3: Cellular IoT device design architectures
  • Figure 6.4: Cellular IoT device shipments by design architecture
  • Figure 6.5: Cellular IoT chipset vendor volume market shares (World 2025)
  • Figure 6.6: Cellular IoT chipset vendor volume by technology (World 2025)
  • Figure 6.7: Top cellular IoT module vendors, by revenues and shipments (World 2025)
  • Figure 6.8: Automotive cellular IoT chipset volume market shares (World 2025)
  • Figure 6.9: NAD module volume market shares (World 2025)
  • Figure 6.10: Cellular IoT module shipment forecast by technology (World 2024–2030)
  • Figure 6.11: Top 10 LTE Cat-4+ device types by module shipments (World 2025)
  • Figure 6.12: Top 10 LTE Cat-1 device types by module shipments (World 2025)
  • Figure 6.13: Top 10 LTE Cat-1 bis device types by module shipments (World 2025)
  • Figure 6.14: Top 10 LTE-M device types by module shipments (World 2025)
  • Figure 6.15: Top 6 NB-IoT device types by module shipments (World 2025)
  • Figure 6.16: Top 6 5G eMBB device types by module shipments (World 2025)
  • Figure 6.17: Cellular IoT module shipments by region and vertical (World 2024–2030)
  • Figure 6.18: Cellular IoT module shipment forecast (Europe 2024–2030)
  • Figure 6.19: Cellular IoT module shipment forecast (North America 2024–2030)
  • Figure 6.20: Cellular IoT module shipment forecast (Latin America 2024–2030)
  • Figure 6.21: Cellular IoT module shipment forecast (China 2024–2030)
  • Figure 6.22: Cellular IoT module shipment forecast (Rest of Asia-Pacific 2024–2030)
  • Figure 6.23: Cellular IoT module shipment forecast (Middle East & Africa 2024–2030)
  • Figure 6.24: LoRa device shipments forecast (World 2024–2030)
  • Figure 6.25: Sigfox device shipments forecast (World 2024–2030)
  • Figure 6.26: 802.15.4 WAN device shipments forecast (World 2024–2030)