5G 和未來 RAN 半導體

本報告探討了 5G 和未來 RAN 半導體市場，概述了 RAN 協定堆疊和半導體、主要趨勢、Open RAN 部署的驅動因素和障礙、主要晶片組供應商概況以及 RAN 晶片。我們編制了建議加速套件開發。

報告的優點：

• 確定 5G 和未來無線接取網路 (RAN) 半導體市場的主要趨勢和挑戰
• 我們可以幫助您決定在行動產業部署 Open RAN
• 確定 mmIMO 的處理需求以及硬體加速的需求
• 取得加速未來 RAN 晶片組開發的重要建議

關鍵問題的答案：

• 大規模 mMIMO 部署的主要挑戰是什麼？
• COT硬體和加速卡如何共同滿足Open RAN的RAN處理需求？
• Open RAN 晶片組的最新趨勢是什麼？

研究亮點：

• 有關 RAN 協定堆疊和半導體的詳細說明
• 詳細概述可用於 RAN 處理的半導體類型，包括第 1 層、第 2 層和第 3 層（傳統 RAN、開放式 RAN）

目錄

簡介/市場概覽

市場發展/問題

• mMIMO技術背景
• 半導體市場概覽
• 5G RAN 半導體

傳統供應商的 RAN 半導體方法

開放 RAN 市場發展

• 開放 RAN 硬體加速
• 具有第 1 層加速功能的通用處理器
• 可能針對上行鏈路效能進行新的 O-RAN 聯盟功能劃分
• 基於 RISC-V 的 Open RAN 設計

晶片組供應商簡介

• Picocom
• NXP Semiconductors
• Intel Corporation
• Marvell Technology
• Qualcomm

概述/建議

Actionable Benefits:

• Determine key trends and challenges in 5G and future Radio Access Network (RAN) semiconductor market.
• Assist the mobile industry in making decisions for Open RAN deployments.
• Identify the processing requirements for Massive Multiple Input, Multiple Output (mMIMO) and the need for hardware acceleration.
• Key recommendations to accelerate chipset development for future RANs.

Critical Questions Answered:

• What are the major challenges related to large-scale mMIMO deployments?
• How can Commercial-Off-the-Shelf (COTs) hardware, in combination with accelerator cards, fulfill the RAN processing demands for Open RAN?
• What are the most recent developments related to chipsets for Open RAN?

Research Highlights:

• Detailed description of RAN protocol stack and semiconductors.
• Detailed overview of the types of semiconductors available for RAN processing, including Layers 1, 2, and 3 (traditional RAN, and Open RAN).

Who Should Read This?

• Decision makers for mobile networks who need to understand the role of semiconductors in RANs.
• Open RAN vendors and service providers.
• Chipset vendors.
• Innovation leaders who need to understand the role of semiconductors in future 5G deployments.

Table of Contents

Introduction and Market Overview

Market Developments and Challenges

• mMIMO Technical Background
• Semiconductor Market Overview
• Semiconductors for 5G RAN

Traditional Vendor Approach toward RAN Semiconductors

Open RAN Market Developments

• Hardware Acceleration in Open RAN
• General-Purpose Processors with Layer-1 Acceleration
• Potential New O-RAN Alliance Functional Splits for Uplink Performance
• RISC-V Based Designs for Open RAN

Chipset Vendor Profiles

• Picocom
• NXP Semiconductors
• Intel Corporation
• Marvell Technology
• Qualcomm

Conclusions and Recommendations