數位身分與嵌入式安全：市場數據概覽（2025 年第三季）

本報告探討了數位身分與嵌入式安全的趨勢，並提供了可信任平台模組 (TPM)、可信任執行環境 (TEE)、安全微控制器單元 (MCU) 和安全元件 (SE) 的市場預測，以及按地區、外形尺寸和其他細分市場的詳細分析。

實際優勢：

• 確定最適合嵌入式身分技術的物聯網應用。
• 根據可用的安全功能來決定嵌入式系統的最佳外形尺寸。
• 優化物聯網產品開發的硬體安全策略。

關鍵問題解答：

• 哪些產業利用硬體為基礎的安全性？
• 原始設備製造商 (OEM) 偏好哪些識別外形尺寸？
• 哪些硬體安全技術引領嵌入式系統市場？

研究亮點：

• 三大類基於硬體的嵌入式安全技術的市場預測：TPM（可信任平台模組）、TEE（可信任執行環境）、安全 MCU（微控制器單元）和 SE（安全元件）
• 按硬體類型和用例進行詳細細分
• 五大地區各類型設備及終端市場的出貨量及收入預測

目錄

本產品建議與 "數位身分驗證與嵌入式安全性 MD-DAES-114" 和 "數位身分驗證與嵌入式安全 物聯網網路安全 MD-IOTDAES-104" 配合閱讀。

主要發現

新資訊

研究方法

主要預測

Actionable Benefits:

• Identify the optimal Internet of Things (IoT) applications for your embedded authentication technologies.
• Determine the best form factor for your specific embedded systems based on available security features.
• Optimize hardware security strategies in your IoT product development.

Critical Questions Answered:

• Which industries are going to be leveraging hardware-based security?
• Which authentication form factors are Original Equipment Manufacturers (OEMs) going to be favoring?
• Which hardware security technologies are likely to lead for embedded systems?

Research Highlights:

• Market forecast for three primary hardware-based embedded security technologies: Trusted Platform Module (TPM), Trusted Execution Environment (TEE), secure Microcontroller Unit (MCU), and Secure Element (SE).
• A detailed breakdown by hardware type and application use case.
• Shipment and revenue forecasts for each form factor and end market across five regions.

Who Should Read This?

• Semiconductor and silicon Intellectual Property (IP) companies.
• Embedded systems OEMs.
• IoT service providers.

TABLE OF CONTENTS

This product is meant to be read in conjunction with Digital Authentication and Embedded Security MD-DAES-114 and Digital Authentication and Embedded Security IoT Cybersecurity MD-IOTDAES-104

Key Findings

Whats New

Methodology

Significant Forecasts