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1730694

汽車系統級封裝 (SiP) 市場，按封裝技術、封裝方法、最終用途、國家和地區 - 行業分析、市場規模、市場佔有率及 2024 年至 2032 年預測

Automotive System in Package (SiP) Market, By Packaging Technology, By Packaging Method, By End Use, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2024-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 284 Pages | 商品交期: 2-3個工作天內

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簡介目錄

報告重點

2023 年汽車系統級封裝 (SiP) 市場規模價值為 21.0342 億美元，2024 年至 2032 年的複合年成長率為 10.20%。

汽車系統級封裝 (SiP) 市場- 市場動態

電動車和 ADAS 需求的不斷成長以及連網汽車的興起預計將推動市場需求

由於技術創新、電動車的普及以及消費者期望的轉變，汽車系統封裝 (SiP) 市場正在經歷強勁成長。 SiP技術，將多個晶片和組件整合到單一封裝中。隨著全球向電動車 (EV) 的轉變，對電池管理、馬達控制和充電系統的緊湊、高效的電子系統的需求日益成長。汽車 SiP 有助於減少空間，同時確保高熱性能和電氣性能。例如，電池管理系統 (BMS) 從 SiP 中受益匪淺，因為它們需要即時監控多個電池單元的電壓、電流和溫度。 SiP 還提高了可靠性並降低了組裝複雜性，這對於空間和重量非常寶貴的電動車來說至關重要。

高級駕駛輔助系統（ADAS）是汽車電子領域成長最快的領域之一。自適應巡航控制、車道維持輔助、自動緊急煞車和 360 度攝影系統等功能需要強大且緊湊的電子控制單元 (ECU)。汽車 SiP 非常適合此類系統，因為它們可以在小體積內整合感測器、處理單元、記憶體和電源管理組件。這使得高速資料處理和最小訊號干擾成為可能，這對於 ADAS 中的即時決策至關重要。現代汽車的連網程度日益提高，提供無線 (OTA) 更新、即時交通資訊、車對車 (V2V) 通訊和豐富的資訊娛樂體驗等功能。這些功能需要整合無線通訊模組（Wi-Fi、藍牙、5G）、微控制器和多媒體處理器。消費者對沉浸式車載體驗和持續連接的需求不斷成長，這是 SiP 應用的強大驅動力。汽車 SiP 以經濟高效且緊湊的形式實現了這種整合，支援無縫資料通訊和多媒體處理，從而推動市場成長。

汽車系統級封裝 (SiP) 市場 - 關鍵洞察

根據我們的研究分析師的分析，預測期內（2024-2032 年）全球市場預計年複合成長率約為 10.20%

根據封裝技術細分，預計 2.5D IC 封裝領域將在 2023 年佔據最大市場佔有率，這得益於其封裝生產能力。

根據封裝方法細分，覆晶由於尺寸減小且功能更多，成為 2023 年領先的封裝方法。

根據最終用途細分，由於 ADAS 系統對半導體晶片和 IC 的需求增加，ADAS 領域成為 2023 年的主要最終用途。

從地區來看，由於高通、英特爾、Powertech 等頂級公司的存在，北美是 2023 年的主要收入來源。

汽車系統級封裝（SiP）市場-細分分析：

全球汽車系統封裝 (SiP) 市場根據封裝技術、封裝方法、最終用途和地區進行細分。

根據封裝技術，市場分為三類：2D IC 封裝、2.5D IC 封裝和 3D IC 封裝。 2.5D IC封裝領域佔據市場主導地位。高生產需求和便捷包裝預計將推動該領域的成長。

根據封裝方法，市場分為三類：引線鍵結、覆晶和扇出晶圓級封裝。覆晶領域佔據市場主導地位。預計扇出型晶圓級封裝在預測期內將以最快的速度擴張。緊湊型包裝（尤其是小型解決方案）的高需求正在補充細分市場的需求。

根據最終用途，市場分為三類：資訊娛樂和遠端資訊處理模組、ADAS 和其他。 ADAS 領域在市場中佔據主導地位，預計在預測期內仍將保持其較高的主導地位。預計電動車需求的不斷成長以及具有安全意識的 ADAS 系統的趨勢將促進市場成長。

汽車系統級封裝 (SiP) 市場- 地理洞察

在全球範圍內，汽車系統封裝 (SiP) 市場廣泛分佈於北美、拉丁美洲、歐洲、亞太地區以及中東和非洲地區。亞太地區是汽車 SiP 規模最大且成長最快的市場。中國引領全球電動車的生產和普及，全球超過 50% 的電動車在中國銷售。日本和韓國擁有瑞薩、東芝、三星、SK海力士等主要半導體巨頭，以及日月光集團等封裝領軍企業。根據美國汽車資料，美國佔全球ADAS部署的25-30％左右，嚴重依賴小型化SiP解決方案。此外，預計到 2030 年電動車 (EV) 將佔全球汽車銷量的 40% 左右，這將極大地推動對先進 SiP 的需求。

汽車系統級封裝 (SiP) 市場-競爭格局：

汽車 SiP 市場競爭激烈且發展迅速。半導體和汽車電子領域的主要參與者正在大力投資加強其產品組合，以創新 3D 封裝技術。例如，Amkor Technology Inc. 在葡萄牙和越南開設了專門用於汽車半導體封裝的新工廠，並與頂級OEM半導體供應商合作進行異構 SiP 開發。市場參與者正在開發整合 MEMS 感測器和控制器的 SiP 解決方案，用於輪胎壓力監測系統 (TPMS) 和 ADAS。該公司還專注於擴展 SiP 功能，專門針對具有更好散熱性的高可靠性汽車封裝。

最新動態：

2024 年，英飛凌科技推出了 AURIX SiP 微控制器，主要針對自動駕駛等安全關鍵型應用。

2024年，恩智浦半導體宣布大力投資S32汽車平台，結合SiP概念實現跨車輛領域的可擴展性，這是其關鍵策略的一部分。

目錄

第1章：汽車系統級封裝 (SiP) 市場概覽

  • 研究範圍
  • 市場估計年限

第2章：執行摘要

  • 市場片段
    • 汽車系統級封裝 (SiP) 市場片段（依封裝技術）
    • 汽車系統級封裝 (SiP) 市場片段（按封裝方法）
    • 汽車系統級封裝 (SiP) 市場片段（依最終用途）
    • 汽車系統級封裝 (SiP) 市場（按國家/地區分類）
    • 汽車系統級封裝 (SiP) 市場區域分佈
  • 競爭洞察

第3章：汽車系統級封裝 (SiP) 主要市場趨勢

  • 汽車系統級封裝 (SiP) 市場促進因素
    • 市場促進因素的影響分析
  • 汽車系統級封裝 (SiP) 市場限制
    • 市場限制的影響分析
  • 汽車系統級封裝 (SiP) 市場機遇
  • 汽車系統級封裝（SiP）市場未來趨勢

第4章：汽車系統級封裝 (SiP) 產業研究

  • PEST分析
  • 波特五力分析
  • 成長前景圖
  • 規範架構分析

第5章：汽車系統級封裝 (SiP) 市場：COVID-19 影響分析

  • COVID-19 之前的影響分析
  • 新冠疫情後影響分析
    • 表現最佳的市場區隔
    • 邊際成長細分市場
    • 最鬆散的細分市場
    • 邊際損失市場區隔

第6章：汽車系統級封裝 (SiP) 市場格局

  • 2024年汽車系統級封裝（SiP）市佔率分析
  • 按主要製造商分類的細分數據
    • 成熟玩家分析
    • 新興企業分析

第7章：汽車系統級封裝 (SiP) 市場 - 依封裝技術

  • 概述
    • 按封裝技術分類的細分市場佔有率分析
    • 2D積體電路封裝
    • 2.5D IC封裝
    • 3D IC封裝

第8章：汽車系統級封裝 (SiP) 市場 - 依封裝方法

  • 概述
    • 按包裝方式分類的細分市場佔有率分析
    • 引線鍵合
    • 覆晶
    • 扇出型晶圓級封裝

第9章：汽車系統級封裝 (SiP) 市場 - 依最終用途

  • 概述
    • 按最終用途分類的細分市場佔有率分析
    • 資訊娛樂和遠端資訊處理模組
    • 高級駕駛輔助系統
    • 其他

第 10 章：汽車系統級封裝 (SiP) 市場 - 按地區

  • 介紹
    • 按地區分類的細分市場佔有率分析
  • 北美洲
    • 概述
    • 北美汽車系統級封裝 (SiP) 主要製造商
    • 北美市場規模及預測（按國家/地區）
    • 北美市場規模及預測（依封裝技術）
    • 北美市場規模及預測（以包裝方式）
    • 北美市場規模和預測，按最終用途
    • 美國
    • 加拿大
  • 歐洲
    • 概述
    • 歐洲汽車系統級封裝 (SiP) 主要製造商
    • 歐洲市場規模及預測（按國家/地區）
    • 歐洲市場規模及預測（依包裝技術）
    • 歐洲市場規模及預測（以包裝方式）
    • 歐洲市場規模和預測，按最終用途
    • 德國
    • 義大利
    • 英國
    • 法國
    • 俄羅斯
    • 荷蘭
    • 瑞典
    • 波蘭
    • 歐洲其他地區
  • 亞太地區 (APAC)
    • 概述
    • 亞太地區汽車系統級封裝 (SiP) 主要製造商
    • 亞太市場規模及預測（按國家/地區）
    • 亞太市場規模及預測（依包裝技術）
    • 亞太市場規模及預測（以包裝方式）
    • 亞太市場規模及預測（依最終用途）
    • 印度
    • 中國
    • 日本
    • 韓國
    • 澳洲
    • 泰國
    • 印尼
    • 菲律賓
    • 亞太地區其他地區
  • 拉丁美洲
    • 概述
    • 拉丁美洲汽車系統級封裝 (SiP) 主要製造商
    • 拉丁美洲市場規模及預測（按國家/地區）
    • 拉丁美洲市場規模及預測（按包裝技術）
    • 拉丁美洲市場規模及預測（以包裝方式）
    • 拉丁美洲市場規模和預測（按最終用途）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥倫比亞
    • 拉丁美洲其他地區
  • 中東和非洲
    • 概述
    • 中東和非洲汽車系統封裝 (SiP) 主要製造商
    • 中東和非洲市場規模及預測（按國家/地區）
    • 中東和非洲市場規模及預測（按包裝技術）
    • 中東和非洲市場規模及預測（以包裝方式）
    • 中東和非洲市場規模和預測（按最終用途）
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 以色列
    • 土耳其
    • 阿爾及利亞
    • 埃及
    • MEA 其餘地區

第 11 章：主要供應商分析-汽車系統級封裝 (SiP) 產業

  • 競爭儀錶板
  • 公司簡介
    • NXP Semiconductors
    • Infineon Technologies
    • STMicroelectronics
    • Texas Instruments
    • Qualcomm Technologies, Inc.
    • Amkor Technology
    • ASE Group
    • Renesas Electronics Corporation
    • Samsung Electronics
    • TSMC (Taiwan Semiconductor Manufacturing Company)
    • Intel Corporation
    • ROHM Semiconductor
    • Murata Manufacturing Co., Ltd.
    • Skyworks Solutions, Inc.
    • Analog Devices, Inc.
    • Others

第 12 章：360 度分析師視角

第 13 章：附錄

  • 研究方法
  • 參考
  • 縮寫
  • 免責聲明
  • 聯絡我們
簡介目錄
Product Code: ANV5076

REPORT HIGHLIGHT

Automotive System in Package (SiP) Market size was valued at USD 2,103.42 Million in 2023, expanding at a CAGR of 10.20% from 2024 to 2032.

Automotive System-in-Package (SiP) is an advanced packaging method where multiple integrated circuits (ICs) and passive components like resistors, capacitors, and inductors are combined into a single compact package to perform a specific function, optimized for automotive applications.

Automotive System in Package (SiP) Market- Market Dynamics

Increasing demand for EVs & ADAS and the rising trend of connected cars are expected to propel market demand

The Automotive System in Package (SiP) market is witnessing robust growth due to a convergence of technological innovations, adoption EVs, and shifting consumer expectations. SiP technology, which integrates multiple chips and components into a single package. With the global shift toward electric vehicles (EVs), there is a growing need for compact and efficient electronic systems for battery management, motor control, and charging systems. Automotive SiPs help reduce space while ensuring high thermal and electrical performance. Battery Management Systems (BMS), for example, benefit greatly from SiPs because they require real-time monitoring of voltage, current, and temperature across multiple battery cells. SiPs also enhance reliability and reduce assembly complexity, which is crucial in EVs where space and weight are at a premium.

Advanced Driver Assistance System (ADAS) is one of the fastest-growing sectors in automotive electronics. Features such as adaptive cruise control, lane-keeping assistance, automatic emergency braking, and 360-degree camera systems require powerful yet compact electronic control units (ECUs). Automotive SiPs are ideal for such systems as they can integrate sensors, processing units, memory, and power management components in a small footprint. This enables high-speed data processing and minimal signal interference, which are critical for real-time decision-making in ADAS. Modern vehicles are increasingly connected, offering features like over-the-air (OTA) updates, real-time traffic information, vehicle-to-vehicle (V2V) communication, and rich infotainment experiences. These functions require integration of wireless communication modules (Wi-Fi, Bluetooth, 5G), microcontrollers, and multimedia processors. The growing consumer demand for immersive in-car experiences and continuous connectivity is a strong driver for SiP adoption. Automotive SiPs enable this integration in a cost-effective and compact form, supporting seamless data communication and multimedia processing, fueling market growth.

Automotive System in Package (SiP) Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 10.20% over the forecast period (2024-2032)

Based on Packaging Technology segmentation, 2.5D IC packaging segment was predicted to show maximum market share in the year 2023, owing to its production capacity in packaging.

Based on Packaging Method segmentation, flip chip segment was the leading Packaging Method in 2023, due to its reduced size and more functionalities.

Based on End Use segmentation, ADAS segment was the leading End Use in 2023, due to increased demand for semiconductor chips & ICs in ADAS system.

On the basis of the region, North America was the leading revenue generator in 2023, owing to the presence of top companies like Qualcomm, Intel, Powertech, etc.

Automotive System in Package (SiP) Market- Segmentation Analysis:

The Global Automotive System in Package (SiP) Market is segmented on the basis of Packaging Technology, Packaging Method, End Use, and Region.

The market is divided into three categories based on Packaging Technology: 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. The 2.5D IC packaging segment dominates the market. High production demand and easy packaging is expected to fuel segment growth.

The market is divided into three categories based on the Packaging Method: wire bond, flip chip, and fan-out wafer level packaging. The flip-chip segment dominates the market. The fan-out wafer-level packaging is expected to expand at the fastest rate over the forecast period. The high demand from compact packaging, especially small factor solutions, is supplementing segment demand.

The market is divided into three categories based on End Use: infotainment & telematics modules, ADAS, and others. The ADAS segment dominates the market and is expected to maintain its high dominance during the forecast period. Growing demand for EVs and trend of ADAS system with safety awareness is anticipated to foster market growth.

Automotive System in Package (SiP) Market- Geographical Insights

Worldwide, the Automotive System in Package (SiP) market is widespread in the regions of North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. Asia-Pacific is the largest and fastest-growing market for automotive SiPs. China leads global EV production and adoption with over 50% of the world's EVs being sold in China. Japan and South Korea house major semiconductor giants like Renesas, Toshiba, Samsung, SK Hynix, and packaging leaders like ASE Group. According to the U.S. automotive data, the U.S. accounts for around 25-30% of global ADAS deployments, heavily reliant on miniaturized SiP solutions. In addition, Electric vehicles (EVs) are expected to represent about 40% of global car sales by 2030, heavily pushing demand for advanced SiPs.

Automotive System in Package (SiP) Market- Competitive Landscape:

The Automotive SiP market is highly competitive and rapidly evolving. Major players in semiconductors and automotive electronics are investing heavily to strengthen their product portfolios, innovating 3D packaging technologies. For example, Amkor Technology Inc. Opened new factories dedicated to automotive semiconductor packaging in Portugal and Vietnam and partnering with top OEM semiconductor suppliers for heterogeneous SiP development. Market participants are developing SiP solutions integrating MEMS sensors and controllers for tire pressure monitoring systems (TPMS) and ADAS. Companies also focus on expansion of SiP capabilities specifically targeted at high-reliability automotive packages with better thermal dissipation.

Recent Developments:

In 2024, Infineon Technologies introduced AURIX SiP microcontrollers targeting safety-critical applications like autonomous driving.

In 2024, NXP Semiconductors announced heavy investment in S32 Automotive Platform combining SiP concepts for scalability across vehicle domains as a part of their key strategy.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET KEY PLAYERS

  • NXP Semiconductors
  • Infineon Technologies
  • STMicroelectronics
  • Texas Instruments
  • Qualcomm Technologies, Inc.
  • Amkor Technology
  • ASE Group
  • Renesas Electronics Corporation
  • Samsung Electronics
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • Intel Corporation
  • ROHM Semiconductor
  • Murata Manufacturing Co., Ltd.
  • Skyworks Solutions, Inc.
  • Analog Devices, Inc.
  • Others

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY PACKAGING TECHNOLOGY- MARKET ANALYSIS, 2019-2032

  • 2D IC packaging
  • 2.5D IC packaging
  • 3D IC packaging

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY PACKAGING METHOD- MARKET ANALYSIS, 2019-2032

  • Wire bond
  • Flip chip
  • Fan-out wafer level packaging

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY END USE- MARKET ANALYSIS, 2019-2032

  • Infotainment & Telematics Modules
  • ADAS
  • Others

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY REGION- MARKET ANALYSIS, 2019-2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • United Arab Emirates
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Automotive System in Package (SiP) Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Automotive System in Package (SiP) Market Snippet by Packaging Technology
    • 2.1.2. Automotive System in Package (SiP) Market Snippet by Packaging Method
    • 2.1.3. Automotive System in Package (SiP) Market Snippet by End Use
    • 2.1.4. Automotive System in Package (SiP) Market Snippet by Country
    • 2.1.5. Automotive System in Package (SiP) Market Snippet by Region
  • 2.2. Competitive Insights

3. Automotive System in Package (SiP) Key Market Trends

  • 3.1. Automotive System in Package (SiP) Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Automotive System in Package (SiP) Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Automotive System in Package (SiP) Market Opportunities
  • 3.4. Automotive System in Package (SiP) Market Future Trends

4. Automotive System in Package (SiP) Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Automotive System in Package (SiP) Market: COVID-19 Impact Analysis

  • 5.1. Pre-COVID-19 Impact Analysis
  • 5.2. Post-COVID-19 Impact Analysis
    • 5.2.1. Top Performing Segments
    • 5.2.2. Marginal Growth Segments
    • 5.2.3. Top Looser Segments
    • 5.2.4. Marginal Loss Segments

6. Automotive System in Package (SiP) Market Landscape

  • 6.1. Automotive System in Package (SiP) Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Automotive System in Package (SiP) Market - By Packaging Technology

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Packaging Technology, 2024 & 2032 (%)
    • 7.1.2. 2D IC packaging
    • 7.1.3. 2.5D IC packaging
    • 7.1.4. 3D IC packaging

8. Automotive System in Package (SiP) Market - By Packaging Method

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Packaging Method, 2024 & 2032 (%)
    • 8.1.2. Wire bond
    • 8.1.3. Flip chip
    • 8.1.4. Fan-out wafer level packaging

9. Automotive System in Package (SiP) Market - By End Use

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By End Use, 2024 & 2032 (%)
    • 9.1.2. Infotainment & Telematics Modules
    • 9.1.3. ADAS
    • 9.1.4. Others

10. Automotive System in Package (SiP) Market- By Geography

  • 10.1. Introduction
    • 10.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 10.2. North America
    • 10.2.1. Overview
    • 10.2.2. Automotive System in Package (SiP) Key Manufacturers in North America
    • 10.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.2.4. North America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.2.5. North America Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.2.6. North America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.2.7. U.S.
      • 10.2.7.1. Overview
      • 10.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.7.3. U.S. Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.2.7.4. U.S. Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.2.7.5. U.S. Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.2.8. Canada
      • 10.2.8.1. Overview
      • 10.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.8.3. Canada Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.2.8.4. Canada Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.2.8.5. Canada Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.3. Europe
    • 10.3.1. Overview
    • 10.3.2. Automotive System in Package (SiP) Key Manufacturers in Europe
    • 10.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.3.4. Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.3.5. Europe Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.3.6. Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.7. Germany
      • 10.3.7.1. Overview
      • 10.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.7.3. Germany Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.7.4. Germany Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.7.5. Germany Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.8. Italy
      • 10.3.8.1. Overview
      • 10.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.8.3. Italy Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.8.4. Italy Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.8.5. Italy Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.9. United Kingdom
      • 10.3.9.1. Overview
      • 10.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.9.3. United Kingdom Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.9.4. United Kingdom Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.9.5. United Kingdom Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.10. France
      • 10.3.10.1. Overview
      • 10.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.10.3. France Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.10.4. France Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.10.5. France Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.11. Russia
      • 10.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.11.2. Russia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.11.3. Russia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.11.4. Russia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.12. Netherlands
      • 10.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.12.2. Netherlands Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.12.3. Netherlands Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.12.4. Netherlands Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.13. Sweden
      • 10.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.13.2. Sweden Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.13.3. Sweden Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.13.4. Sweden Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.14. Poland
      • 10.3.14.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.14.2. Poland Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.14.3. Poland Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.14.4. Poland Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.15. Rest of Europe
      • 10.3.15.1. Overview
      • 10.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.15.3. Rest of the Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.15.4. Rest of the Europe Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.15.5. Rest of the Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.4. Asia Pacific (APAC)
    • 10.4.1. Overview
    • 10.4.2. Automotive System in Package (SiP) Key Manufacturers in Asia Pacific
    • 10.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.4.4. Asia Pacific Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.4.5. Asia Pacific Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.4.6. Asia Pacific Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.7. India
      • 10.4.7.1. Overview
      • 10.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.7.3. India Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.7.4. India Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.7.5. India Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.8. China
      • 10.4.8.1. Overview
      • 10.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.8.3. China Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.8.4. China Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.8.5. China Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.9. Japan
      • 10.4.9.1. Overview
      • 10.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.9.3. Japan Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.9.4. Japan Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.9.5. Japan Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.10. South Korea
      • 10.4.10.1. Overview
      • 10.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.10.3. South Korea Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.10.4. South Korea Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.10.5. South Korea Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.11. Australia
      • 10.4.11.1. Overview
      • 10.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.11.3. Australia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.11.4. Australia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.11.5. Australia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.12. Thailand
      • 10.4.12.1. Overview
      • 10.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.12.3. Thailand Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.12.4. Thailand Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.12.5. Thailand Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.13. Indonesia
      • 10.4.13.1. Overview
      • 10.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.13.3. Indonesia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.13.4. Indonesia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.13.5. Indonesia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.14. Philippines
      • 10.4.14.1. Overview
      • 10.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.14.3. Philippines Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.14.4. Philippines Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.14.5. Philippines Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.15. Rest of APAC
      • 10.4.15.1. Overview
      • 10.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.15.3. Rest of APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.15.4. Rest of APAC Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.15.5. Rest of APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.5. Latin America
    • 10.5.1. Overview
    • 10.5.2. Automotive System in Package (SiP) Key Manufacturers in Latin America
    • 10.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.5.4. Latin America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.5.5. Latin America Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.5.6. Latin America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.7. Brazil
      • 10.5.7.1. Overview
      • 10.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.7.3. Brazil Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.7.4. Brazil Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.7.5. Brazil Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.8. Mexico
      • 10.5.8.1. Overview
      • 10.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.8.3. Mexico Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.8.4. Mexico Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.8.5. Mexico Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.9. Argentina
      • 10.5.9.1. Overview
      • 10.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.9.3. Argentina Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.9.4. Argentina Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.9.5. Argentina Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.10. Colombia
      • 10.5.10.1. Overview
      • 10.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.10.3. Colombia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.10.4. Colombia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.10.5. Colombia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.11. Rest of LATAM
      • 10.5.11.1. Overview
      • 10.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.11.3. Rest of LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.11.4. Rest of LATAM Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.11.5. Rest of LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.6. Middle East and Africa
    • 10.6.1. Overview
    • 10.6.2. Automotive System in Package (SiP) Key Manufacturers in Middle East and Africa
    • 10.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.6.4. Middle East and Africa Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.6.5. Middle East and Africa Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.6.6. Middle East and Africa Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.7. Saudi Arabia
      • 10.6.7.1. Overview
      • 10.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.7.3. Saudi Arabia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.7.4. Saudi Arabia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.7.5. Saudi Arabia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.8. United Arab Emirates
      • 10.6.8.1. Overview
      • 10.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.8.3. United Arab Emirates Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.8.4. United Arab Emirates Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.8.5. United Arab Emirates Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.9. Israel
      • 10.6.9.1. Overview
      • 10.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.9.3. Israel Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.9.4. Israel Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.9.5. Israel Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.10. Turkey
      • 10.6.10.1. Overview
      • 10.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.10.3. Turkey Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.10.4. Turkey Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.10.5. Turkey Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.11. Algeria
      • 10.6.11.1. Overview
      • 10.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.11.3. Algeria Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.11.4. Algeria Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.11.5. Algeria Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.12. Egypt
      • 10.6.12.1. Overview
      • 10.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.12.3. Egypt Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.12.4. Egypt Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.12.5. Egypt Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.13. Rest of MEA
      • 10.6.13.1. Overview
      • 10.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.13.3. Rest of MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.13.4. Rest of MEA Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.13.5. Rest of MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)

11. Key Vendor Analysis- Automotive System in Package (SiP) Industry

  • 11.1. Competitive Dashboard
  • 11.2. Company Profiles
    • 11.2.1. NXP Semiconductors
    • 11.2.2. Infineon Technologies
    • 11.2.3. STMicroelectronics
    • 11.2.4. Texas Instruments
    • 11.2.5. Qualcomm Technologies, Inc.
    • 11.2.6. Amkor Technology
    • 11.2.7. ASE Group
    • 11.2.8. Renesas Electronics Corporation
    • 11.2.9. Samsung Electronics
    • 11.2.10. TSMC (Taiwan Semiconductor Manufacturing Company)
    • 11.2.11. Intel Corporation
    • 11.2.12. ROHM Semiconductor
    • 11.2.13. Murata Manufacturing Co., Ltd.
    • 11.2.14. Skyworks Solutions, Inc.
    • 11.2.15. Analog Devices, Inc.
    • 11.2.16. Others

12. 360 Degree Analyst View

13. Appendix

  • 13.1. Research Methodology
  • 13.2. References
  • 13.3. Abbreviations
  • 13.4. Disclaimer
  • 13.5. Contact Us