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蜂巢式/LPWA IoT設備的生態系統 - 第9版
市場調查報告書
商品編碼
1747990

蜂巢式/LPWA IoT設備的生態系統 - 第9版

Cellular and LPWA IoT Device Ecosystems - 9th Edition
出版日期: | 出版商: Berg Insight | 英文 130 Pages | 商品交期: 最快1-2個工作天內

價格

全球對物聯網廣域網路技術的需求正處於成長階段。到 2024 年底，將有約 43 億台裝置連接到基於蜂巢或 LPWA 技術的廣域網路。預計蜂巢/非 3GPP LPWA 物聯網模組的年出貨量將從 2024 年的 6.03 億台成長到 2029 年的 10.4 億台，複合年增長率為 11.6%。

本報告概述了物聯網設備市場，包括 NB-IoT、LTE-M、LoRa 和 Sigfox 等 LPWA 技術的採用趨勢、主要物聯網晶片組/模組供應商的概況，並提供了到 2029 年的市場預測。

目錄

圖表清單

摘要整理

第1章 IoT廣域網

  • 怎樣的東西被廣域網連接
    • 公共事業儀表
    • 汽車
    • 建築物
    • 資產追蹤、供應鏈可視性
    • 打造更智慧、更安全城市的機遇
    • 物聯網與人工智慧的融合
  • 技術選擇
    • 網路部署模式
    • 授權和非授權頻段
    • 蜂窩技術與低功耗廣域網路 (LPWA) 技術的成本比較
  • 主要的技術生態係有哪些？

第2章 3GPP生態系統

  • 技術特性
    • 3GPP Release 13 - LTE-M 和 NB-IoT 部署
    • 3GPP Release 14 - 物聯網增強功能與 C-V2X
    • 3GPP Release 15 - 5G 規範第一階段
    • 3GPP Release 16 - URLLC 增強功能、IIoT 功能、5G NR C-V2X
    • 3GPP Release 17 - RedCap 與非地面網路通信
    • 3GPP Release 18 - 首個 5G-Advanced 規範和 eRedCap
    • 網路足跡
    • 2G/3G行動網路
    • 4G行動網路
    • 4G/5G行動IoT網路(LTE-M，NB-IoT)
    • 5G行動網路
  • 半導體供應商
    • ASR Microelectronics
    • Eigencomm
    • MediaTek
    • MLINK
    • Qualcomm
    • Samsung Electronics
    • Sequans Communications
    • Sony
    • UNISOC
    • Xinyi Information Technology
    • 其他的半導體供應商
  • 模組供應商
    • Cavli Wireless
    • China Mobile IoT
    • Fibocom
    • Kontron
    • MeiG Smart Technology
    • Murata
    • Neoway
    • Nordic Semiconductor
    • Quectel
    • Rolling Wireless
    • Semtech
    • Sunsea AIoT (SIMCom & Longsung)
    • Telit Cinterion
    • Trasna
    • 其他的蜂巢式IoT模組供應商

第3章 LoRa/LoRaWAN生態系統

  • 技術特性
  • 網路足跡
    • 歐洲
    • 亞太地區
    • 南北美洲
    • 中東·非洲
  • 半導體/模組供應商
    • Semtech
    • 其他的半導體供應商
    • LoRa模組供應商

第4章 Sigfox生態系統

  • 技術特性
  • 網路足跡
    • 歐洲
    • 南北美洲
    • 亞太地區
    • 中東·非洲
    • UnaBiz與LoRaWAN生態系統協作
    • Sigfox的主要的使用案例
  • 半導體/模組供應商
    • 半導體供應商
    • Sigfox模組供應商

第5章 新LPWA生態系統

  • IEEE 802.15.4
    • 802.15.4為基礎連接性堆疊
    • 網路足跡
  • Wirepas Mesh
  • DECT-2020 NR(NR+)
  • Mioty
  • 晶片組/模組供應商

第6章 市場預測和趨勢

  • 市場摘要
  • 蜂巢式IoT設備市場
    • 歐洲
    • 北美
    • 南美
    • 中國
    • 其他的亞太地區
    • 中東·非洲
  • LoRa設備市場
  • Sigfox設備市場
  • 新的LPWA技術
  • 縮寫和簡稱清單

Global demand for IoT wide area networking technology is in a growth phase. By the end of 2024, about 4.3 billion devices were connected to wide area networks based on cellular or LPWA technologies. The market is highly diverse and divided into multiple ecosystems. Berg Insight forecasts that annual shipments of cellular and non-3GPP LPWA IoT modules will grow at a compound annual growth rate (CAGR) of 11.6 percent from 603 million units in 2024 to 1.04 billion units in 2029. Get up to date with the latest trends from all main regions and vertical markets with this unique 130-page report.

Highlights from the report:

  • 360-degree overview of the main IoT wide area networking ecosystems.
  • Comparison of technologies and standards.
  • Updated profiles of the main suppliers of IoT chipsets and modules.
  • Cellular IoT module market data for 2024.
  • Adoption trends for LPWA technologies including NB-IoT, LTE-M, LoRa and Sigfox.
  • Cellular and non-3GPP LPWA IoT device market forecasts until 2029.

Table of Contents

Table of Contents

List of Figures

Executive Summary

1. Wide Area Networks for the Internet of Things

  • 1.1. Which things will be connected to wide area networks?
    • 1.1.1. Utility meters
    • 1.1.2. Motor vehicles
    • 1.1.3. Buildings
    • 1.1.4. Asset tracking and supply chain visibility
    • 1.1.5. The opportunity to create smarter and safer cities
    • 1.1.6. The convergence of IoT and AI
  • 1.2. What are the technology options?
    • 1.2.1. Network deployment models
    • 1.2.2. Licensed and unlicensed frequency bands
    • 1.2.3. Cost comparison for cellular and LPWA technologies
  • 1.3. Which are the leading technology ecosystems?

2. 3GPP Ecosystem

  • 2.1. Technology characteristics
    • 2.1.1. 3GPP Release 13-Introducing LTE-M and NB-IoT
    • 2.1.2. 3GPP Release 14-IoT enhancements and C-V2X
    • 2.1.3. 3GPP Release 15-The first phase of 5G specifications
    • 2.1.4. 3GPP Release 16-URLLC enhancements, IIoT features and 5G NR C-V2X
    • 2.1.5. 3GPP Release 17-RedCap and non-terrestrial network communications
    • 2.1.6. 3GPP Release 18-The first 5G-Advanced specifications and eRedCap
    • 2.1.7. Network footprint
    • 2.1.8. 2G/3G mobile networks
    • 2.1.9. 4G mobile networks
    • 2.1.10. 4G/5G mobile IoT networks (LTE-M and NB-IoT)
    • 2.1.11. 5G mobile networks
  • 2.2. Semiconductor vendors
    • 2.2.1. ASR Microelectronics
    • 2.2.2. Eigencomm
    • 2.2.3. MediaTek
    • 2.2.4. MLINK
    • 2.2.5. Qualcomm
    • 2.2.6. Samsung Electronics
    • 2.2.7. Sequans Communications
    • 2.2.8. Sony
    • 2.2.9. UNISOC
    • 2.2.10. Xinyi Information Technology
    • 2.2.11. Other semiconductor vendors
  • 2.3. Module vendors
    • 2.3.1. Cavli Wireless
    • 2.3.2. China Mobile IoT
    • 2.3.3. Fibocom
    • 2.3.4. Kontron
    • 2.3.5. MeiG Smart Technology
    • 2.3.6. Murata
    • 2.3.7. Neoway
    • 2.3.8. Nordic Semiconductor
    • 2.3.9. Quectel
    • 2.3.10. Rolling Wireless
    • 2.3.11. Semtech
    • 2.3.12. Sunsea AIoT (SIMCom & Longsung)
    • 2.3.13. Telit Cinterion
    • 2.3.14. Trasna
    • 2.3.15. Other cellular IoT module vendors

3. LoRa and LoRaWAN Ecosystem

  • 3.1. Technology characteristics
  • 3.2. Network footprint
    • 3.2.1. Europe
    • 3.2.2. Asia-Pacific
    • 3.2.3. The Americas
    • 3.2.4. Middle East & Africa
  • 3.3. Semiconductor and module vendors
    • 3.3.1. Semtech
    • 3.3.2. Other semiconductor vendors
    • 3.3.3. LoRa module vendors

4. Sigfox Ecosystem

  • 4.1. Technology characteristics
  • 4.2. Network footprint
    • 4.2.1. Europe
    • 4.2.2. The Americas
    • 4.2.3. Asia-Pacific
    • 4.2.4. Middle East & Africa
    • 4.2.5. UnaBiz partners with the LoRaWAN ecosystem
    • 4.2.6. Examples of major Sigfox use cases
  • 4.3. Semiconductor and module vendors
    • 4.3.1. Semiconductor vendors
    • 4.3.2. Sigfox module vendors

5. Emerging LPWA Ecosystems

  • 5.1. IEEE 802.15.4
    • 5.1.1. Connectivity stacks based on 802.15.4
    • 5.1.2. Network footprint
  • 5.2. Wirepas Mesh
  • 5.3. DECT-2020 NR (NR+)
  • 5.4. Mioty
  • 5.5. Chipset and module vendors

6. Market Forecasts and Trends

  • 6.1. Market summary
  • 6.2. The cellular IoT device market
    • 6.2.1. Europe
    • 6.2.2. North America
    • 6.2.3. Latin America
    • 6.2.4. China
    • 6.2.5. Rest of Asia-Pacific
    • 6.2.6. Middle East & Africa
  • 6.3. The LoRa device market
  • 6.4. The Sigfox device market
  • 6.5. Emerging LPWA technologies
  • List of Acronyms and Abbreviations

List of Figures

  • Figure 1.1: Top wide area IoT target segments (2024)
  • Figure 1.2: Building stock by category (EU27+3/US 2024)
  • Figure 1.3: Unlicensed and reserved radio frequencies available for wireless IoT
  • Figure 1.4: Cost comparison for wireless modules (2025)
  • Figure 2.1: Comparison of LTE Cat-1, LTE Cat-1 bis, LTE-M and NB-IoT specifications
  • Figure 2.2: Comparison of RedCap and eRedCap specifications
  • Figure 2.3: Technology positioning of RedCap in relation to eMBB, URLLC and mMTC
  • Figure 2.4: IoT solution design options
  • Figure 2.5: Cost comparison between module and chipset designs
  • Figure 2.6: Routes to market for cellular IoT chipsets
  • Figure 2.7: Cellular IoT chipset vendor volume market shares (World 2024)
  • Figure 2.8: Business activities of key cellular chipset providers (Q2-2025)
  • Figure 2.9: ASR Microelectronics' cellular IoT chipsets (Q2-2025)
  • Figure 2.10: Eigencomm's cellular IoT chipsets (Q2-2025)
  • Figure 2.11: MediaTek's cellular IoT chipsets (Q2-2025)
  • Figure 2.12: MLINK's IoT chipsets (Q2-2025)
  • Figure 2.13: Qualcomm's IoT modem chipsets (Q2-2025)
  • Figure 2.14: QCT revenues by segment (2022-2024)
  • Figure 2.15: Samsung's automotive chip solutions
  • Figure 2.16: Sequans' revenues by product segment (2020-2024)
  • Figure 2.17: UNISOC's cellular IoT chipsets (Q2-2025)
  • Figure 2.18: Xinyi's cellular IoT chipsets (Q2-2025)
  • Figure 2.19: Business activities of other cellular chipset providers (Q2-2025)
  • Figure 2.20: Top cellular IoT module vendors, by revenues and shipments (World 2024)
  • Figure 2.21: Fibocom's embedded wireless IoT modules (Q2-2025)
  • Figure 2.22: Fibocom's AI-powered robot solution
  • Figure 2.23: MeiG's embedded cellular IoT modules (Q2-2025)
  • Figure 2.24: Neoway's revenue by segment (2021-2024)
  • Figure 2.25: Neoway's embedded cellular IoT modules (Q2-2025)
  • Figure 2.26: Nordic Semiconductor's revenues by segment (2020-2024)
  • Figure 2.27: Feature comparison of the nRF91 Series SiPs
  • Figure 2.28: Quectel's cellular IoT module series (Q2-2025)
  • Figure 2.29: Semtech's embedded cellular module series (Q2-2025)
  • Figure 2.30: Semtech's embedded cellular modules (Q2-2025)
  • Figure 2.31: Sunsea AIoT's revenue by segment (2021-2024)
  • Figure 2.32: Embedded cellular IoT modules from SIMCom and Longsung (Q2-2025)
  • Figure 2.33: Overview of the SIMCom AI stack
  • Figure 2.34: Telit Cinterion's embedded cellular IoT modules (Q2-2025)
  • Figure 2.35: Trasna's embedded cellular IoT modules (Q2-2025)
  • Figure 3.1: LoRaWAN network architecture
  • Figure 3.2: Public LoRaWAN network operators in Europe (Q1-2025)
  • Figure 3.3: Public LoRaWAN network operators in Asia-Pacific (Q1-2025)
  • Figure 3.4: Public LoRaWAN network operators in the Americas (Q1-2025)
  • Figure 3.5: Amazon Sidewalk network coverage (Q2-2025)
  • Figure 3.6: Public LoRaWAN network operators in Middle East & Africa (Q1-2025)
  • Figure 3.7: Semtech's LoRa business KPIs (FY-2022-FY-2025)
  • Figure 3.8: LoRa module vendors (Q2-2025)
  • Figure 4.1: Sigfox network architecture
  • Figure 4.2: Sigfox network partners in Europe (Q1-2025)
  • Figure 4.3: Sigfox networks in the Americas (Q1-2025)
  • Figure 4.4: Sigfox networks in Asia-Pacific and MEA (Q1-2025)
  • Figure 4.5: List of Sigfox module vendors by supported regions (Q1-2025)
  • Figure 5.1: Major 802.15.4 networking platforms for smart metering (Q1-2025)
  • Figure 5.2: Technology positioning for NR+ in relation to eMBB, URLLC and mMTC
  • Figure 5.3: The Mioty telegram splitting technology
  • Figure 5.4: Members of the Mioty Alliance (Q1-2025)
  • Figure 6.1: Cellular/non-3GPP LPWA IoT device shipments by region (World 2023-2029)
  • Figure 6.2: Cellular/non-3GPP LPWA IoT device shipments by technology (World 2024)
  • Figure 6.3: Cellular IoT module shipments by region and vertical (World 2023-2029)
  • Figure 6.4: Cellular IoT module shipment forecast by technology (World 2023-2029)
  • Figure 6.5: Cellular IoT module shipment forecast (Europe 2023-2029)
  • Figure 6.6: Cellular IoT module shipment forecast (North America 2023-2029)
  • Figure 6.7: Cellular IoT module shipment forecast (Latin America 2023-2029)
  • Figure 6.8: Cellular IoT module shipment forecast (China 2023-2029)
  • Figure 6.9: Cellular IoT module shipment forecast (Rest of Asia-Pacific 2023-2029)
  • Figure 6.10: Cellular IoT module shipment forecast (Middle East & Africa 2023-2029)
  • Figure 6.11: LoRa device shipments forecast (World 2023-2029)
  • Figure 6.12: Sigfox device shipments forecast (World 2023-2029)
  • Figure 6.13: 802.15.4 WAN device shipments forecast (World 2023-2029)