消費性/物聯網 eSIM 市場數據概覽：2025 年第三季度

本報告深入分析了 eSIM 市場，包括對消費性設備和物聯網應用中的設備和 IC 的預測、eSIM 在消費性/物聯網應用中的普及率以及支援 RSP 的 eSIM 出貨量。

關鍵問題解答

• 2024 年至 2030 年消費性/物聯網市場 eSIM 總市場規模
• 消費市場區域區隔，考慮中國市場的普及率和消費性智慧型手機的發布情況，以及未來五年市場變化趨勢
• IC 外型尺寸模式（獨立式與三合一 eUICC、iUICC 滲透率）將如何演變？
• 目前設定檔下載量是多少？未來五年將如何成長？
• 消費者活化率將如何改變？物聯網活化量在 GSMA 和 SGP 標準之間將如何分配？
• 主要 IC 供應商及其市場佔有率

本產品建議與 "消費者與物聯網市場的 eSIM" （MD-ESM-114）配合閱讀。

目錄

主要發現

最新資訊

研究方法

主要預測

按應用程式和裝置類型劃分的 eSIM 裝置出貨量

OEM 廠商在 eSIM 智慧型手機出貨量的佔有率

按地區劃分的 eSIM 智慧型手機出貨量

依應用程式劃分的物聯網 eSIM 出貨量

依規範劃分的 eSIM RSP 設定檔下載量

eSIM IC 供應商

Actionable Benefits:

• Track growth and identify the largest opportunities in the Embedded Subscriber Identity Module (eSIM) markets-across embedded Universal Integrated Circuit Card (eUICC) and integrated Universal Integrated Circuit Card (iUICC) form factors, consumer and Internet of Things (IoT) device types, and IoT applications (verticals).
• Revise and quantify expectations following the delayed commercial launch of SGP.32 and its impact on IoT applications.
• Understand regional complexities in the consumer market with smartphone Original Equipment Manufacturer (OEM) vendor breakdowns.

Critical Questions Answered:

• What is the total market size for eSIM in the consumer and IoT markets from 2024 to 2030?
• What is the regional breakdown of the consumer market, and how will this change over the coming 5 years, given the increasing penetration and consumer smartphone launch in China?
• How will the Integrated Circuit (IC) form factor (standalone versus 3-in-1 eUICC, iUICC penetration) landscape evolve?
• What is the current scale of profile downloads, and how will this progress in the coming 5 years?
• How will consumer activation rates change, and how will IoT activations split across GSMA SGP standards?
• Who are the leading IC suppliers, and what are their respective market shares?

Research Highlights:

• Device and IC forecasts across consumer devices and IoT applications with regional consumer splits across device types.
• eSIM penetration rates across consumer and IoT.
• Remote SIM Provisioning (RSP)-capable eSIM shipments by IoT application.
• Profile download forecasts across consumer and IoT, split by specification.
• eSIM smartphone shipments and penetration rates by region and vendor.
• eSIM IC vendor market shares.

Who Should Read This?

• Strategic and product design leads within smart card, secure IC, module, and device makers.
• Sales and marketing leads seeking to understand key trends and priorities.
• eSIM infrastructure players looking to quantify Total Addressable Market (TAM) size, identify key opportunities and prioritize technology support features.
• IoT strategists and module vendors identifying integration requirements and TAM.

TABLE OF CONTENTS

This product is meant to be read in conjunction with eSIM in the Consumer and IoT Markets MD-ESM-114

Key Findings

Whats New

Methodology

Significant Forecasts

eSIM Device Shipments by ApplicationDevice Type

eSIM Smartphone Shipments OEM Shares

eSIM Smartphone Shipments by Region

IoT eSIM Shipments by Application

eSIM RSP Profile Downloads by Specification

eSIM IC Vendors