市場調查報告書
商品編碼
1153742
到 2028 年的半導體鍵合市場預測和全球分析——按類型(芯片鍵合機、晶圓鍵合機、倒裝芯片鍵合機)、技術(RF 設備、MEMS 和傳感器、LED、CMOS 圖像傳感器、3D NAND)Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Global Analysis - by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Technology (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND) |
預計2028年半導體鍵合市場規模將達到10.7682億美元,預計2022-2028年復合年增長率為8.2%。
內存、圖形處理單元、5G 芯片組等在超大手機、PC、平板電腦、5G 服務等中的使用推動了半導體行業的增長。然而,在 2020 年,由於 COVID-19 大流行的爆發,工業和汽車電子行業的半導體需求下降。根據半導體行業協會 (SIA) 的數據,全球半導體銷售額從 2000 年的 2044 億美元增加到 2020 年的 4404 億美元,在過去 20 年中幾乎翻了一番。市場增長受到存儲芯片和其他芯片價格下跌、智能手機、服務器和個人電腦需求下降以及中美貿易摩擦等因素的阻礙。此外,出於國家安全考慮,美國對中國公司實施了一些限制。例如,美國對中國公司Huawei的製裁是該公司半導體業務的直接結果。據 SIA 稱,因此,中國在半導體行業的份額已從 2020 年的 6.7% 下降到 2021 年的 6.5%。
一些半導體結廠商正在採用各種有機和無機戰略來獲得競爭優勢。例如,2021 年 4 月,ASM Pacific Technology 宣布了三個新的製造系統,可通過 X-Celeprint 的微轉移印刷和 ASM AMICRA 的精密貼片技術實現超薄芯片的大規模異構集成。。
COVID-19 大流行對北美半導體鍵合市場增長的影響
北美半導體公司在滿足消費者需求的同時應對不斷增加的成本、交貨時間和供應短缺。據美國商務部統計,美國占全球半導體生產市場份額的50%。由於 COVID-19 的出現,北美對關鍵半導體元器件的需求大幅下降。例如,2020 年全球半導體行業與 2019 年相比面臨 5-15% 的下滑。COVID-19 大流行也對美國半導體公司產生了負面影響。在大流行來襲之前,美國半導體行業也嚴重依賴從中國外包原材料和勞動力。此外,墨西哥將看到電信和汽車行業的增長,預計這將為半導體鍵合市場的參與者提供有利可圖的機會。中國的邊境關閉導致工廠關閉和生產限制,運輸成本增加和產能互補限制。結果,國內產量增加,推高了整體成本,同時讓美國控制了整個供應鏈。此外,2020 年 8 月,美國政府禁止向中國跨國公司華為出售半導體芯片。這些努力有望振興美國半導體產業,擴大半導體鍵合市場規模。
北美地區分為美國、加拿大和墨西哥。美國將在 2021 年擁有最大的半導體鍵合市場份額,加拿大預計將以最高的複合年增長率增長。政府當局採取了許多舉措來促進半導體行業,導致對該行業的投資越來越多。北美對 3D 半導體組裝和封裝解決方案有著巨大的需求。越來越多的公司正在引入物聯網和人工智能等先進技術,主要集中在汽車領域。Robert Bosch GmbH、Allegro MicroSystems, Inc、Texas Instruments Incorporated、Qualcomm Technologies, Inc、InvenSense 和 Honeywell International Inc. 是半導體鍵合市場的主要參與者。該地區對 MEMS 和傳感器不斷增長的需求為參與製造芯片鍵合機、晶圓鍵合機和倒裝芯片鍵合機的市場領導者提供了許多機會。
半導體結用於消費電子、汽車、醫療設備和其他各種應用,對它們的需求正在顯著增加,推動了美國半導體結市場的增長。此外,美國汽車的高銷量影響了對該國 2021 年整體半導體鍵合市場的分析。主要汽車製造商宣布對電動汽車和自動駕駛汽車投資數十億美元。GM宣佈到 2025 年將投資 350 億美元。2022年9月,美國政府宣布投資500億美元建立美國半導體產業,旨在通過這一投資計劃降低中國對半導體的依賴。此外,2022 年 8 月,亞利桑那州政府訪問了台灣,重點關注用於日常電子產品的半導體。因此,增加政府對半導體行業的投資將推動對半導體鍵合的需求。
由於加拿大人口增長,從單戶住宅到高層公寓的住房需求將會增加。因此,對消費電子產品的需求將推動該國對半導體的需求。此外,智能手機、平板設備、電視和個人電腦正變得越來越流行。加拿大對消費電子產品不斷增長的需求正在推動半導體鍵合市場的增長。加拿大還為半導體芯片製造商提供 15 項自由貿易協定,擁有 15 億消費者和 49.3 萬億美元的國內生產總值。此外,該國還是TSMC、Samsung Electronics、AMD、Qualcomm, Intel等各種半導體公司的所在地。因此,加拿大政府對智能電子產品日益增長的需求和舉措正在推動該國半導體鍵合市場的增長。
Palomar Technologies、Panasonic Corporation、Toray Industries, Inc.、Kulicke & Soffa Industries, Inc、HUTEM、DIAS Automation (HK) Ltd、ASMPT Ltd(原 ASM Pacific Technology Ltd)、EV Group、Yamaha Robotics Holdings、WestBond, Inc. 是一些在半導體粘合劑市場經營的知名公司。
整個半導體鍵合市場是使用主要和次要信息得出的。為了開始對半導體鍵合市場的分析,我們使用內部和外部資源進行了徹底的二次研究,以獲得與半導體鍵合市場相關的定性和定量信息。此過程還用於獲取所有細分市場的市場增長概況和市場預測。還對業內人士和評論員進行了多次初步採訪,以驗證數據並獲得有關該主題的更多分析見解。參與這一過程的公司包括副總裁、業務發展經理、市場情報經理、國內銷售經理等行業專家,以及專門從事半導體鍵合市場的評估員、研究分析師和關鍵意見領袖等外部專家,包括顧問。
The semiconductor bonding market size is expected to reach US$ 1,076.82 million by 2028; it is estimated to grow at a CAGR of 8.2% from 2022 to 2028.
The semiconductor industry's growth is attributed to the use of memories, graphics processing units, and 5G chipsets in hyperscale mobile phones, PCs, tablets, and 5G services. However, in 2020, the industrial & automotive electronics industries experienced a decline in the demand for semiconductors due to the onset of the COVID-19 pandemic. According to the Semiconductor Industry Association (SIA), the global sales of semiconductors increased from US$ 204.4 billion in 2000 to US$ 440.4 billion in 2020, which approximately doubled in the last two decades. Low prices of various chip types, such as memory chips; decreasing demand for smartphones, servers, and PCs; and a trade dispute between the US and China are hampering the market growth. Moreover, the US has imposed several restrictions on Chinese businesses because of national security concerns. For instance, the direct result of US sanctions against Huawei, the Chinese company, has adversely affected the company's semiconductor business. As a result, China's share of the semiconductor industry dropped from 6.7% in 2020 to 6.5% in 2021, according to SIA.
Several semiconductor bonding players are adopting various organic and inorganic strategies to gain a competitive advantage. For instance, in April 2021, ASM Pacific Technology introduced three new manufacturing systems with X-Celeprint's Micro Transfer Printing and ASM AMICRA's high precision die bonding technology to allow high volume heterogeneous integration of ultra-thin dies.
Impact of COVID-19 Pandemic on North America Semiconductor Bonding Market Growth
Semiconductor companies in North America are adapting to increased costs, lead time, and a shortage of supplies while catering to consumer demand. According to the United States Department of Commerce, the US constitutes ~50% of the global market share of semiconductor production. The demand for major semiconductor components in North America witnessed a significant decline due to the emergence of the COVID-19 pandemic. For example, in 2020, the global semiconductor industry faced a decline of 5-15% compared to 2019. The COVID-19 pandemic has had a negative impact on semiconductor companies in the US. In addition, the US semiconductor industry relied heavily on outsourcing raw materials and labor from China before the onset of the pandemic. Further, In Mexico, growth is observed in telecom & automotive sectors which is also expected to offer lucrative opportunities for semiconductor bonding market players. The shutdown of China's border led to the shutdown of factories or limited production, an increase in shipping costs, and supplementary capacity constraints. As a result, domestic production increased, which increased overall costs while allowing the US to control the entire supply chain. Further, in August 2020, the US government banned the sale of semiconductor chips to Huawei, the Chinese multinational corporation. These initiatives are expected to boost the US semiconductor industry, which, in turn, is expected to boost the semiconductor bonding market size.
The North America region is segmented into the US, Canada, and Mexico. The US held the largest semiconductor bonding market share in 2021, whereas Canada is projected to grow at the highest CAGR. Government authorities have taken many initiatives to promote the semiconductor industry, which has increased the number of investments in the industry. North America has a huge demand for 3D semiconductor assembly and packaging solutions. An increasing number of companies, majorly in the automotive sector, are adopting advanced technologies such as IoT and artificial intelligence. Robert Bosch GmbH; Allegro MicroSystems, Inc.; Texas Instruments Incorporated; Qualcomm Technologies, Inc.; InvenSense; and Honeywell International Inc. are a few of the prominent semiconductor bonding market players. The rising demand for MEMS and sensors in the region has provided many opportunities for market leaders engaged in the manufacturing of die bonders, wafer bonders, and flip-chip bonders.
Semiconductor bonding is used in manufacturing consumer electronic devices, automotive, medical devices, and various other applications, which is significantly increasing its demand, thereby driving the semiconductor bonding market growth in the US. Further, high automotive sales in the US impacted the country's overall semiconductor bonding market analysis in 2021. Major automakers announced multibillion-dollar investments in EVs and AVs. GM announced an investment of US$ 35 billion by 2025. In addition, in September 2022, the US government announced that they would be investing US$ 50 billion in the establishment of the US semiconductor industry; they are also aiming to lower the dependency on China for semiconductors through this investment plan. Moreover, in August 2022, the Arizona government visited Taiwan, focusing on semiconductors for everyday electronic devices. Thus, the growing government investment in the semiconductor industry will fuel the demand for semiconductor bonding.
A rise in the population in Canada will increase the demand for housing units, from single-family homes to high-rise condominiums. As a result, the demand for household electronic goods is fueling the need for semiconductors in the country. In addition, The use of smartphones, tablets, television, personal computers, and other devices is increasing tremendously. The rising demand for consumer electronic devices in Canada is boosting the semiconductor bonding market growth. Also, the country has provided semiconductor chip manufacturers access to 15 free trade agreements with 51 countries with ~1.5 billion consumers and a combined GDP of US$ 49.3 trillion. Furthermore, the country is home to various semiconductor companies such as TSMC, Samsung Electronics, AMD, Qualcomm, and Intel. Thus, the rising demand for smart electronic devices and the initiative by the Canadian government are propelling the growth of the semiconductor bonding market in the country.
Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few of the prominent players operating in the semiconductor bonding market.
The overall semiconductor bonding market has been derived using both primary and secondary sources. To begin the semiconductor bonding market analysis, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the semiconductor bonding market. The process also serves the purpose of obtaining an overview and market forecast of the market growth with respect to all market segments. Also, multiple primary interviews with industry participants and commentators have been conducted to validate the data and gain more analytical insights about the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, national sales managers, and external consultants-such as valuation experts, research analysts, and key opinion leaders-specializing in the semiconductor bonding market.
Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the semiconductor bonding market
Highlights key business priorities in order to assist companies to realign their business strategies
The key findings and recommendations highlight crucial progressive industry trends in the semiconductor bonding market thereby allowing players across the value chain to develop effective long-term strategies
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it
Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution