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印刷電子產品

市場調查報告書

商品編碼

1477298

在模塑電子市場中，依產品、依組件、依應用、依地理位置

In Mold Electronics Market, By Product, By Component, By Application, By Geography

出版日期: 2024年04月23日 | 出版商:

Coherent Market Insights | 英文 165 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

模塑電子市場預計到2024年價值為2.2873億美元，預計到2031年將達到12.4847億美元，2024年至2031年的年複合成長率（CAGR）為27.4%。

報告範圍		報告詳情
基準年：	2023年	2024 年市場規模：	2.2873億美元
歷史數據：	2019年至2023年	預測期：	2024年至2031年
預測 2024 年至 2031 年複合年成長率：	27.40%	2031 年價值預測：	12.4847 億美元

數字。模塑電子市佔率 (%)，依地區分類 2024 年

模塑電子市場預計在未來幾年將顯著成長。模塑電子技術是一種在成型過程中將電子電路整合到注塑塑膠零件中的技術。這種新技術有助於將感測、照明等電子功能直接嵌入模製塑膠零件中。減少組裝步驟、緊湊設計、耐用性和大規模客製化等優點正在推動各行業對模塑電子產品的需求。電子製造商擴大採用這種技術來生產創新產品並滿足不斷變化的客戶偏好。由於汽車、建築自動化、消費品和醫療領域的應用不斷成長，預計未來十年全球模塑電子市場將出現兩位數成長。

市場動態：

全球模塑電子市場的成長主要是由各個垂直行業不斷成長的自動化需求所推動的。製造商正在積極尋求將電子元件整合到他們的產品中，以添加感測、顯示等功能。這有助於使產品變得更聰明。此外，以經濟高效的方式生產具有嵌入式電子產品的客製化零件的能力正在推動採用。然而，模具的高初始投資和小規模生產的課題正在限制更快的市場成長。此外，電子裝置與塑膠零件的整合可能會促使需要解決的過熱問題。從積極的一面來看，印刷技術、積體電路小型化和新型導電材料的不斷進步為市場參與者帶來了巨大的機會。一旦規模化，模塑電子技術就可以實現物聯網產品的大規模生產。

研究的主要特點：

該報告對全球模塑電子市場進行了深入分析，並提供了以2023年為基準年的預測期（2024-2031年）的市場規模和年複合成長率（CAGR%）。

它闡明了不同區隔市場的潛在收入機會，並解釋了該市場有吸引力的投資主張矩陣。

這項研究還提供了有關市場促進因素、限制因素、機會、新產品發布或批准、市場趨勢、區域前景以及主要參與者採取的競爭策略的重要見解。

它根據以下參數描述了全球模塑電子市場的主要參與者——公司亮點、產品組合、主要亮點、財務表現和策略。

本研究涵蓋的主要公司包括 DuPont de Numours、TactoTek Oy、Golden Valley Products、Butler Technologies、GenesInk、YOMURA、InMold Solutions、Eastprint Incorporated、DuraTech Technologies Industries、BotFactory、Canatu、CEagaROP、Lite-On Technology、MesoScribe Technologies Industries 、Nagase America Corporation、nScrypt Inc.、Optomec、Pulse Electronics、Tangio Printed Electronics 和Nissha Co. Ltd.

該報告的見解將使行銷人員和公司管理當局能夠就未來的產品發布、類型升級、市場擴張和行銷策略做出明智的決策。

全球模塑電子市場報告迎合了該行業的各個利益相關者，包括投資者、供應商、產品製造商、分銷商、新進業者和財務分析師。

利害關係人可以透過用於分析全球模塑電子市場的各種策略矩陣輕鬆做出決策。

公司簡介
- DuPont de Numours
- TactoTek Oy
- Golden Valley Products
- Butler Technologies
- GenesInk
- YOMURA
- InMold Solutions
- Eastprint Incorporated
- DuraTech Industries BotFactory
- Canatu
- CERADROP
- Lite-On Technology
- MesoScribe Technologies
- Nagase America Corporation
- nScrypt Inc.
- Optomec
- Pulse Electronics
- Tangio Printed Electronics
- Nissha Co. Ltd

第 9 章：分析師建議

命運之輪
分析師觀點
連貫的機會圖

第 10 章：研究方法

參考
研究方法論

簡介目錄

Product Code: CMI6919

The In Mold Electronics Market is estimated to be valued at US$ 228.73 Mn in 2024 and is expected to reach US$ 1,248.47 Mn by 2031, exhibiting a compound annual growth rate (CAGR) of 27.4% from 2024 to 2031.

Report Coverage		Report Details
Base Year:	2023	Market Size in 2024:	US$ 228.73 Mn
Historical Data for:	2019 To 2023	Forecast Period:	2024 To 2031
Forecast Period 2024 to 2031 CAGR:	27.40%	2031 Value Projection:	US$ 1,248.47 Mn

Figure. In Mold Electronics Market Share (%), By Region 2024

The in mold electronics market is projected to grow significantly in the coming years. In mold electronics is a technology that involves the integration of electronic circuits into injection molded plastic parts during the molding process. This novel technique helps embed electronic functionality like sensing, lighting and others directly into molded plastic components. Several advantages such as decreased assembly steps, compact design, durability and mass customization is driving the demand for in mold electronics across various industries. Electronic manufacturers are increasingly adopting this technology to produce innovative products and cater to evolving customer preferences. The global in mold electronics market is expected to witness double digit growth over the next decade attributed to growing applications in automotive, building automation, consumer goods and medical sectors.

Market Dynamics:

The global in mold electronics market growth is primarily driven by growing automation needs across various industry verticals. Manufacturers are actively looking to integrate electronic components into their products to add functions like sensing, displays and more. This helps make products smarter. Additionally, the ability to produce customized parts with embedded electronics in a cost-effective manner is boosting adoption. However, high initial investment for tooling and small scale production challenges are restraining faster market growth. Moreover, the integration of electronics close to plastic parts can cause overheating issues which needs to be addressed. On the positive side, ongoing advancements in printing technologies, miniaturization of ICs and new conductive materials are presenting significant opportunities for market participants. Once scaled, in mold electronics can enable mass production of IoT products.

Key features of the study:

This report provides in-depth analysis of the global in mold electronics market, and provides market size (US$ Million) and compound annual growth rate (CAGR%) for the forecast period (2024-2031), considering 2023 as the base year

It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market

This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players

It profiles key players in the global in mold electronics market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies

Key companies covered as a part of this study include DuPont de Numours, TactoTek Oy, Golden Valley Products, Butler Technologies, GenesInk, YOMURA, InMold Solutions, Eastprint Incorporated, DuraTech Industries, BotFactory, Canatu, CERADROP, Lite-On Technology, MesoScribe Technologies, Nagase America Corporation, nScrypt Inc., Optomec, Pulse Electronics, Tangio Printed Electronics, and Nissha Co. Ltd

Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics

The global in mold electronics market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global in mold electronics market.

Market Segmentation

By Product
- Silver Conductive Ink
- Carbon Conductive Ink
- Others
By Component
- Sensors
- Antennas
- Connectors
- Others
By Application
- Consumer Electronics
- Automobile
- Home Appliance
- Industrial
- Others
By Regional
- North America
- Latin America
- Europe
- Asia Pacific
- Middle East & Africa
Key Players
- DuPont de Numours
- TactoTek Oy
- Golden Valley Products
- Butler Technologies
- GenesInk
- YOMURA
- InMold Solutions
- Eastprint Incorporated
- DuraTech Industries
- BotFactory
- Canatu
- CERADROP
- Lite-On Technology
- MesoScribe Technologies
- Nagase America Corporation
- nScrypt Inc.
- Optomec
- Pulse Electronics
- Tangio Printed Electronics
- Nissha Co. Ltd

1. Research Objectives and Assumptions

Research Objectives
Assumptions
Abbreviations

2. Market Purview

Report Description
- Market Definition and Scope
Executive Summary
- Market Snippet, By Product
- Market Snippet, By Component
- Market Snippet, By Application
- Market Snippet, By Region
Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

Market Dynamics
- Drivers
- Restraints
- Opportunities
Regulatory Scenario
Industry Trend
Merger and Acquisitions
New system Launch/Approvals
Impact of the COVID-19 Pandemic

4. Global In Mold Electronics Market, By Product, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
- Segment Trends
Silver Conductive Ink
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Carbon Conductive Ink
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Others
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)

5. Global In Mold Electronics Market, By Component, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
- Segment Trends
Sensors
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Antennas
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Connectors
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Others
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)

6. Global In Mold Electronics Market, By Application, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
- Segment Trends
Consumer Electronics
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Automobile
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Home Appliance
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Industrial
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Others
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)

7. Global In Mold Electronics Market, By Region, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, By Region, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
North America
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
U.S.
Canada
Europe
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
U.K.
Germany
Italy
France
Russia
Rest of Europe
Asia Pacific
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
China
India
ASEAN
Australia
South Korea
Japan
Rest of Asia Pacific
Latin America
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
Brazil
Argentina
Mexico
Rest of Latin America
Middle East and Africa
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
GCC Countries
South Africa
Rest of the Middle East and Africa

8. Competitive Landscape

Company Profiles
- DuPont de Numours
Company Overview
Product Portfolio
Financial Performance
Key Strategies
Recent Developments/Updates
- TactoTek Oy
- Golden Valley Products
- Butler Technologies
- GenesInk
- YOMURA
- InMold Solutions
- Eastprint Incorporated
- DuraTech Industries BotFactory
- Canatu
- CERADROP
- Lite-On Technology
- MesoScribe Technologies
- Nagase America Corporation
- nScrypt Inc.
- Optomec
- Pulse Electronics
- Tangio Printed Electronics
- Nissha Co. Ltd