全球軟性印刷電路板(PCB)市場
市場調查報告書
商品編碼
1963163

全球軟性印刷電路板(PCB)市場

Global Flexible PCB Market

出版日期: | 出版商: BCC Research | 英文 137 Pages | 訂單完成後即時交付

價格

全球軟性印刷電路板(PCB)市場預計將從2025年的233億美元成長到2030年的417億美元。

預計 2025 年至 2030 年的複合年成長率將達到 12.3%。

預計亞太市場在 2025 年的價值為 195 億美元,到 2030 年將達到 357 億美元,2025 年至 2030 年的複合年成長率為 12.9%。

預計到 2025 年,北美市場價值將達到 17 億美元,到 2030 年將達到 29 億美元,2025 年至 2030 年的複合年成長率為 10.9%。

本報告調查了全球軟性印刷電路板(PCB)市場,並提供了市場概況、市場影響因素和市場機會分析、技術和專利趨勢、法律制度、市場規模趨勢和預測、按各個細分市場和地區進行的詳細分析以及主要企業的概況。

目錄

第1章執行摘要

  • 市場展望
  • 調查範圍
  • 市場概況
  • 市場動態與成長要素
  • 新興技術
  • 細分市場分析
  • 區域分析
  • 結論

第2章 市場概覽

  • 當前市場概況
  • 未來展望
  • 宏觀經濟因素分析
  • 國內生產總值(GDP)成長率
  • 通貨膨脹
  • 利率
  • 地緣政治風險
  • 政府獎勵
  • 貿易政策
  • 中美貿易戰的影響
  • 供應鏈中斷
  • 價值鏈分析
  • 組件開發
  • 製造和組裝
  • 配送/物流
  • 部署和運行
  • 持續支援和效能最佳化
  • 波特五力分析

第3章 市場動態

  • 重點總結
  • 市場促進因素
  • 小型輕量電子設備的普及率不斷提高
  • 電動車和電池系統的擴展
  • 5G和高速通訊網路的成長
  • 市場限制/挑戰
  • 生產和材料成本高昂
  • 供應鏈中斷和原料短缺
  • 市場機遇
  • 對小型醫療用電子設備的需求不斷成長
  • 航太和國防領域對軟性及剛柔結合印刷電路板的應用日益增多

第4章:監理現狀

  • 概述
  • 軟性印刷電路板的監管環境

第5章 新興技術與專利分析

  • 概述
  • 新興技術
  • 折疊式伸縮式電子平台
  • 晶片整合和軟式電路板上的先進封裝
  • 用於超輕軟性電路的印刷電子和增材電子技術
  • 專利分析
  • 區域模式
  • 主要發現

第6章 市場區隔分析

  • 細分市場分析
  • 市場區隔:按類型
  • 重點總結
  • 多層FPCB
  • 雙層FPCB
  • 單層軟性印刷電路板
  • 剛撓性PCB
  • 其他
  • 市場區隔:依厚度分類
  • 重點總結
  • 小於 0.15 毫米
  • 16~30mm
  • 超過 30 毫米
  • 市場區隔:使用市場
  • 重點總結
  • 移動的
  • CE產品
  • 汽車電子
  • 工業電子
  • 航太/國防
  • 醫療設備
  • 其他
  • 地理細分
  • 市場區隔:依地區分類
  • 重點總結
  • 北美洲
  • 歐洲
  • 亞太地區
  • 拉丁美洲
  • 中東和非洲

第7章 競爭情勢

  • 重點總結
  • 市場生態系分析
  • 主要企業分析
  • Zhen Ding Technology Group
  • Suzhou Dongshan Precision Manufacturing Co. Ltd.
  • Mektron Corp.
  • Nitto Denko Corp.
  • BH Co. Ltd.
  • 戰略分析
    • 最新進展

第8章:環境、社會與管治(ESG)展望

  • 重點總結
  • 軟性PCB市場ESG績效分析
  • 環境影響
  • 對社會的影響
  • 管治影響
  • 軟性PCB市場ESG現狀
  • BCC 的結論

第9章附錄

  • 調查方法
  • 參考
  • 簡稱
  • 公司簡介
  • AT&S
  • BHFLEX CO. LTD.
  • CAREER TECHNOLOGY (MFG.) CO. LTD.
  • COMPEQ CO. LTD.
  • FLEX LTD.
  • FUJIKURA PRINTED CIRCUITS LTD.
  • INTERFLEX CO. LTD.
  • MEKTRON CORP.
  • NITTO DENKO CORP.
  • RAYMING TECHNOLOGY
  • SUMITOMO ELECTRIC INDUSTRIES LTD.
  • SUZHOU DONGSHAN PRECISION MANUFACTURING CO. LTD.
  • TTM TECHNOLOGIES INC.
  • UNIMICRON
  • VIASION TECHNOLOGY CO. LTD.
  • YOUNGPOONG ELECTRONICS CO. LTD.
  • ZHEN DING TECHNOLOGY HOLDING LTD.
Product Code: SMC141A

The global market for flexible printed circuit boards (PCBs) was valued at $23.3 billion in 2025 and is estimated to reach $41.7 billion by 2030, at a compound annual growth rate (CAGR) of 12.3% from 2025 through 2030.

The Asia-Pacific market for flexible PCB was valued at $19.5 billion in 2025 and is estimated to reach $35.7 billion by 2030, at a CAGR of 12.9% from 2025 through 2030.

The North American market for flexible PCB was valued at $1.7 billion in 2025 and is estimated to reach $2.9 billion by 2030, at a CAGR of 10.9% from 2025 through 2030.

Report Scope

The report analyzes the flexible printed circuit board (PCB) market across various segments, including type, thickness, and application, offering insights into key trends and growth in drivers. The study focuses on types of flexible PCBs (FPCBs), such as multi-layer FPCBs, double-layer FPCBs, single-layer FPCBs, rigid-flex PCBs, and others. It assesses the use of these types across different flexible-PCB thickness categories, including under 0.15 mm, 16 mm to 30 mm, and above 30 mm. Furthermore, the report evaluates market demand across key application segments, including mobile, consumer electronics, automotive electronics, industrial electronics, aerospace and defense, medical devices, and others.

The report provides a comprehensive regional analysis covering North America, Europe, Asia-Pacific, Latin America, and the Middle East and Africa (MEA). It evaluates the drivers, challenges, and emerging trends, while highlighting innovations in flexible PCB-based electronics and performance enhancement. The study concludes with an analysis of major companies in the market and their offerings. The base year for the study is 2024, with projections for 2025 through 2030, including compound annual growth rate (CAGR) for the forecast period.

Report Includes

  • 52 data tables and 47 additional tables
  • Overview and an analysis of the global markets for flexible printed circuit boards (FPCB) technology
  • Analyses of global market trends, with market revenue data for 2024, estimates for 2025, forecast for 2027, and projected CAGRs through 2030
  • Estimates of the size and revenue prospects for global flexible PCB market, along with a corresponding market share analysis by type, layer, application, end-use industry, and geographic region
  • Facts and figures about the global market dynamics, technological advancements, emerging applications, innovations, prospects, regulations, and the impact of macroeconomic factors
  • Insights derived from the Porter's Five Forces model, as well as global supply chain analyses
  • Analysis of patents, emerging trends and new developments in the electronics manufacturing industry
  • Analysis of the industry structure, including companies' market shares and rankings, strategic initiatives, M&A activity and a venture funding outlook
  • Overview of sustainability trends and ESG developments, with emphasis on consumer attitudes, and the ESG risk ratings scores and practices of leading companies
  • Company profiles of major players within the industry, including Zhen Ding Technology Holding Ltd., Suzhou Dongshan Precision Manufacturing Co. Ltd., Nitto Denko Corporation, and BHflex Co. Ltd.

Table of Contents

Chapter 1 Executive Summary

  • Market Outlook
  • Scope of Report
  • Market Summary
  • Market Dynamics and Growth Factors
  • Emerging Technologies
  • Segmental Analysis
  • Regional Analysis
  • Conclusion

Chapter 2 Market Overview

  • Current Market Overview
  • Future Outlook
  • Macroeconomic Factors Analysis
  • Gross Domestic Product (GDP) Growth
  • Inflation
  • Interest Rates
  • Geopolitical Risks
  • Government Incentives
  • Trade Policies
  • Impact of the U.S.-China Trade War
  • Supply Chain Disruptions
  • Value Chain Analysis
  • Component Development
  • Manufacturing and Assembly
  • Distribution and Logistics
  • Deployment and Operation
  • Ongoing Support and Performance Optimization
  • Porter's Five Forces Analysis
  • Bargaining Power of Suppliers
  • Bargaining Power of Buyers
  • Threat of New Entrants
  • Level of Competitiveness
  • Availability of Substitutes

Chapter 3 Market Dynamics

  • Key Takeaways
  • Market Drivers
  • Rising Adoption of Compact and Lightweight Electronics
  • Expansion of EVs and Battery Systems
  • Growth of 5G and High-Speed Communication Networks
  • Market Restraints/Challenges
  • High Production Costs and Material Expenses
  • Supply Chain Disruptions and Raw Material Shortages
  • Market Opportunities
  • Growing Demand for Compact Medical Electronics
  • Rising Adoption of Flex and Rigid-Flex PCBs in Aerospace and Defense

Chapter 4 Regulatory Landscape

  • Overview
  • Regulatory Scenario of Flexible PCBs

Chapter 5 Emerging Technologies and Patent Analysis

  • Overview
  • Emerging Technologies
  • Foldable and Stretchable Electronics Platforms
  • Chiplet Integration and Advanced Packaging on Flex Substrates
  • Printed and Additive Electronics for Ultra-Light Flexible Circuits
  • Patent Analysis
  • Regional Patterns
  • Key Findings

Chapter 6 Market Segmentation Analysis

  • Segmentation Breakdown
  • Market Breakdown by Type
  • Key Takeaways
  • Multi-Layer FPCB
  • Double-Layer FPCBs
  • Single-Layer FPCBs
  • Rigid-Flex PCBs
  • Others
  • Market Breakdown by Thickness
  • Key Takeaways
  • Under 0.15 mm
  • 16 mm to 30 mm
  • Above 30 mm
  • Market Breakdown by Application
  • Key Takeaways
  • Mobile
  • Consumer Electronics
  • Automotive Electronics
  • Industrial Electronics
  • Aerospace and Defense
  • Medical Devices
  • Other Applications
  • Geographic Breakdown
  • Market Breakdown by Region
  • Key Takeaways
  • North America
  • Europe
  • Asia-Pacific
  • Latin America
  • Middle East and Africa

Chapter 7 Competitive Landscape

  • Key Takeaways
  • Market Ecosystem Analysis
  • Raw Material Suppliers
  • Substrate Manufacturers
  • Flexible PCB Fabricators
  • Component Suppliers
  • Assembly and Integration Service Providers
  • Original Equipment Manufacturers (OEMs)
  • Distributors
  • Analysis of Key Companies
  • Zhen Ding Technology Group
  • Suzhou Dongshan Precision Manufacturing Co. Ltd.
  • Mektron Corp.
  • Nitto Denko Corp.
  • BH Co. Ltd.
  • Strategic Analysis
    • Recent Developments

Chapter 8 Environmental, Social, and Governance (ESG) Perspective

  • Key Takeaways
  • ESG Performance Analysis in the Flexible PCB Market
  • Environmental Impact
  • Social Impact
  • Governance Impact
  • Status of ESG in the Flexible PCB Market
  • Concluding Remarks from BCC

Chapter 9 Appendix

  • Research Methodology
  • References
  • Abbreviations
  • Company Profiles
  • AT&S
  • BHFLEX CO. LTD.
  • CAREER TECHNOLOGY (MFG.) CO. LTD.
  • COMPEQ CO. LTD.
  • FLEX LTD.
  • FUJIKURA PRINTED CIRCUITS LTD.
  • INTERFLEX CO. LTD.
  • MEKTRON CORP.
  • NITTO DENKO CORP.
  • RAYMING TECHNOLOGY
  • SUMITOMO ELECTRIC INDUSTRIES LTD.
  • SUZHOU DONGSHAN PRECISION MANUFACTURING CO. LTD.
  • TTM TECHNOLOGIES INC.
  • UNIMICRON
  • VIASION TECHNOLOGY CO. LTD.
  • YOUNGPOONG ELECTRONICS CO. LTD.
  • ZHEN DING TECHNOLOGY HOLDING LTD.

List of Tables

  • Summary Table : Global Market for Flexible PCB, by Region, Through 2030
  • Table 1 : Porter's Five Forces: Rating Scale
  • Table 2 : Regulatory Scenario of Flexible PCBs, by Country, 2025
  • Table 3 : Key Published Patents on Flexible PCB, January 2025-October 2025
  • Table 4 : Global Market for Flexible PCB, by Type, Through 2030
  • Table 5 : Global Market for Multi-Layer Flexible PCB, by Region, Through 2030
  • Table 6 : Global Market for Double-Layer Flexible PCB, by Region, Through 2030
  • Table 7 : Global Market for Single-layer Flexible PCB, by Region, Through 2030
  • Table 8 : Global Market for Rigid-Flexible PCB, by Region, Through 2030
  • Table 9 : Global Market for Other Types of Flexible PCB, by Region, Through 2030
  • Table 10 : Global Market for Flexible PCB, by Thickness, Through 2030
  • Table 11 : Global Market for Under 0.15 mm Flexible PCB, by Region, Through 2030
  • Table 12 : Global Market for 16 mm to 30 mm Flexible PCB, by Region, Through 2030
  • Table 13 : Global Market for Above 30 mm Flexible PCB, by Region, Through 2030
  • Table 14 : Global Market for Flexible PCB, by Application, Through 2030
  • Table 15 : Global Market for Flexible PCB in Mobile, by Region, Through 2030
  • Table 16 : Global Market for Flexible PCB in Consumer Electronics, by Region, Through 2030
  • Table 17 : Global Market for Flexible PCB in Automotive Electronics, by Region, Through 2030
  • Table 18 : Global Market for Flexible PCB in Industrial Electronics, by Region, Through 2030
  • Table 19 : Global Market for Flexible PCB in Aerospace and Defense, by Region, Through 2030
  • Table 20 : Global Market for Flexible PCB in Medical Devices, by Region, Through 2030
  • Table 21 : Global Market for Flexible PCB in Other Applications, by Region, Through 2030
  • Table 22 : Global Market for Flexible PCB, by Region, Through 2030
  • Table 23 : North American Market for Flexible PCB, by Country, Through 2030
  • Table 24 : North American Market for Flexible PCB, by Type, Through 2030
  • Table 25 : North American Market for Flexible PCB, by Thickness, Through 2030
  • Table 26 : North American Market for Flexible PCB, by Application, Through 2030
  • Table 27 : European Market for Flexible PCB, by Country, Through 2030
  • Table 28 : European Market for Flexible PCB, by Type, Through 2030
  • Table 29 : European Market for Flexible PCB, by Thickness, Through 2030
  • Table 30 : European Market for Flexible PCB, by Application, Through 2030
  • Table 31 : Asia-Pacific Market for Flexible PCB, by Country, Through 2030
  • Table 32 : Asia-Pacific Market for Flexible PCB, by Type, Through 2030
  • Table 33 : Asia-Pacific Market for Flexible PCB, by Thickness, Through 2030
  • Table 34 : Asia-Pacific Market for Flexible PCB, by Application, Through 2030
  • Table 35 : Latin American Market for Flexible PCB, by Country, Through 2030
  • Table 36 : Latin American Market for Flexible PCB, by Type, Through 2030
  • Table 37 : Latin American Market for Flexible PCB, by Thickness, Through 2030
  • Table 38 : Latin American Market for Flexible PCB, by Application, Through 2030
  • Table 39 : Middle East and African Market for Flexible PCB, by Country, Through 2030
  • Table 40 : Middle East and African Market for Flexible PCB, by Type, Through 2030
  • Table 41 : Middle East and African Market for Flexible PCB, by Thickness, Through 2030
  • Table 42 : Middle East and African Market for Flexible PCB, by Application, Through 2030
  • Table 43 : Ranking and Market Shares of Top 5 Providers in the Flexible PCB Market, 2024
  • Table 44 : Recent Developments in the Global Flexible PCB Market, 2024 and 2025
  • Table 45 : ESG Risk Ratings Metric, by Company, 2025
  • Table 46 : Abbreviations Used in the Flexible PCB Market Report
  • Table 47 : AT&S: Company Snapshot
  • Table 48 : AT&S: Financial Performance, FY 2023 and 2024
  • Table 49 : AT&S: Product Portfolio
  • Table 50 : AT&S: News/Key Developments, 2025
  • Table 51 : BHflex Co. Ltd.: Company Snapshot
  • Table 52 : BHflex Co. Ltd.: Financial Performance, FY 2023 and 2024
  • Table 53 : BHflex Co. Ltd.: Product Portfolio
  • Table 54 : BHflex Co. Ltd.: News/Key Developments, 2024
  • Table 55 : Career Technology (Mfg.) Co. Ltd.: Company Snapshot
  • Table 56 : Career Technology (Mfg.) Co. Ltd.: Financial Performance, FY 2023 and 2024
  • Table 57 : Compeq Co. Ltd.: Company Snapshot
  • Table 58 : Compeq Co. Ltd.: Financial Performance, FY 2023 and 2024
  • Table 59 : Compeq Co. Ltd.: Product Portfolio
  • Table 60 : Compeq Co. Ltd: News/Key Developments, 2024
  • Table 61 : Flex Ltd.: Company Snapshot
  • Table 62 : Flex Ltd.: Financial Performance, FY 2023 and 2024
  • Table 63 : Flex Ltd.: Product Portfolio
  • Table 64 : Flex Ltd.: News/Key Developments, 2024
  • Table 65 : Fujikura Printed Circuits Ltd.: Company Snapshot
  • Table 66 : Fujikura Printed Circuits Ltd.: Product Portfolio
  • Table 67 : Interflex Co. Ltd.: Company Snapshot
  • Table 68 : Interflex Co. Ltd.: Financial Performance, FY 2023 and 2024
  • Table 69 : Interflex Co. Ltd.: Product Portfolio
  • Table 70 : Mektron Corp.: Company Snapshot
  • Table 71 : Mektron Corp.: Product Portfolio
  • Table 72 : Mektron Corp.: News/Key Developments, 2024
  • Table 73 : Nitto Denko Corp.: Company Snapshot
  • Table 74 : Nitto Denko Corp.: Financial Performance, FY 2023 and 2024
  • Table 75 : Nitto Denko Corp.: Product Portfolio
  • Table 76 : RayMing Technology: Company Snapshot
  • Table 77 : RayMing Technology: Product Portfolio
  • Table 78 : Sumitomo Electric Industries Ltd.: Company Snapshot
  • Table 79 : Sumitomo Electric Industries Ltd.: Financial Performance, FY 2023 and 2024
  • Table 80 : Sumitomo Electric Industries Ltd.: Product Portfolio
  • Table 81 : Sumitomo Electric Industries Ltd: News/Key Developments, 2024
  • Table 82 : Suzhou Dongshan Precision Manufacturing Co. Ltd.: Company Snapshot
  • Table 83 : Suzhou Dongshan Precision Manufacturing Co. Ltd.: Financial Performance,FY 2023 and 2024
  • Table 84 : TTM Technologies Inc.: Company Snapshot
  • Table 85 : TTM Technologies Inc.: Financial Performance, FY 2023 and 2024
  • Table 86 : TTM Technologies Inc.: Product Portfolio
  • Table 87 : TTM Technologies Inc.: News/Key Developments, 2024
  • Table 88 : Unimicron: Company Snapshot
  • Table 89 : Unimicron: Financial Performance, FY 2023 and 2024
  • Table 90 : Unimicron: Product Portfolio
  • Table 91 : Viasion Technology Co. Ltd.: Company Snapshot
  • Table 92 : Viasion Technology Co. Ltd.: Product Portfolio
  • Table 93 : Youngpoong Electronics Co. Ltd.: Company Snapshot
  • Table 94 : Youngpoong Electronics Co. Ltd.: Product Portfolio
  • Table 95 : Zhen Ding Technology Holding Ltd.: Company Snapshot
  • Table 96 : Zhen Ding Technology Holding Ltd.: Financial Performance, FY 2023 and 2024
  • Table 97 : Zhen Ding Technology Holding Ltd.: Product Portfolio
  • Table 98 : Zhen Ding Technology Holding Ltd.: News/Key Developments, 2024

List of Figures

  • Summary Figure : Global Market Share for Flexible PCB, by Region, 2024
  • Figure 1 : Flexible PCB Market: Value Chain Analysis
  • Figure 2 : Porter's Five Forces Analysis: Global Flexible PCB Market
  • Figure 3 : Market Dynamics of Flexible PCBs
  • Figure 4 : Emerging Technologies in Flexible PCB
  • Figure 5 : Published Patents Share for Flexible PCB, by Country/Organization, January 2025-October 2025
  • Figure 6 : Global Market Share for Flexible PCB, by Type, 2024
  • Figure 7 : Global Market Share for Multi-Layer Flexible PCB, by Region, 2024
  • Figure 8 : Global Market Share for Double-Layer Flexible PCB, by Region, 2024
  • Figure 9 : Global Market Share for Single-layer Flexible PCB, by Region, 2024
  • Figure 10 : Global Market Share for Rigid-Flexible PCB, by Region, 2024
  • Figure 11 : Global Market Share for Other Types of Flexible PCB, by Region, 2024
  • Figure 12 : Global Market Share for Flexible PCB, by Thickness, 2024
  • Figure 13 : Global Market Share for Under 0.15 mm Flexible PCB, by Region, 2024
  • Figure 14 : Global Market Share for 16 mm to 30 mm Flexible PCB, by Region, 2024
  • Figure 15 : Global Market Share for Above 30 mm Flexible PCB, by Region, 2024
  • Figure 16 : Global Market Share for Flexible PCB, by Application, 2024
  • Figure 17 : Global Market Share for Flexible PCB in Mobile, by Region, 2024
  • Figure 18 : Global Market Share for Flexible PCB in Consumer Electronics, by Region, 2024
  • Figure 19 : Global Market Share for Flexible PCB in Automotive Electronics, by Region, 2024
  • Figure 20 : Global Market Share for Flexible PCB in Industrial Electronics, by Region, 2024
  • Figure 21 : Global Market Share for Flexible PCB in Aerospace and Defense, by Region, 2024
  • Figure 22 : Global Market Share for Flexible PCB in Medical Devices, by Region, 2024
  • Figure 23 : Global Market Share for Flexible PCB in Other Applications, by Region, 2024
  • Figure 24 : Global Market Share for Flexible PCB, by Region, 2024
  • Figure 25 : AT&S: Revenue Share, by Business Unit, FY 2024
  • Figure 26 : AT&S: Revenue Share, by Country/Region, FY 2024
  • Figure 27 : BHflex Co. Ltd: Revenue Share, by Country/Region, FY 2024
  • Figure 28 : BHflex Co. Ltd.: Revenue Share, by Country/Region, FY 2024
  • Figure 29 : Career Technology (Mfg.) Co. Ltd.: Revenue Share, by Country/Region, FY 2024
  • Figure 30 : Compeq Co. Ltd.: Revenue Share, by Business Unit, FY 2024
  • Figure 31 : Compeq Co. Ltd.: Revenue Share, by Country/Region, FY 2024
  • Figure 32 : Flex Ltd.: Revenue Share, by Business Unit, FY 2024
  • Figure 33 : Flex Ltd.: Revenue Share, by Country/Region, FY 2024
  • Figure 34 : Nitto Denko Corp.: Revenue Share, by Business Unit, FY 2024
  • Figure 35 : Nitto Denko Corp.: Revenue Share, by Country/Region, FY 2024
  • Figure 36 : Sumitomo Electric Industries Ltd.: Revenue Share, by Business Unit, FY 2024
  • Figure 37 : Suzhou Dongshan Precision Manufacturing Co. Ltd.: Revenue Share, by Business Unit, FY 2024
  • Figure 38 : TTM Technologies Inc.: Revenue Share, by Business Unit, FY 2024
  • Figure 39 : TTM Technologies Inc.: Revenue Share, by Country/Region, FY 2024
  • Figure 40 : Unimicron: Revenue Share, by Business Unit, FY 2024
  • Figure 41 : Unimicron: Revenue Share, by Country/Region, FY 2024
  • Figure 42 : Zhen Ding Technology Holding Ltd.: Revenue Share, by Country/Region, FY 2024